Abstract: A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that simplifies the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.

Abstract: A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that simplifies the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.

Abstract: A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated circuit package, which takes advantage of the surface tension of solder to produce increased rotational align forces and increased centering forces during package soldering when aligned to a matching shaped pad on the surface of a circuit board.

Abstract: A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that simplifies the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.

Abstract: A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that can utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that can simplify the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.

Abstract: A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated circuit package, which takes advantage of the surface tension of solder to produce increased rotational align forces and increased centering forces during package soldering when aligned to a matching shaped pad on the surface of a circuit board.

Abstract: A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated circuit package, which takes advantage of the surface tension of solder to produce increased rotational align forces and increased centering forces during package soldering when aligned to a matching shaped pad on the surface of a circuit board.

Abstract: A center pad or paddle that is shaped with three or more curved spires which are symmetrical in form about axis that radiate from the center of the integrated circuit package, which takes advantage of the surface tension of solder to produce increased rotational align forces and increased centering forces during package soldering when aligned to a matching shaped pad on the surface of a circuit board.

Abstract: A keychain includes a key ring and a housing member coupled to the key ring. The housing member includes a body member and a cover member shaped and dimensioned to slide over the body member to substantially cover the body member. The body member includes at least one pocket shaped and dimensioned for receiving a digital memory card. The body member includes a plurality of sidewalls, a front wall and an end wall. The at least one pocket is formed in one of the plurality of sidewalls and extends into a central portion of the body member. A body stop member is formed along at least one of the plurality of sidewalls, the body stop member is shaped and dimensioned for engaging a cover stop member formed along the cover member so as to provide a frictional engagement preventing inadvertent removal of the cover member when the cover member is positioned over the body member.

Abstract: A keychain includes a key ring and a housing member coupled to the key ring. The housing member includes a body member and a cover member shaped and dimensioned to slide over the body member to substantially cover the body member. The body member includes at least one pocket shaped and dimensioned for receiving a digital memory card. The body member includes a plurality of sidewalls, a front wall and an end wall. The at least one pocket is formed in one of the plurality of sidewalls and extends into a central portion of the body member. A body stop member is formed along at least one of the plurality of sidewalls, the body stop member is shaped and dimensioned for engaging a cover stop member formed along the cover member so as to provide a frictional engagement preventing inadvertent removal of the cover member when the cover member is positioned over the body member.