Abstract: A liquid ejecting head includes a pressure chamber formation substrate having a pressure chamber formed therein, a flow path formation substrate that is connected to the pressure chamber formation substrate, and that has a flow path in communication with the pressure chamber formed in a state penetrating through the flow path formation substrate in a thickness direction thereof, and a nozzle plate that is connected to the flow path formation substrate on an opposite side to the pressure chamber formation substrate, and that has a nozzle in communication with the flow path opened therein. The flow path formation substrate is configured from a single substrate, and an opening area on a pressure chamber side of the flow path is formed wider than an opening area on a nozzle side of the flow path.

Abstract: A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.

Abstract: A piezoelectric device includes an actuator substrate that includes two rows of piezoelectric element rows piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include individual electrodes disposed for each of the piezoelectric elements, and a common electrode common to the piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion, and a common wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion. The two rows of piezoelectric element rows are respectively disposed so as to interpose the core portion. The individual wiring portion and the common wiring portion are respectively electrically connected to the individual electrode and the common electrode.

Abstract: A head including a channel formation substrate is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid; a piezo element includes a first electrode which is provided on one surface side of a channel formation substrate, a piezoelectric layer is provided on the first electrode, and a second electrode is provided on the piezoelectric layer; and a driving circuit board is bonded to the one surface side of the channel formation substrate via an adhesive layer, and is provided with a driving circuit for driving the piezo element, in which the piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board, and in which the bump and the adhesive layer are provided above the piezoelectric layer of the piezo element.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.

Abstract: A MEMS device includes a plurality of movable regions, wiring lines extending along a first direction from the movable regions, and electrodes connected to the wiring lines. The electrodes include connection regions for connecting other electrode terminals to the connection regions. A plurality of the connection regions are disposed along a second direction intersecting the first direction. A distance between centers of connection regions that are adjacent in the second direction is longer than a distance between centers of movable regions that are adjacent in the second direction.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element; and an adhesive agent that bonds the pressure chamber-forming plate and the circuit board, wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction orthogonal to

Abstract: A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; and a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element, wherein the first electrode layer is formed independently for each piezoelectric element, the second electrode layer is formed continuously across the plurality of piezoelectric elements, and at least part of the bump electrodes is electrically connected with the first electrode layer and t

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.

Abstract: An empty chamber component includes a pressure chamber formation substrate where a pressure chamber as an empty chamber is defined and a communication substrate bonded to the pressure chamber formation substrate. A piezoelectric element is provided on one side of the pressure chamber formation substrate. A flexible surface is located between the piezoelectric element and the pressure chamber. Empty portions are defined by the communication substrate closing recessed portions in the pressure chamber formation substrate. The empty portions are formed at positions where ends of the active section of the piezoelectric element pass through the empty portions in plan view.

Abstract: A piezoelectric device includes a first substrate having an empty chamber, a diaphragm defining a surface of the empty chamber, a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in sequence from the diaphragm side, the piezoelectric element provided on the side of the diaphragm opposite to the empty chamber, and a second substrate provided on the side of the first substrate opposite to the diaphragm. The thickness of at least a part of the first substrate in an opening peripheral area of the empty chamber is thicker than the thickness in an area outside the opening peripheral area.

Abstract: A piezoelectric element includes a plurality of individual electrodes, a piezoelectric layer formed on each of individual electrodes, and a common electrode which is formed on the piezoelectric layer and is an electrode common to the individual electrodes. Further, a protection film covering a region, which is not covered by the common electrode on the individual electrode, is provided.

Abstract: A MEMS device includes a drive region having a stacked structural body in which a first electrode layer, a first dielectric layer, and a second electrode layer are stacked in that order. The stacked structural body extends from the drive region to a non-drive region that is outer than the drive region and, in an extending direction of the stacked structural body, the first electrode layer and the first dielectric layer extend farther outward than the second electrode layer. A second dielectric layer covering an end of the second electrode layer in the extending direction is stacked on the second electrode layer in the non-drive region and the first dielectric layer that is formed outer in the extending direction than the second electrode layer. A third electrode layer electrically connected to the second electrode layer is stacked on the second dielectric layer and on the second electrode layer in a region outside the second dielectric layer.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a plurality of individual electrodes disposed for each of the piezoelectric elements, and a common electrodes common to the plurality of piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion that partially covers the core portion, a common wiring portion that partially covers the core portion, and an auxiliary wiring disposed in a groove portion disposed on a first principal surface on the side opposite to the actuator substrate or on a second principal surface on the actuator substrate side. The auxiliary wiring is electrically connected to the common wiring portion.

Abstract: A piezoelectric device includes an actuator substrate that includes two rows of piezoelectric element rows piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include individual electrodes disposed for each of the piezoelectric elements, and a common electrode common to the piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion, and a common wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion. The two rows of piezoelectric element rows are respectively disposed so as to interpose the core portion. The individual wiring portion and the common wiring portion are respectively electrically connected to the individual electrode and the common electrode.

Abstract: An empty chamber component includes a pressure chamber formation substrate where a pressure chamber as an empty chamber is defined and a communication substrate bonded to the pressure chamber formation substrate. A piezoelectric element is provided on one side of the pressure chamber formation substrate. A flexible surface is located between the piezoelectric element and the pressure chamber. Empty portions are defined by the communication substrate closing recessed portions in the pressure chamber formation substrate. The empty portions are formed at positions where ends of the active section of the piezoelectric element pass through the empty portions in plan view.

Abstract: The piezoelectric body is configured to have a layered structure such that a plurality of unit layers are stacked in a film thickness direction, and each of the unit layers is formed of a first layer on which the displacement is relatively easy to occur, and a second layer which has a high concentration of Zr as compared with the first layer. In addition, when composition ratio Ti/(Zr+Ti) of Zr to Ti in each of the first layer and the second layer is set as Cr1 and Cr2, the composition ratio of each layer is adjusted so as to satisfy the following conditions (1) to (3): 0.41?Cr1?0.81??(1) 0.1?Cr1?Cr2?0.3??(2) Cr1>Cr2??(3).

Abstract: A piezoelectric element includes a plurality of individual electrodes, a piezoelectric layer formed on each of individual electrodes, and a common electrode which is formed on the piezoelectric layer and is an electrode common to the individual electrodes. Further, a protection film covering a region, which is not covered by the common electrode on the individual electrode, is provided.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.