Patents by Inventor Myung-jun Park

Myung-jun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9168468
    Abstract: In a system for recycling a high-boiling-point waste photoresist stripper generated in processes of manufacturing LCDs or semiconductor devices, wherein an expensive high-boiling-point stripper solvent can be easily recycled at high yield and high-purity electronic grade. This system includes a first distillation device for removing low-boiling-point impurities, a second distillation device for recycling a stripper solvent composition while removing high-boiling-point impurities, a third distillation device for removing trace water, thus recovering the stripper solvent composition, a fourth distillation device for additionally recycling a stripper solvent, thus additionally recovering a high-boiling-point stripper solvent, and a fifth distillation device for sequentially and separately recovering the stripper solvent composition recovered by the second distillation device and the high-boiling-point stripper solvent additionally recovered by the fourth distillation device.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: October 27, 2015
    Assignee: KOREX CORPORATION
    Inventors: Ho Kyung Lee, In Gyoo Lee, Myung Jun Park, Kee-Kahb Koo, Jae-Kyeong Kim
  • Patent number: 9165712
    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 ?m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T1, 0.8?|T1/Tc|?1.0 is satisfied.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: October 20, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Jun Jeon, Kyu Ha Lee, Hyun Hee Gu, Chang Hoon Kim, Myung Jun Park
  • Patent number: 9159495
    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: October 13, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hyuk Shim, Dae Bok Oh, Jae Yeol Choi, Myung Jun Park, Young Sook Lee
  • Publication number: 20150287533
    Abstract: A multilayer ceramic capacitor may include: a ceramic body having upper and lower surfaces opposing each other in a thickness direction thereof and first and second end surfaces opposing each other in a length direction thereof, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface to allow a predetermined region of the first end surface adjacent to the upper surface to be exposed; a second external electrode disposed on the second end surface to allow a predetermined region of the second end surface adjacent to the upper surface to be exposed; and first and second internal electrodes disposed within the ceramic body, stacked in a width direction of the ceramic body, and connected to the first and second external electrodes, respectively.
    Type: Application
    Filed: July 28, 2014
    Publication date: October 8, 2015
    Inventors: Jong Ho LEE, Doo Young KIM, Chang Hoon KIM, Myung Jun PARK
  • Patent number: 9087644
    Abstract: A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 ?m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5?|T1/Tc|?1.0 is satisfied.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 21, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Jun Jeon, Kyu Ha Lee, Hyun Hee Gu, Chang Hoon Kim, Myung Jun Park
  • Publication number: 20150129409
    Abstract: In a system for recycling a high-boiling-point waste photoresist stripper generated in processes of manufacturing LCDs or semiconductor devices, wherein an expensive high-boiling-point stripper solvent can be easily recycled at high yield and high-purity electronic grade. This system includes a first distillation device for removing low-boiling-point impurities, a second distillation device for recycling a stripper solvent composition while removing high-boiling-point impurities, a third distillation device for removing trace water, thus recovering the stripper solvent composition, a fourth distillation device for additionally recycling a stripper solvent, thus additionally recovering a high-boiling-point stripper solvent, and a fifth distillation device for sequentially and separately recovering the stripper solvent composition recovered by the second distillation device and the high-boiling-point stripper solvent additionally recovered by the fourth distillation device.
    Type: Application
    Filed: January 21, 2015
    Publication date: May 14, 2015
    Inventors: Ho Kyung LEE, In Gyoo LEE, Myung Jun PARK, Kee-Kahb KOO, Jae-Kyeong KIM
  • Patent number: 8961744
    Abstract: In a system and method for recycling a high-boiling-point waste photoresist stripper generated in processes of manufacturing LCDs or semiconductor devices, an expensive high-boiling-point stripper solvent can be easily recycled at high yield and high-purity electronic grade.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: February 24, 2015
    Assignee: Korex Corporation
    Inventors: Ho Kyung Lee, In Gyoo Lee, Myung Jun Park, Kee-Kahb Koo, Jae-Kyeong Kim
  • Publication number: 20150041193
    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode.
