Abstract: There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.

Abstract: There is provided a power amplifier including a bias circuit unit generating a bias voltage of an amplifying unit, a voltage drop unit disposed between the bias circuit unit and the amplifying unit to drop the bias voltage to a base voltage, and a bypass circuit unit including an impedance element connected to the voltage drop unit in parallel and performing a switching operation according to a magnitude of an input signal.

Abstract: Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.

Abstract: There are provided a bias circuit supplying different levels of bias power according to respective power modes through a simple circuit configuration, and a power amplifier having the same. The bias circuit includes: a bias setting unit setting a bias power voltage level by switching reference power having a pre-set voltage level determined according to a pre-set power mode; and a bias supply unit including a switching element performing switching according to the setting of the bias setting unit and supplying bias power having a voltage level determined according to a switching operation of the switching element.

Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.

Abstract: There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.

Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.

Abstract: Disclosed herein is a bandwidth adjustable dielectric resonant antenna. The dielectric resonator antenna includes: a multi-layer substrate; a first conductor plate formed on a top portion of an uppermost insulating layer to have an opening part; a second conductor plate formed on a bottom portion of a lowermost insulating layer; a plurality of metal vial holes penetrating through a circumference of the opening part of the first conductor plate at a predetermined interval; a feeding unit supplying power to the dielectric resonator embedded in the multi-layer substrate in the cavity shape by the first conductor plate, the second to conductor plate, and the plurality of metal via holes; and at least one multi-resonant generation via holes formed within the dielectric resonator so as to adjust the bandwidth by generating the multi-resonance within the dielectric resonator, thereby improving the bandwidth without increasing the size of the dielectric resonator and implementing miniaturization.

Abstract: There are provided an apparatus and a method for super high-speed wireless communications. The apparatus includes a signal processor transmitting data to be transmitted through a predetermined super high-speed communications network when the super high-speed communications network is connected and transmitting data to be transmitted through a predetermined high-speed communications network when the super high-speed communications network is disconnected; a super high-speed wireless communications unit converting the data transmitted from the signal processor to a super high-speed wireless signal suitable for transmission through the super high-speed communications network; and a high-speed wireless communications unit converting the data transmitted from the signal processor to a high-speed wireless signal suitable for transmission through the high-speed communications network.

Abstract: There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.

Abstract: There is provided an RF module performing radio communications and allowing for a significantly reduced distance between an antenna and a semiconductor chip. To this end, the RF module includes a semiconductor chip; and a substrate including an anntenna unit formed by a circuit pattern thereon, and having a surface on which the semiconductor chip is mounted to be electrically connected to the antenna unit.

Abstract: There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern.

Abstract: There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.

Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

Abstract: Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.

Abstract: Disclosed herein is a dielectric resonator antenna using a matching substrate in order to improve a bandwidth. The dielectric resonator antenna includes: a dielectric resonator body part that is embedded in a multi-layer substrate and has an opening part on the upper portion thereof; and at least one matching substrate that is stacked on the opening part and includes an an insulating layer having a dielectric constant smaller than that of the multi-layer substrate but larger than that of air, thereby making it possible to improve the bandwidth without adjusting the size of the dielectric resonator body part and to prevent loss and change in the radiation pattern due to the substrate mode.