Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.

Abstract: The present invention relates to a phosphine precursor for the preparation of a quantum dot, and a quantum dot prepared therefrom. Using the phosphine precursor for the preparation of a quantum dot of the present invention, a quantum dot with improved luminous efficiency and higher luminous color purity can be provided.

Abstract: A memory device is provided. A memory device includes a memory cell array having variable resistance memory cells that are coupled to and disposed between first conductive lines extending in a first direction and second conductive lines crossing the first conductive lines, and a selection circuit configured to select the first conductive lines. The second conductive lines include straight conductive lines extending in a second direction that crosses the first direction, and first bending conductive lines spaced apart from the selection circuit by the straight conductive lines, the first bending conductive lines extending parallel with each other, and having an L shape.

Abstract: A memory device is provided. A memory device includes a memory cell array having variable resistance memory cells that are coupled to and disposed between first conductive lines extending in a first direction and second conductive lines crossing the first conductive lines, and a selection circuit configured to select the first conductive lines. The second conductive lines include straight conductive lines extending in a second direction that crosses the first direction, and first bending conductive lines spaced apart from the selection circuit by the straight conductive lines, the first bending conductive lines extending parallel with each other, and having an L shape.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a first variable resistance element, a first switching element coupled to the first variable resistance element via a first line, a second variable resistance element, and a second switching element coupled to the second variable resistance element via a second line, wherein a distance between the first switching element and the first variable resistance element is larger than a distance between the second switching element and the second variable resistance element, and wherein a second path from a first terminal of the second switching element to the second variable resistance element includes a resistance component, a resistance of the second path being greater than a resistance of a first path, the first path being from a first terminal of the first switching element to the first variable resistance element.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a first variable resistance element, a first switching element coupled to the first variable resistance element via a first line, a second variable resistance element, and a second switching element coupled to the second variable resistance element via a second line, wherein a distance between the first switching element and the first variable resistance element is larger than a distance between the second switching element and the second variable resistance element, and wherein a second path from a first terminal of the second switching element to the second variable resistance element includes a resistance component, a resistance of the second path being greater than a resistance of a first path, the first path being from a first terminal of the first switching element to the first variable resistance element.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a first variable resistance element, a first switching element coupled to the first variable resistance element via a first line, a second variable resistance element, and a second switching element coupled to the second variable resistance element via a second line, wherein a distance between the first switching element and the first variable resistance element is larger than a distance between the second switching element and the second variable resistance element, and wherein a second path from a first terminal of the second switching element to the second variable resistance element includes a resistance component, a resistance of the second path being greater than a resistance of a first path, the first path being from a first terminal of the first switching element to the first variable resistance element.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a first variable resistance element, a first switching element coupled to the first variable resistance element via a first line, a second variable resistance element, and a second switching element coupled to the second variable resistance element via a second line, wherein a distance between the first switching element and the first variable resistance element is larger than a distance between the second switching element and the second variable resistance element, and wherein a second path from a first terminal of the second switching element to the second variable resistance element includes a resistance component, a resistance of the second path being greater than a resistance of a first path, the first path being from a first terminal of the first switching element to the first variable resistance element.

Abstract: A stack type memory device and a method of manufacturing the same are provided. The stack type memory device includes a semiconductor substrate, a plurality of active layers stacked on the semiconductor substrate, and a gate structure overlapping the plurality of active layers. The gate structure includes a side gate region overlapping sides of the plurality of active layers and a top gate region overlapping a top of an uppermost active layer.

Abstract: A stack type memory device and a method of manufacturing the same are provided. The stack type memory device includes a semiconductor substrate, a plurality of active layers stacked on the semiconductor substrate, and a gate structure overlapping the plurality of active layers. The gate structure includes a side gate region overlapping sides of the plurality of active layers and a top gate region overlapping a top of an uppermost active layer.

Abstract: A stack type memory device and a method of manufacturing the same are provided. The stack type memory device includes a semiconductor substrate, a plurality of active layers stacked on the semiconductor substrate, and a gate structure overlapping the plurality of active layers. The gate structure includes a side gate region overlapping sides of the plurality of active layers and a top gate region overlapping a top of an uppermost active layer.