    Type: Application
    Filed: November 21, 2013
    Publication date: February 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho LEE, Doo Young KIM, Myung Jun PARK, Jae Yeol CHOI, Young Ghyu AHN, Sang Huk KIM
  • Publication number: 20150041194
    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively.
    Type: Application
    Filed: October 22, 2013
    Publication date: February 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hyuk SHIM, Dae Bok OH, Jae Yeol CHOI, Myung Jun PARK, Young Sook LEE
  • Patent number: 8941972
    Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: January 27, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Jun Park, Sang Hoon Kwon, Chang Hoon Kim, Hyun Hee Gu, Jae Young Park, Da Young Choi, Kyu Ha Lee, Byung Jun Jeon
  • Patent number: 8941971
    Abstract: There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 ?m to 30 ?m, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: January 27, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Jun Park, Kyu Ha Lee, Da Young Choi, Chang Hoon Kim, Hyun Hee Gu, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
  • Publication number: 20140345926
    Abstract: There is provided a multilayered ceramic capacitor including a ceramic body including a dielectric layer and having first and second main surfaces, first and second end surfaces, and first and second side surfaces; a first internal electrode having a first lead part; a second internal electrode having a second lead part; a first external electrode electrically connected to the first lead part and extending from the side surface having the first lead part exposed thereto, to at least one of the first and second main surfaces; a second external electrode electrically connected to the second lead part and extending from the side surface having the second lead part exposed thereto, to at least one of the first and second main surfaces; and an insulating layer covering the first and second external electrodes disposed on the first and second side surfaces.
    Type: Application
    Filed: March 31, 2014
    Publication date: November 27, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho LEE, Jae Yeol CHOI, Sang Huk KIM, Myung Jun PARK, Yu Na KIM, Sung Woo KIM
  • Publication number: 20140290999
    Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.
    Type: Application
    Filed: July 16, 2013
    Publication date: October 2, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung Jun PARK, Kyu Sik PARK, Young Sook LEE
  • Patent number: 8842413
    Abstract: There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 23, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Jun Park, Da Young Choi, Byong Gyun Kim, Ji Sook Kim, Byung Jun Jeon, Hyun Hee Gu, Kyu Ha Lee, Gun Jung Yoon, Eun Sang Na
  • Patent number: 8837112
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 16, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hee Gu, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
  • Publication number: 20140238840
    Abstract: This invention relates to a system and method for recycling a high-boiling-point waste photoresist stripper generated in processes of manufacturing LCDs or semiconductor devices, wherein an expensive high-boiling-point stripper solvent can be easily recycled at high yield and high-purity electronic grade.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: KOREX CORPORATION
    Inventors: Ho Kyung Lee, In Gyoo Lee, Myung Jun Park, Keeg Kahb Koo, Jae Kyung Kim
  • Publication number: 20140233148
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.
    Type: Application
    Filed: May 24, 2013
    Publication date: August 21, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Jun JEON, Kyu Ha LEE, Hyun Hee GU, Chang Hoon KIM, Myung Jun PARK
  • Publication number: 20140233149
    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T?10 ?m, TA/TC>0.8, and t?5 ?m, so that a multilayer ceramic electronic component having excellent reliability may be realized.
    Type: Application
    Filed: May 24, 2013
    Publication date: August 21, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Jun JEON, Kyu Ha LEE, Hyun Hee GU, Chang Hoon KIM, Myung Jun PARK
  • Patent number: 8792223
    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls?10 ?m is satisfied.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 29, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hee Gu, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
  • Patent number: 8767375
    Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: July 1, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Jun Park, Sang Hoon Kwon, Jae Young Park, Kyu Ha Lee, Byung Jun Jeon, Da Young Choi, Hyun Hee Gu, Chang Hoon Kim