Abstract: A data management method is provided. To-be-migrated base data in a first service data set is obtained, mirror data that are same as the base data are generated, and the base data to a second service data set are migrated. Incremental data obtained for the base data are recorded in the migration process of the base data. Adding processing is performed on the mirror data by using the incremental data, and the incremental data are migrated to the second service data set, when the migration process of the base data is completed. The mirror data and the incremental data in the first service data set are cleared when the migration process of the incremental data is completed.

Abstract: An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.

Abstract: A multi-group lens assembly includes a plurality of lens group units and at least one assembly structure. The assembly structure is for assembling two adjacent lens group units. Lenses in the lens group units are made of any two or three of a glass material, a resin material, and a glass-resin composite material. Alternatively, the lenses are made of only the glass-resin composite material. The lenses can be assembled and adjusted easily and conveniently and have high pixel densities and small TTLs, thereby improving user experience.

Abstract: Provided is a lens assembly, which comprises: a first optical lens module, comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module, comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. A lower end portion of the first carrier extends to the bearing portion, so as to constrain the relative positions of the first optical lens module and the second optical lens module.

Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

Abstract: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.

Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: Approaches presented herein enable hot upgrading a microservices sequence in a cloud computing environment. More specifically, a next microservice of microservice subsequence in a running sequence is obtained, in response to a message to invoke the microservice or subsequence. The running microservice sequence includes at least one unexecuted microservice or subsequence that is to be hot upgraded. The running microservice sequence is generated based on a sequence that is to be hot upgraded which comprises an ordered list of microservices and/or subsequences. The approach may include determining the status of a next microservice or subsequence. The approach may further include invoking the next microservice or subsequence in the running sequence, in response to the status of the next microservice or subsequence being upgrade-complete.

Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

Abstract: A camera module includes a circuit board, a photosensitive element mounted on the circuit board, and a support body formed on the circuit board and surrounding the photosensitive element. The support body extends towards the photosensitive element and contacts the photosensitive element. The support body and the circuit board are fixed together to form a combined body, and the combined body has a side face including an indented surface indented towards the direction of the photosensitive element, one end of the indented surface being located at the bottom surface of the circuit board. A method is used for manufacturing a camera module and an intelligent terminal with built-in camera module. The screen-to-body ratio of the intelligent terminal is increased, which allows the thickness of the intelligent terminal to be further decreased, enables easy processing, and allows for a miniaturized camera module having a good structural strength.

Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.