Patents by Inventor Myeong Woo HAN

Myeong Woo HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769951
    Abstract: An antenna apparatus includes antennas, each having first and second feeding portions facing each other across a dielectric layer, and third and fourth feeding portions facing each other across the dielectric layer, and a signal application unit configured to apply a wireless communication signal to the antennas, and including a plurality of output ports, wherein the first and second feeding portions are configured to receive electric signals having a first polarization characteristic, and are respectively connected to first and second output ports that are different from each other among the plurality of output ports, and the third and fourth feeding portions are configured to receive electric signals having a second polarization characteristic that is different from the first polarization characteristic, and are respectively connected to third and fourth output ports that are different from each other among the plurality of output ports.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: September 26, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyungjin Lee, Woncheol Lee, Myeong Woo Han, Jeongki Ryoo, Youngsik Hur, Wongi Kim, Gopal Garg
  • Patent number: 11658425
    Abstract: An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: May 23, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Cheol Lee, Jeong Ki Ryoo, Nam Ki Kim, Myeong Woo Han, Sang Hyun Kim
  • Patent number: 11646503
    Abstract: An antenna apparatus may include: first patch antenna patterns arrayed in an N×1 structure, the first patch antenna patterns each having a polygonal shape having an oblique side with respect to an array direction of the N×1 structure; feed vias electrically connected to the first patch antenna patterns; and guide vias arrayed along the oblique side, wherein N is a natural number greater than or equal to 2.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: May 9, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki Lim, Nam Ki Kim, Myeong Woo Han, Jeong Ki Ryoo, Ju Hyoung Park, Won Cheol Lee
  • Patent number: 11646504
    Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: May 9, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Young Sik Hur, Sung Yong An, Myeong Woo Han, Kyu Bum Han, Dae Ki Lim
  • Patent number: 11646496
    Abstract: An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: May 9, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Kim, Ju Hyoung Park, Jeong Ki Ryoo, Myeong Woo Han, Dae Ki Lim
  • Patent number: 11605892
    Abstract: An antenna device includes: a dielectric layer including a first edge extending in a first direction and a second edge, shorter that the first edge, extending in a second direction; a first feed via penetrating a portion of the dielectric layer in a third direction, and disposed adjacent to the second edge; a second feed via penetrating a portion of the dielectric layer in the third direction, disposed adjacent to the first edge; a feed pattern connected to the second feed via; and an antenna patch disposed on the second feed via and the feed pattern in the third direction, and coupled to the first feed via, the second feed via, and the feed pattern. The antenna patch overlaps the first feed via in a direction parallel to the first direction or the second direction. The antenna patch overlaps the feed pattern in a direction parallel to the third direction.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: March 14, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Daeki Lim, Youngsik Hur, Juhyoung Park, Jeongki Ryoo, Myeong Woo Han, Woncheol Lee
  • Patent number: 11502423
    Abstract: An antenna device includes a dielectric resonator antenna configured to transmit and/or receive a first RF signal, a patch antenna pattern configured to transmit and/or receive a second RF signal, and at least partially overlaps the dielectric resonator antenna in a vertical direction, a first feed via configured to feed to the dielectric resonator antenna, and a second feed via configured to feed to the patch antenna pattern, wherein a frequency of the first RF signal is lower than a frequency of the second RF signal.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: November 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woncheol Lee, Youngsik Hur, Wongi Kim, Jeongki Ryoo, Myeong Woo Han, Hyungjin Lee
  • Patent number: 11431107
    Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: August 30, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Sung Yong An, Myeong Woo Han, Sung Nam Cho, Jae Yeong Kim
  • Publication number: 20220231431
    Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
    Type: Application
    Filed: April 7, 2022
    Publication date: July 21, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hyoung PARK, Young Sik HUR, Sung Yong AN, Myeong Woo HAN, Kyu Bum HAN, Dae Ki LIM
  • Publication number: 20220224018
