Thermometry tool for substrate processing apparatus

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a thermometry tool for substrate processing apparatus showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an enlarged portion view taken along line 8-8 in FIG. 1 thereof;

FIG. 9 is an enlarged portion view taken along line 9-9 in FIG. 2 thereof;

FIG. 10 is an enlarged portion view taken along line 10-10 in FIG. 4 thereof; and,

FIG. 11 is an enlarged portion view taken along line 11-11 in FIG. 6 thereof.

The dashed-dot-dashed lines represent the boundary lines of the claimed design.

The broken lines shown in the drawings represent portions of the thermometry tool for substrate processing apparatus that form no part of the claimed design.

Claims

We claim the ornamental design for a thermometry tool for substrate processing apparatus, as shown (and described).

Referenced Cited
U.S. Patent Documents
9488528 November 8, 2016 Schlipf
Patent History
Patent number: D803075
Type: Grant
Filed: Jul 28, 2016
Date of Patent: Nov 21, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Tokunobu Akao (Toyama), Motoya Takewaki (Toyama), Akihiro Osaka (Toyama), Masaaki Ueno (Toyama), Tetsuya Kosugi (Toyama), Masashi Sugishita (Toyama)
Primary Examiner: Antoine D Davis
Application Number: 29/572,550
Classifications