Spoked solder pad

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Description

FIG. 1 is a top plan view of a solder pad with three or more solderable lobes, each solderable lobe symmetrically extending along a radial axis.

FIG. 2 is a top plan view of a solder pad with illustrative solder prefill on the solder pad as shown in FIG. 1.

FIG. 3 is a top plan view of a solder pad with illustrative solder prefill wetting along each radial axis when soldered; and,

FIG. 4 is a top plan view of a solder pad with illustrative integrated circuit elements in unused adjacent space.

Broken line illustrations of environmental structure in the drawings, including dashed line radial axes and integrated circuit package and/or circuit board outlines in FIGS. 1-3, and integrated circuit elements in FIG. 4, are provided for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a spoked solder pad, as shown and described.

Referenced Cited
U.S. Patent Documents
D571810 June 24, 2008 Ikeda
7902666 March 8, 2011 Hsu et al.
D701864 April 1, 2014 Lepp
D702240 April 8, 2014 Lepp
D702241 April 8, 2014 Lepp
20090211087 August 27, 2009 Oggioni et al.
20110067911 March 24, 2011 Ishikawa et al.
Patent History
Patent number: D816135
Type: Grant
Filed: Dec 19, 2014
Date of Patent: Apr 24, 2018
Inventor: Myron Walker (Redmond, WA)
Primary Examiner: Antoine Duval Davis
Application Number: 29/512,592
Classifications
Current U.S. Class: Heat Treatment, Welding Or Brazing (D15/144)