Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.

Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.

Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.

Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.

Abstract: A multilayer ceramic component is provided. The multilayer ceramic component includes a ceramic body including a plurality of ceramic laminates, each including a plurality of dielectric layers and a plurality of internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and a plurality of external electrodes including base electrode layers disposed on outer surfaces of the ceramic body and respectively connected to the internal electrodes of the ceramic laminates, and resin electrode layers disposed on the base electrode layers to expose at least portions of end portions of the base electrode layers, respectively.

Abstract: A multilayered ceramic capacitor including a ceramic body including a dielectric layer and having first and second main surfaces, first and second end surfaces, and first and second side surfaces; a first internal electrode having a first lead part; a second internal electrode having a second lead part; a first external electrode electrically connected to the first lead part and extending from the side surface having the first lead part exposed thereto, to at least one of the first and second main surfaces; a second external electrode electrically connected to the second lead part and extending from the side surface having the second lead part exposed thereto, to at least one of the first and second main surfaces; and an insulating layer covering the first and second external electrodes disposed on the first and second side surfaces.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, base electrode layers disposed on the ceramic body and including main portions connected to the internal electrodes and extension portions extending from the main portions, and resin electrode layers disposed on the base electrode layers while leaving end portions of the extension portions exposed. A width of the extension portion is narrower than a width of the outer surface of the ceramic body on which the extension portion is disposed, measured in a direction parallel to a width direction of the extension portion.

Abstract: A multilayer ceramic capacitor includes: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode.

Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.

Abstract: A multilayer ceramic capacitor may include: a ceramic body having upper and lower surfaces opposing each other in a thickness direction thereof and first and second end surfaces opposing each other in a length direction thereof, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface to allow a predetermined region of the first end surface adjacent to the upper surface to be exposed; a second external electrode disposed on the second end surface to allow a predetermined region of the second end surface adjacent to the upper surface to be exposed; and first and second internal electrodes disposed within the ceramic body, stacked in a width direction of the ceramic body, and connected to the first and second external electrodes, respectively.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer and having first and third surfaces opposing each other in a length direction of the dielectric layer and second and fourth surfaces opposing each other in a width direction thereof; and a multilayer part including a first internal electrode and a second internal electrode disposed to oppose each other, while having the dielectric layer interposed there between in the ceramic body, and exposed to the first and third surfaces of the ceramic body, respectively; wherein one or more residual carbon removing path parts are formed to be protruded on both side of the first and second internal electrodes in a length direction of the ceramic body.

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T?10 ?m, TA/TC>0.8, and t?5 ?m, so that a multilayer ceramic electronic component having excellent reliability may be realized.

Abstract: A wire wound inductor and a manufacturing method thereof. A wire wound inductor in accordance with an aspect of the present invention includes a magnetic core, a coil being wound and installed in the magnetic core, and a conductive resin layer being formed on each of both ends of the magnetic core for electrical connection with the coil. The conductive resin layer includes a head covering a surface of the end of the magnetic core and a band being extended from the head to a lateral surface of the end of the magnetic core, and the head is formed to be relatively thinner than the band.

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: A multilayer ceramic capacitor may include: a ceramic body having first and second main surfaces opposing each other in a thickness direction and first and second end surfaces opposing each other in a length direction, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; a second external electrode disposed on the second end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; and first and second internal electrodes disposed in the ceramic body and connected to the first and second external electrodes, respectively.

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second side surfaces; first and second internal electrodes having an overlapping region provided in the ceramic body, forming a capacitance forming area exposed to the first side surface, the first internal electrode having a first lead-out portion, and the second internal electrode being insulated from the first internal electrode and having a second lead-out portion; a first external electrode connected to the first lead-out portion and a second external electrode connected to the second lead-out portion; and an insulating layer formed on the first side surface, wherein the first and second external electrodes further include non-conductive layers formed on outer surfaces thereof.