    Abstract: An antenna module includes: an IC package including an IC; first and second antenna portions including respective patch antenna patterns, respective feed vias connected to the respective patch antenna patterns, and respective dielectric layers surrounding the respective feed vias; and a connection member having an upper surface on which the first and second antenna portions are disposed and a lower surface on which the IC package is disposed, the connection member forming an electrical connection path between the IC and the feed via of the first antenna portion and an electrical connection path of the second antenna portion. The connection member includes a first region disposed between the IC package and the first antenna portion, a second region on which the second antenna portion is disposed, and a third region electrically connecting the first and second regions and being more flexible than the dielectric layer of the first antenna portion.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myeong Woo HAN, Ju Hyoung PARK, Dae Ki LIM, Jeong Ki RYOO, Won Cheol LEE, Nam Ki KIM
  • Patent number: 11380633
    Abstract: A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: July 5, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myeong Woo Han, Young Sik Hur, Won Gi Kim, Soo Ki Choi
  • Publication number: 20220190484
    Abstract: An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Cheol LEE, Jeong Ki RYOO, Nam Ki KIM, Myeong Woo HAN, Sang Hyun KIM
  • Patent number: 11349215
    Abstract: An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: May 31, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Kim, Ju Hyoung Park, Jeong Ki Ryoo, Dae Ki Lim, Myeong Woo Han
  • Publication number: 20220158359
    Abstract: An antenna device includes a dielectric resonator antenna configured to transmit and/or receive a first RF signal, a patch antenna pattern configured to transmit and/or receive a second RF signal, and at least partially overlaps the dielectric resonator antenna in a vertical direction, a first feed via configured to feed to the dielectric resonator antenna, and a second feed via configured to feed to the patch antenna pattern, wherein a frequency of the first RF signal is lower than a frequency of the second RF signal.
    Type: Application
    Filed: March 10, 2021
    Publication date: May 19, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woncheol LEE, Youngsik HUR, Wongi KIM, Jeongki RYOO, Myeong Woo HAN, Hyungjin LEE
  • Patent number: 11336022
    Abstract: An antenna apparatus includes a ground layer, patch antenna patterns, feed vias, ring-type meta patterns, and coupling-type meta patterns. The ground layer has one or more through-holes. Patch antenna patterns are each disposed above the ground layer. Feed vias are disposed to penetrate through the one or more through-holes, and electrically connect to the patch antenna patterns, respectively. Ring-type meta patterns are arranged between the patch antenna patterns. Coupling-type meta patterns are alternately arranged between the patch antenna patterns in fewer numbers than the ring-type meta patterns in positions more distant from the patch antenna patterns than positions in which the ring-type meta patterns are arranged.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 17, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Kim, Dae Ki Lim, Jeong Ki Ryoo, Ju Hyoung Park, Jae Min Keum, Myeong Woo Han
  • Patent number: 11322857
    Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: May 3, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Young Sik Hur, Sung Yong An, Myeong Woo Han, Kyu Bum Han, Dae Ki Lim
  • Patent number: 11316281
    Abstract: An antenna apparatus may include: a feed via; a patch antenna pattern electrically connected to the feed via; and coupling patterns spaced apart from the patch antenna pattern and spaced apart from each other. At least one of the coupling patterns may protrude in a direction in which the at least one of the coupling patterns is spaced apart from the patch antenna pattern.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 26, 2022
    Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Myeong Woo Han, Dae Ki Lim, Keum Cheol Hwang, Sung Woo Lee, Jeong Ki Ryoo
  • Patent number: 11303038
    Abstract: An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: April 12, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Cheol Lee, Jeong Ki Ryoo, Nam Ki Kim, Myeong Woo Han, Sang Hyun Kim
  • Patent number: 11296421
    Abstract: An antenna module includes: an IC package including an IC; first and second antenna portions including respective patch antenna patterns, respective feed vias connected to the respective patch antenna patterns, and respective dielectric layers surrounding the respective feed vias; and a connection member having an upper surface on which the first and second antenna portions are disposed and a lower surface on which the IC package is disposed, the connection member forming an electrical connection path between the IC and the feed via of the first antenna portion and an electrical connection path of the second antenna portion. The connection member includes a first region disposed between the IC package and the first antenna portion, a second region on which the second antenna portion is disposed, and a third region electrically connecting the first and second regions and being more flexible than the dielectric layer of the first antenna portion.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: April 5, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myeong Woo Han, Ju Hyoung Park, Dae Ki Lim, Jeong Ki Ryoo, Won Cheol Lee, Nam Ki Kim
  • Patent number: 11283175
    Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: March 22, 2022
    Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Myeong Woo Han, Nam Ki Kim, Young Sik Hur, Yong Serk Kim, Keum Cheol Hwang, Nam Heung Kim, Jeong Ki Ryoo