Spoked solder pad

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top plan view of my new design for a solder pad.

FIG. 2 is a top plan view of the solder pad of FIG. 1 with illustrative radial axes drawn.

FIG. 3 is a top plan view of the solder pad of FIG. 1 with illustrative adjacent circuit board traces and vias.

FIG. 4 is a perspective view of the solder pad of FIG. 1 on an illustrative integrated circuit package; and,

FIG. 5 is a perspective view of the solder pad of FIG. 1 on an illustrative circuit board.

Broken line illustrations of environmental structure in the drawings, including the radial axes in FIG. 2, circuit board traces and vias in FIG. 3, integrated circuit package outlines in FIG. 4, and circuit board outlines in FIG. 5, are provided for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a spoked solder pad, as shown and described.

Referenced Cited
U.S. Patent Documents
5900674 May 4, 1999 Wojnarowski et al.
6054563 April 25, 2000 Alas et al.
D571810 June 24, 2008 Ikeda
7902666 March 8, 2011 Hsu et al.
D701864 April 1, 2014 Lepp
D702240 April 8, 2014 Lepp
D702241 April 8, 2014 Lepp
20020071642 June 13, 2002 Nakata
20020092672 July 18, 2002 Primavera
20030057515 March 27, 2003 Fillion et al.
20040020972 February 5, 2004 Miyajima
20070126030 June 7, 2007 Ito
20090091025 April 9, 2009 Wong et al.
20090211087 August 27, 2009 Oggioni et al.
20110067911 March 24, 2011 Ishikawa et al.
20130323526 December 5, 2013 Hasin et al.
Foreign Patent Documents
S61102089 May 1986 JP
H09107173 April 1997 JP
Patent History
Patent number: D845369
Type: Grant
Filed: Feb 12, 2018
Date of Patent: Apr 9, 2019
Inventor: Myron Walker (Redmond, WA)
Primary Examiner: Antoine Duval Davis
Application Number: 29/636,910
Classifications
Current U.S. Class: Heat Treatment, Welding Or Brazing (D15/144)