Patents by Inventor Motoya TAKEWAKI
Motoya TAKEWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11913116Abstract: Described herein is a technique capable of improving a uniformity of a semiconductor manufacturing process by placing a substrate at an appropriate position on the basis of actual installation dimensions of a reaction tube. According to one aspect of the technique, there is provided a substrate processing apparatus including: a boat on which substrates are placed; a process furnace including a reaction tube into which the boat is to be inserted, wherein a film is formed on the substrates placed on the boat in the reaction tube; and a substrate transport device configured to transfer the substrates into the boat, wherein the substrates are transferred into the boat by the substrate transport device referring to a virtual center axis of the reaction tube measured in advance.Type: GrantFiled: September 22, 2020Date of Patent: February 27, 2024Assignee: Kokusai Electric CorporationInventors: Motoya Takewaki, Tomoshi Taniyama
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Patent number: 11300456Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: November 15, 2019Date of Patent: April 12, 2022Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Publication number: 20220082447Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: November 22, 2021Publication date: March 17, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Publication number: 20210092798Abstract: Described herein is a technique capable of preventing a deterioration in controllability of a gas flow rate in a substrate processing apparatus. According to one aspect thereof a substrate processing apparatus includes: a process furnace including a process chamber; a process gas supply path; a process gas supply controller; a heater configured to heat at least a part of the process gas supply controller or the process gas supply path; a gas box accommodating the process gas supply path, the process gas supply controller and the heater. The gas box includes: an inlet port configured to introduce an outer atmosphere; an exhaust port connected to an exhaust duct and configured to exhaust an inner atmosphere to the exhaust duct; a temperature controller configured to lower and monitor a temperature of the inner atmosphere; and a gas leakage sensor configured to detect the process gas leaked in the gas box.Type: ApplicationFiled: September 17, 2020Publication date: March 25, 2021Inventors: Kazuya NABETA, Motoya TAKEWAKI
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Publication number: 20210002768Abstract: Described herein is a technique capable of improving a uniformity of a semiconductor manufacturing process by placing a substrate at an appropriate position on the basis of actual installation dimensions of a reaction tube. According to one aspect of the technique, there is provided a substrate processing apparatus including: a boat on which substrates are placed; a process furnace including a reaction tube into which the boat is to be inserted, wherein a film is formed on the substrates placed on the boat in the reaction tube; and a substrate transport device configured to transfer the substrates into the boat, wherein the substrates are transferred into the boat by the substrate transport device referring to a virtual center axis of the reaction tube measured in advance.Type: ApplicationFiled: September 22, 2020Publication date: January 7, 2021Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Motoya TAKEWAKI, Tomoshi TANIYAMA
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Patent number: 10684174Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: July 26, 2018Date of Patent: June 16, 2020Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Publication number: 20200166413Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: November 15, 2019Publication date: May 28, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Patent number: 10415136Abstract: A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.Type: GrantFiled: September 9, 2016Date of Patent: September 17, 2019Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Motoya Takewaki, Tetsuya Kosugi, Masaaki Ueno
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Patent number: 10340151Abstract: A ceiling heat insulator installed above a side wall heat insulator of a heating apparatus for a substrate processing apparatus for processing a substrate is provided. The ceiling heat insulator includes a gas-flow path installed therein to allow a cooling gas to pass therethrough so that the ceiling heat insulator has a solid cross-sectional area in an outer edge side of the ceiling heat insulator that is smaller than that in a center side of the ceiling heat insulator.Type: GrantFiled: February 5, 2015Date of Patent: July 2, 2019Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuya Kosugi, Motoya Takewaki, Masaaki Ueno, Hitoshi Murata
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Patent number: 10228291Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: February 24, 2016Date of Patent: March 12, 2019Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Publication number: 20180328790Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
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Patent number: 9587884Abstract: A heat insulation structure, which has a cylindrical side wall part formed in a multilayer structure, includes: a cooling gas supply port provided in an upper portion of a side wall outer layer disposed in an outer side of the side wall part; a cooling gas passage provided between a side wall inner layer disposed in an inner side of the side wall part and the side wall outer layer; a space provided in an inner side of the side wall inner layer; a plurality of blowout holes provided in the side wall inner layer for distributing cooling gas from the cooling gas passage to the space; a buffer area continuously provided in the cooling gas supply port and the cooling gas passage; and a throttle part configured to reduce a cross-sectional area of a boundary surface between the buffer area and the cooling gas passage.Type: GrantFiled: March 24, 2014Date of Patent: March 7, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Tetsuya Kosugi, Motoya Takewaki, Hitoshi Murata, Masaaki Ueno
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Publication number: 20160376701Abstract: A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.Type: ApplicationFiled: September 9, 2016Publication date: December 29, 2016Applicant: HITACHI KOKUSAI ELECTRIC INC.Inventors: Motoya TAKEWAKI, Tetsuya KOSUGI, Masaaki UENO
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Patent number: D778741Type: GrantFiled: August 19, 2015Date of Patent: February 14, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
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Patent number: D778742Type: GrantFiled: August 19, 2015Date of Patent: February 14, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
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Patent number: D786951Type: GrantFiled: August 19, 2015Date of Patent: May 16, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
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Patent number: D790490Type: GrantFiled: March 2, 2016Date of Patent: June 27, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Akihiro Osaka, Hideto Yamaguchi, Motoya Takewaki
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Patent number: D803075Type: GrantFiled: July 28, 2016Date of Patent: November 21, 2017Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Tokunobu Akao, Motoya Takewaki, Akihiro Osaka, Masaaki Ueno, Tetsuya Kosugi, Masashi Sugishita
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Patent number: D823363Type: GrantFiled: August 10, 2016Date of Patent: July 17, 2018Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Motoya Takewaki, Tetsuya Kosugi
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Patent number: D824440Type: GrantFiled: August 10, 2016Date of Patent: July 31, 2018Assignee: HITACHI KOKUSAI ELECTRIC INC.Inventors: Motoya Takewaki, Tetsuya Kosugi