Abstract: A floating-body dynamic random access memory device may include a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer may be formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode may be formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body. The gate electrode may only partially deplete a region of the semiconductor body, and the partially depleted region may be used as a storage node for logic states.

Abstract: A method and apparatus for a one-phase write to a one-transistor memory cell array. In one embodiment, the method includes a one-phase write to a selected wordline of a memory cell array. Once the wordline is selected, a logical zero value is stored within at least one memory cell of the selected wordline of the memory cell array. Simultaneously, a logical 0 value is stored within at least one memory cell of the selected wordline of the selected memory cell array. Other embodiments are described and claimed.

Abstract: A row of floating-body single transistor memory cells is written to in two phases.

Abstract: A system to write to a plurality of memory cells coupled to a word line, each of the plurality of memory cells comprising a transistor having a source, a drain, a body and a gate coupled to the word line. Some embodiments provide biasing of one or more of the plurality of memory cells in saturation to inject charge carriers into the body of the one or more of the plurality of memory cells, and biasing of each of the plurality of memory cells in accumulation to tunnel charge carriers from the body of each of the plurality of memory cells to the gate of each of the plurality of memory cells.

Abstract: Embodiments relate to a Floating Body Dynamic Random Access Memory (FBDRAM). The FBDRAM utilizes a purge line to reset a FBDRAM cell, prior to writing data to the FBDRAM cell.

Abstract: An apparatus and method are provided for limiting a drop of a supply voltage in an SRAM device to retain the state of the memory during an IDLE state. The apparatus may include a memory array, a sleep device, and a clamping circuit. The clamping circuit may be configured to activate the sleep device when a voltage drop across the memory array falls below a preset voltage and the memory array is in an IDLE state.

Abstract: Embodiments relate to a Floating Body Dynamic Random Access Memory (FBDRAM). The FBDRAM utilizes a purge line to reset a FBDRAM cell, prior to writing data to the FBDRAM cell.

Abstract: Some embodiments provide a memory cell comprising a body region doped with charge carriers of a first type, a source region disposed in the body region and doped with charge carriers of a second type, and a drain region disposed in the body region and doped with charge carriers of the second type. According to some embodiments, the body region, the source region, and the drain region are oriented in a first direction, the body region and the source region form a first junction, and the body region and the drain region form a second junction. Moreover, a conductivity of the first junction from the body region to the source region in a case that the first junction is unbiased is substantially less than a conductivity of the second junction from the body region to the drain region in a case that the second junction is unbiased. Some embodiments further include a transistor oriented in a second direction, wherein the second direction is not parallel to the first direction.

Abstract: Some embodiments provide a memory cell that includes a body region, a source region and a drain region. The body region is doped with charge carriers of a first type, the source region is disposed in the body region and doped with charge carriers of a second type, and the drain region is disposed in the body region and doped with charge carriers of the second type. The body region and the source region form a first junction, the body region and the drain region form a second junction, and a conductivity of the first junction from the body region to the source region in a case that the first junction is unbiased is substantially less than a conductivity of the second junction from the body region to the drain region in a case that the second junction is unbiased.

Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.

Abstract: A SRAM memory cell comprising cross-coupled inverters, each cross-coupled inverter comprising a pull-up transistor, where the pull-up transistors are forward body biased during read operations. Forward body biasing improves the read stability of the memory cell. Other embodiments are described and claimed.

Abstract: An apparatus and method for generating a reference in a memory circuit are disclosed. At least two dummy bit-cells are used to generate a reference voltage. One cell has high value stored and the other has a low value stored. The cells are activated and discharged into respective bit-lines. The bit-lines are equalized during the discharge process to generate a reference that is approximately a mid point between a high value cell and a low value cell.

Abstract: A SRAM with reduced subthreshold leakage current, the SRAM including a pMOSFET with its gate at VSS and its source at VCC, and a diode-connected pMOSFET with its source at VCC, where the drains of the pMOSFET and the diode-connected pMOSFET are connected together to provide a voltage VCCL, where VSS<VCCL<VCC. The beta of the diode-connected pMOSFET is substantially larger than the beta of the pMOSFET. The wordline associated with each memory cell is driven to a voltage ?VEE during a read operation, where ?VEE<VSS and VEE?VCC?VCCL. Each memory cell has cross-coupled inverters to store a data bit, where the cross-coupled inverters have pMOSFETs with their sources at VCCL.

Abstract: Some embodiments provide pre-charge of a bit-line coupled to a memory cell to a reference voltage using a pre-charge device, discharge of the bit-line based on a value stored by the memory cell, injection during the discharge, of a first current into the bit-line using the pre-charge device, and injection, during the discharge, of a second current into a reference bit-line using a second pre-charge device. Also during the discharge, a difference is sensed between a voltage on the bit-line and a voltage on the reference bit-line.

Abstract: A static random access memory (SRAM) is provided that includes a logic circuit coupled to a column select signal line and a leakage reduction circuit coupled to the logic circuit and a bit line pair of a column. The logic circuit may control the leakage reduction circuit so as to reduce leakage through a column select device that is not selected.

Abstract: According to some embodiments, provided are a memory cell, a bit-line coupled to the memory cell, a pre-charge circuit coupled to the bit-line to pre-charge the bit-line, and a discharge device coupled to the bit-line to discharge the bit-line prior to a read of the memory cell.

Abstract: A leakage compensation approach enabling full VCC precharge. An array of memory cells is coupled between a pair of bit lines. A precharge circuit precharges the pair of bit lines to substantially a supply voltage level and a leakage compensation circuit supplies a first compensation current to a first one of the bit lines to substantially compensate for leakage current supplied by the first bit line during a memory access operation directed to one of the plurality of memory cells.

Abstract: According to some embodiments, provided are a first signal line, the first signal line coupled to a first repeater, the first repeater to convert a first signal from a received signal level to an output signal level, the first repeater to convert from a first signal level to a second signal level slower than from the second signal level to the first signal level, and a second signal line adjacent to the first signal line, the second signal line coupled to a second repeater adjacent to the first repeater, the second repeater to convert a second signal from a second received signal level to a second output signal level, the second repeater to convert from the first signal level to the second signal level slower than from the second signal level to the first signal level, wherein the received signal level is substantially equivalent to the second output signal level and wherein the second received signal level is substantially equivalent to the output signal level.

Abstract: A multi-ported register comprises a Global Bit Line (GBL) to couple a gate to a data output line via an output transistor. A Local bit Line (LBL) couples the gate to a first register file cell and a second register file cell, said second register file cell disposed closer to the data output line than the first register file cell. At least one transistor in the first register file cell having a stronger drive current than the at least one transistor in the second register file cell. At least one of, the output transistor, the gate, and the first register file cell of a first bank have a stronger drive current than the corresponding output transistor, the gate and the first register file cell of a second bank said second bank being closer to the data output line.

Abstract: According to some embodiments, provided are a memory cell, a bit-line coupled to the memory cell, a pre-charge circuit coupled to the bit-line to pre-charge the bit-line, and a discharge device coupled to the bit-line to discharge the bit-line prior to a read of the memory cell.