Abstract: A vertical transistor may include a pillar, a gate and an electric field-buffering region. The pillar may be vertically extended from a surface of a semiconductor substrate. The pillar may include a source, a channel region and a drain. The gate may be formed on an outer surface of the pillar. The gate may be overlapped with the channel region, a portion of the source configured to make contact with the channel region, and a portion of the drain configured to make contact with the channel region. The electric field-buffering region may be formed in the portion of the drain overlapped with the gate. The electric field-buffering region may have a band gap different from a band gap of a material in the pillar.

Abstract: A variable resistance memory device and a driving method thereof are provided. The variable resistance memory device includes a base layer and a pillar-shaped gate electrode formed on the base layer and extending substantially perpendicular to a surface of the base layer. A current transfer layer is formed to surround the pillar-shaped gate electrode. A variable resistance layer formed in an outer portion of the current transfer layer. A blocking layer blocks a path of current flowing through the current transfer layer based on a voltage applied voltage to the pillar-shaped gate electrode, and diverts the current flowing through the current transfer layer to the variable resistance layer.

Abstract: A 3-dimensional stack memory device includes a semiconductor substrate, a stacked active pattern configured so that a plurality of stripe shape active regions and insulation layers are stacked alternatively over the semiconductor substrate, a gate electrode formed in the stacked active pattern, a source and drain formed at both sides of the gate electrode in each of the plurality of active regions, a bit line formed on one side of the drain to be connected to the drain, a resistive device layer formed on one side of the source to be connected to the source, and a source line connected to the resistive device layer. The source is configured of an impurity region having a first conductivity type, and the drain is configured of an impurity region having a second conductivity type different from the first conductivity type.

Abstract: A variable resistance memory device includes a semiconductor substrate having a vertical transistor with a shunt gate that increases an area of a gate of the vertical transistor.

Abstract: A semiconductor memory device comprising a bit line extending in a first direction, a vertical gate cell including a gate oxide layer and a gate metal layer that are formed in a pillar shape, a lower electrode and a data storage material layer formed on the vertical gate cell, and an interconnection layer formed on the data storage material layer.

Abstract: A vertical transistor may include a pillar, a gate and an electric field-buffering region. The pillar may be vertically extended from a surface of a semiconductor substrate. The pillar may include a source, a channel region and a drain. The gate may be formed on an outer surface of the pillar. The gate may be overlapped with the channel region, a portion of the source configured to make contact with the channel region, and a portion of the drain configured to make contact with the channel region. The electric field-buffering region may be formed in the portion of the drain overlapped with the gate. The electric field-buffering region may have a band gap different from a band gap of a material in the pillar.

Abstract: A semiconductor device having a fin gate that improves an operation current, and a method of manufacturing the same are provided. The semiconductor device includes an active pillar formed on a semiconductor substrate, and including a first region and a second region surrounding at least one surface of the first region, and a fin gate extending to overlap an upper surface and a lateral surface of the active pillar. The first region of the active pillar is formed of a semiconductor layer having a lattice constant smaller than that of the second region of the active pillar.

Abstract: A semiconductor device includes a semiconductor substrate having a first conductivity type, a plurality of pillars extending to a direction perpendicular to a surface of the semiconductor substrate, a stress providing layer formed in the semiconductor substrate between pillars and forming a junction with the semiconductor substrate below each pillar to cause lattice deformation in the pillar, a source region having a second conductivity type opposite to the first conductivity type formed in the semiconductor substrate below the pillar, a drain region having the second conductivity type formed in an upper portion of the pillar, a gate insulating layer formed on a lateral surface of the pillar and a surface of the stress providing layer, and a gate electrode formed to surround the lateral surface of the pillar.

Abstract: A variable resistance memory device includes a plurality of column selection switches, a plurality of variable resistance memory cells configured to be stacked and selected by the plurality of column selection switches, and a bit line connected to the plurality of variable resistance memory cells. Each of the plurality of variable resistance memory cells includes an ovonic threshold switch (OTS) element selectively driven by a plurality of word lines arranged to be stacked and a variable resistor connected in parallel to the OTS element.