Abstract: A system including a user interface that includes a processor in communication with a display and an input interface, the processor programmed to output on the display the user interface including a keyboard layout, wherein the keyboard layout includes at least a keyboard includes a collection of characters, in response to a first input from the input interface, output a first portion of the keyboard layout associated with a first subset of characters of the keyboard layout, wherein the first subset does not include all of the characters, in response to a second input from the input interface, select a second subset of characters, wherein the second subset of characters is from and include less characters than the first subset of characters and the second subset includes two or more characters, and output a character on a text field associated with the user interface based on the selection of the second subset.

Abstract: A virtual reality apparatus that includes a display configured to output information related to a user interface of the virtual reality device, a microphone configured to receive one or more spoken word commands from a user upon activation of a voice recognition session, an eye gaze sensor configured to track eye movement of the user, and a processor programmed to, in response to a first input, output one or more words of a text field, in response to an eye gaze of the user exceeding a threshold time, emphasize a group of one or more words of the text field, toggle through a plurality of words of only the group utilizing the input interface, in response to a second input, highlight and edit an edited word from the group, and in response to utilizing contextual information associated with the group a language model, outputting one or more suggested words.

Abstract: A method for offshore dual-drive core drilling with three layers of casings under surge compensation is provided. According to the method, a drilling vessel is located at set latitude and longitude coordinates by a dynamic positioning system; drill pipes are stabilized by a seabed template; torques and drilling pressures can be transmitted during drilling of the casings by means of surge compensation of the casings at a wellhead; during drilling for sampling, the surge compensation can compensate to a certain extent for a change in water depth caused by rising or falling tides, or surge, thereby preventing the casings from colliding with equipment and ensuring the safety of wellhead operation; and the drilling of three layers of casings is achieved by means of dual driver heads to effectively protect a wellbore wall, such that high core-drilling rate and good core-drilling quality are achieved during drilling for sampling.

Abstract: An engine includes a cylinder block, a cylinder head, and a piston. The cylinder head is connected to the cylinder block. The piston is movably connected to the cylinder block. The cylinder block, the cylinder head, and the piston form a combustion chamber. The cylinder head includes an intake valve hole and an exhaust valve hole. An intake valve is disposed at the intake valve hole and an exhaust valve is disposed at the exhaust valve hole. A barrier protrusion is protruded at the edge of the intake valve hole away from the exhaust valve hole. The included angle between a first connecting line connecting a first end of the barrier protrusion and a center of the intake valve hole and a second connecting line connecting a second end of the barrier protrusion and the center of the intake valve hole is greater than 120 degrees and less than or equal to 180 degrees.

Abstract: A method of sharing data between a publisher device and at least one customer device, the method including the steps, performed by a processing unit of the publisher device, of: a) receiving, from a customer device, a request for obtaining the data from the publisher device, the request including customer image data related to a customer image of a given scene; b) determining a similarity score between the customer image data and publisher image data related to a publisher image stored in the publisher device; and c) depending on the similarity score, sending the data to the customer device.

Abstract: The present invention provides a benzoheterocycle substituted tetrahydroisoquinoline compound, and in particular, relates to a compound shown in formula (I) and a pharmaceutically acceptable salt thereof, and the compound for the treatment of chronic kidney disease.

Abstract: The present disclosure relates to a processor and a computing system. A processor is provided, including: a pipeline stage, including sequential device(s); and a first clock driving circuit, configured to provide a clock signal to the pipeline stage, wherein the first clock driving circuit includes: a plurality of first clock paths, configured to provide corresponding clock signals respectively; a first selector, configured to select a clock signal from the clock signals provided by the plurality of first clock paths for the pipeline stage.

Abstract: This application relates to a method of processing augmented reality (AR) data at a terminal, and a storage medium, and the AR data propagation method includes: receiving AR data, the AR data carrying AR recognition data and being generated by a source terminal; displaying the AR data according to the AR recognition data; in response to receiving a user instruction, updating the AR data according to the user instruction; and sharing the updated AR data with a target terminal. With the solutions provided in this application, users can implement AR interactions with virtual world data by using a terminal with a relatively low configuration.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A split lens assembly module, comprising: a focusing mechanism; and a lens assembly, wherein the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the fixing lens assembly, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing.

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.

Abstract: An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Abstract: Embodiments of the present disclosure relate to rollback of services with a global variable change. Embodiment techniques detect that at least two of a plurality of services in a transaction are executed to change a value of a first global variable. Tracing information is obtained to indicate a first order in which the at least two services change the value of the first global variable during execution of the plurality of services. In response to a failure of the transaction, a rollback execution plan for a plurality of compensating services is determined at least based on the tracing information, where the plurality of compensating services are configured to compensate for the plurality of services respectively. The plurality of compensating services subsequently executed according to the rollback execution plan.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.