Abstract: An antenna device includes: a dielectric layer including a first edge extending in a first direction and a second edge, shorter that the first edge, extending in a second direction; a first feed via penetrating a portion of the dielectric layer in a third direction, and disposed adjacent to the second edge; a second feed via penetrating a portion of the dielectric layer in the third direction, disposed adjacent to the first edge; a feed pattern connected to the second feed via; and an antenna patch disposed on the second feed via and the feed pattern in the third direction, and coupled to the first feed via, the second feed via, and the feed pattern. The antenna patch overlaps the first feed via in a direction parallel to the first direction or the second direction. The antenna patch overlaps the feed pattern in a direction parallel to the third direction.

Abstract: An antenna apparatus includes antennas, each having first and second feeding portions facing each other across a dielectric layer, and third and fourth feeding portions facing each other across the dielectric layer, and a signal application unit configured to apply a wireless communication signal to the antennas, and including a plurality of output ports, wherein the first and second feeding portions are configured to receive electric signals having a first polarization characteristic, and are respectively connected to first and second output ports that are different from each other among the plurality of output ports, and the third and fourth feeding portions are configured to receive electric signals having a second polarization characteristic that is different from the first polarization characteristic, and are respectively connected to third and fourth output ports that are different from each other among the plurality of output ports.

Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.

Abstract: An antenna apparatus includes patch antennas arranged in an N×1 array, first feed vias, second feed vias, third feed vias, and fourth feed vias connected to a point offset from a center of each of the patch antennas, in a first direction, second direction, third direction, and fourth direction, respectively a first RF signal of a first phase passes through the first feed vias and the second feed vias, a second RF signal of a second phase passes through the third feed vias and the fourth feed vias, and wherein a line between the point in the first direction and the point in the second direction is oblique to a direction of an array of the patch antennas, and a line between the point in the third direction and the point in the fourth direction is oblique to the direction of the array.

Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.

Abstract: An antenna apparatus including: a first insulation layer defining a cavity; an antenna and an electronic element disposed in the cavity of the first insulation layer; a second insulation layer disposed on a first surface facing a first direction among surfaces of the antenna and on a second surface facing the first direction among surfaces of the electronic element; and a connection wire disposed on a third surface facing the first direction among surfaces of the second insulation layer and configured to electrically connect the antenna and the electronic element. The connection wire is disposed on the second insulation layer, is disposed within a first contact hole overlapping the electronic element, and overlaps the antenna.

Abstract: A dielectric resonator antenna includes: a first dielectric block; at least one second dielectric block stacked on the first dielectric block in a first direction; and a feed unit disposed in the first dielectric block. A side surface of the first dielectric block facing a second direction crossing the first direction is exposed to an outside of the dielectric resonator antenna.

Abstract: An antenna apparatus includes a ground layer having a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via; a first coupling patch pattern disposed on the patch antenna pattern; a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; and a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern.

Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.

Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.

Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from the ground plane, and spaced apart from each other; a first feed via providing a first feed path of the first patch antenna pattern through a first point disposed adjacent to an edge of the first patch antenna pattern in a direction spaced apart from the second patch antenna pattern; a second feed via providing a second feed path of the second patch antenna pattern through a second point disposed adjacent to an edge of the second patch antenna pattern in a direction spaced apart from the first patch antenna pattern; and a first coupling pattern spaced apart from the first and second patch antenna patterns between the first and second patch antenna patterns, and defining a first internal space exposed towards the first patch antenna pattern.

Abstract: A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.

Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.

Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.

Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from the ground plane, and spaced apart from each other; a first feed via providing a first feed path of the first patch antenna pattern through a first point disposed adjacent to an edge of the first patch antenna pattern in a direction spaced apart from the second patch antenna pattern; a second feed via providing a second feed path of the second patch antenna pattern through a second point disposed adjacent to an edge of the second patch antenna pattern in a direction spaced apart from the first patch antenna pattern; and a first coupling pattern spaced apart from the first and second patch antenna patterns between the first and second patch antenna patterns, and defining a first internal space exposed towards the first patch antenna pattern.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: An antenna apparatus includes: a ground layer; a feed line disposed in a position lower than a position of the ground layer; and an antenna structure including a first radiation part connected to one end of the feed line and configured to provide a first electromagnetic plane in a first direction, and a second radiation part connected to the first radiation part, configured to provide a second electromagnetic plane in a second direction, and disposed such that at least a portion of the second radiation part is disposed in a position higher than the position of the ground layer.

Abstract: A chip antenna module includes a substrate having layers; a chip antenna mounted on one surface of the substrate to radiate a radio signal, the chip antenna having a body portion formed of a dielectric substance, and a ground portion and a radiating portion disposed on opposite surfaces of the body portion; and an auxiliary patch disposed below the radiating portion on at least one layer of the substrate.

Abstract: An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.

Abstract: An antenna apparatus includes a ground layer, patch antenna patterns, feed vias, ring-type meta patterns, and coupling-type meta patterns. The ground layer has one or more through-holes. Patch antenna patterns are each disposed above the ground layer. Feed vias are disposed to penetrate through the one or more through-holes, and electrically connect to the patch antenna patterns, respectively. Ring-type meta patterns are arranged between the patch antenna patterns. Coupling-type meta patterns are alternately arranged between the patch antenna patterns in fewer numbers than the ring-type meta patterns in positions more distant from the patch antenna patterns than positions in which the ring-type meta patterns are arranged.