Abstract: An antenna apparatus includes patch antennas arranged in an N×1 array, first feed vias, second feed vias, third feed vias, and fourth feed vias connected to a point offset from a center of each of the patch antennas, in a first direction, second direction, third direction, and fourth direction, respectively a first RF signal of a first phase passes through the first feed vias and the second feed vias, a second RF signal of a second phase passes through the third feed vias and the fourth feed vias, and wherein a line between the point in the first direction and the point in the second direction is oblique to a direction of an array of the patch antennas, and a line between the point in the third direction and the point in the fourth direction is oblique to the direction of the array.

Abstract: An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.

Abstract: There is provided a multilayer directional coupler formed in a wireless communications device formed by stacking a plurality of substrates, comprising a first conductive pattern formed on a first substrate among the plurality of substrates; and a second conductive pattern formed on a second substrate stacked on one surface of the first substrate and having one or more conductive lines overlapping the first conductive pattern when viewed in a plane direction.

Abstract: A filter module includes: a first substrate and a second substrate coupled to each other to form an internal space; a first filter formed on the first substrate, in the internal space, and including a bulk acoustic resonator; and a second filter disposed on the second substrate, wherein the first and second filters are configured to filter frequencies within different bands.

Abstract: A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.

Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.

Abstract: The present invention relates to a power detection circuit and an RF signal amplification circuit having the same. According to an embodiment of the present invention, a power detection circuit including a coupling unit adjacent to an RF matching inductor to extract induced power; a rectification unit for rectifying the signal output from the coupling unit to output the rectified signal; a slope adjustment unit connected between an output terminal of the rectification unit and a ground and adjusting a voltage slope for power detection by changing the output signal of the output terminal of the rectification unit according to changes in internal impedance; and a smoothing unit for receiving the output signal of the output terminal of the rectification unit to smooth the received signal into a DC voltage for power detection using the voltage slope is provided. Further, an RF signal amplification circuit having the same is provided.

Abstract: There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.

Abstract: A dual-band filter and method thereof include a diplexer configured to process one of a first band signal and a second band signal, which includes a frequency band different from a frequency band of the first band signal, and block the other of the first band signal and the second band signal. A balun is configured to convert the first band signal from a differential signal to a single signal in response to the first band signal being transmitted, and convert the first band signal from a single signal to a differential signal in response to the first band signal being received. A direct current (DC) voltage supply port configured to supply a DC voltage to the balun when the first band signal is received.

Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon: a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

Abstract: There are provided an antenna and a front end module having an air cavity formed therein and shortening a connection distance with a signal processing module to improve radiation characteristics and facilitate a manufacturing process thereof, the antenna including a substrate having a preset mounting surface, an antenna pattern part formed on the mounting surface of the substrate and transmitting and receiving a signal within a preset frequency band, and a solder ball group having a plurality of solder balls formed on the mounting surface of the substrate to fix the substrate to an external circuit board and disposed at preset intervals around the antenna pattern part to form an air cavity.

Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.

Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.

Abstract: There are provided a bias circuit and an amplifier controlling a bias voltage, the bias circuit and the amplifier including a control voltage generating unit generating a control voltage using a reference voltage, a bias voltage generating unit generating a bias voltage according to the control voltage, and a voltage drop unit dropping the bias voltage from the bias voltage generating unit to a base voltage so as to provide the base voltage to an amplifying unit, wherein the control voltage generating unit controls the control voltage according to an amplitude of a high-frequency signal input to the amplifying unit.

Abstract: There are provided a series inductor array implemented as a single winding capable of decreasing a layout area for providing a plurality of inductors, and a filter including the same, the series inductor array including a winding structure having both ends, and one or more terminal parts electrically connected to a region between the both ends of the winding structure to form an external electrical connection, wherein the winding structure has a structure in which a plurality of inductors having inductance formed in regions of the winding structure disposed between the both ends thereof and the terminal parts or between the terminal parts are connected in series.

Abstract: There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.

Abstract: There are provided a power amplifying circuit and a front end module including the same. The power amplifying circuit includes a signal amplifying unit amplifying and outputting a plurality of wireless signals having different frequency bands, and a diplexer circuit transferring at least one of the plurality of wireless signals output from the signal amplifying unit to an antenna, wherein the signal amplifying unit and the diplexer circuit include impedance matching circuits having different impedance matching ranges, respectively, and the impedance matching range of the diplexer circuit is continuous with that of the signal amplifying unit.

Abstract: There is provided a radio frequency input circuit including a first direct current blocking unit provided between an input terminal and an input circuit unit and blocking a direct current voltage introduced through the input terminal, a first ESD protection circuit unit provided in parallel with the first direct current blocking unit and forming a bypass path according to an ESD voltage introduced through the input terminal, and a ground circuit unit provided between a first connection node between the first direct current blocking unit and the input circuit unit, and a ground, and forming a ground path according to the ESD voltage.

Abstract: Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode.