Patents by Inventor Nan Lin

Nan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11418098
    Abstract: Embodiments of the disclosure provide a rotor, a motor, and a driving apparatus. The rotor is defined by laminated electromagnetic steel plates. The electromagnetic steel plate includes a plurality of through hole groups running through the electromagnetic steel plate, and each through hole group includes a plurality of through holes. A central axis of a magnetic pole of the rotor is used as a d axis, and an axis that is 45 degrees from the d axis is used as a q axis, where an outer peripheral surface of the rotor that is between the d axis and the q axis is recessed radially inward relative to an outer peripheral surface of another portion of the rotor, so that the rotor is noncircular when observed in an axial direction.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: August 16, 2022
    Assignee: NIDEC CORPORATION
    Inventors: Sheng-Chan Yen, Guo-Jhih Yan, Ta-Yin Luo, Yu-Wei Hsu, Hsin-Nan Lin, Cheng-Tsung Liu
  • Publication number: 20220249395
    Abstract: A method for treating an autoimmune neurological disease and/or a neurodegenerative disease is provided. The method includes administering an effective amount of at least one compound having Formula (I), Formula (II) or Formula (III), or its geometric isomer, enantiomer or diastereomer to a subject in need thereof: wherein is a single or double bond, X is NCH3 or CH2, Y is null, O or N, Z is O or N, R1 is H, OH, and R2 is null, H, C1-C8 alkyl, —(C?O)-alkyl, —(C?O)-aryl, —(C?O)-alkyl-aryl, —(C?O)-heteroaryl, cycloalkyl or heterocycloalkyl, which optionally substituted by one or more of —OH, —NO2, —NH2, —NR3R4, carbonyl, alkoxyl, alkyl or —OCF3, wherein R3 and R4 independently are H, alkyl, O2CH3, —(C?O)—CH3 or (C?O)—NH2.
    Type: Application
    Filed: April 22, 2022
    Publication date: August 11, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Kuei HUANG, I-Hong PAN, Shu-Fang WEN, Meng-Nan LIN, I-Huang LU, Zong-Keng KUO, Chu-Hsun LU, Tze-Chung LEE, Ya-Yan YANG, Jia-Horng LIAW, Pei-Hsin LIN
  • Publication number: 20220254679
    Abstract: A method includes depositing an etch stop layer over a first conductive feature, performing a first treatment to amorphize the etch stop layer, depositing a dielectric layer over the etch stop layer, etching the dielectric layer to form an opening, etching-through the etch stop layer to extend the opening into the etch stop layer, and filling the opening with a conductive material to form a second conductive feature.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 11, 2022
    Inventors: Jyh-Nan Lin, Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu
  • Patent number: 11400054
    Abstract: A method for treating an autoimmune neurological disease and/or a neurodegenerative disease is provided. The method includes administering an effective amount of at least one compound having Formula (I), Formula (II) or Formula (III), or its geometric isomer, enantiomer or diastereomer to a subject in need thereof: wherein is a single or double bond, X is NCH3 or CH2, Y is null, O or N, Z is O or N, R1 is H, OH, and R2 is null, H, C1-C8 alkyl, —(C?O)-alkyl, —(C?O)-aryl, —(C?O)-alkyl-aryl, —(C?O)-heteroaryl, cycloalkyl or heterocycloalkyl, which optionally substituted by one or more of —OH, —NO2, —NH2, —NR3R4, carbonyl, alkoxyl, alkyl or —OCF3, wherein R3 and R4 independently are H, alkyl, —SO2CH3, —(C?O)—CH3 or —(C?O)—NH2.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: August 2, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Kuei Huang, I-Hong Pan, Shu-Fang Wen, Meng-Nan Lin, I-Huang Lu, Zong-Keng Kuo, Chu-Hsun Lu, Tze-Chung Lee, Ya-Yan Yang, Jia-Horng Liaw, Pei-Hsin Lin
  • Publication number: 20220214828
    Abstract: A storage device management method for a storage device is provided. The method includes periodically obtaining a current device temperature corresponding to the storage device via a temperature sensor of the storage device; accumulating a first count value in response to determining that the current device temperature is greater than a first temperature threshold; adjusting the first temperature threshold in response to determining that the first count value is greater than the first count threshold; accumulating a second count value in response to determining that the current device temperature is greater than a second temperature threshold; adjusting the second temperature threshold in response to determining that the second count value is greater than the second count threshold; and controlling the storage device to enter a target system state in response to determining that the current device temperature is not less than a critical temperature threshold.
    Type: Application
    Filed: December 3, 2021
    Publication date: July 7, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hsiu-En Hsu, Chung-Chieh Lee, Jeng-Nan Lin, Chan-Ju Lin, Jie-Ting Hsieh, Tsuan-Fang Lin, Yi-Ting Lyu
  • Publication number: 20220209595
    Abstract: A synchronous reluctance motor includes a rotor and a stator surrounding the rotor. The rotator includes a rotatable shaft and magnetic flux barrier layers arranged radially. One of the magnetic flux barrier layers closest to the stator is filled with a conductor, and one of the magnetic flux barrier layers closest to the rotating shaft is a void.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 30, 2022
    Inventors: Pei-Chun SHIH, Yu-Wei HSU, Sheng-Chan YEN, Ta-Yin LUO, Hsin-Nan LIN, Guo-Jhih YAN, Cheng-Tsung LIU
  • Patent number: 11367241
    Abstract: Raytracing can be used to generate high quality, physics-based water caustics patterns in real time. A caustics map is generate to represent locations and normals of points across a water surface. Rays from a light source that are reflected and refracted from these points, as determined by the locations and normals, and can generate hit points on a surface. Neighboring points can be used to help determine the resulting caustics pattern. In one embodiment, information for neighboring points in the caustics map can be used to generate scale factors for geometric regions to be projected onto the surface for each hit point. In another embodiment, these points serve as vertices of a caustic mesh that can be projected onto the surface, where the brightness at a primitive is determined by the size of the primitive area defined by the vertices of the caustics mesh.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: June 21, 2022
    Assignee: NVIDIA CORPORATION
    Inventors: Xueqing Yang, Nan Lin
  • Patent number: 11368252
    Abstract: Embodiments of the present disclosure disclose a data indicating method and related products, including: receiving, by a terminal, a downlink control signaling from a network side device, where the downlink control signaling includes a first information domain and a second information domain, the first information domain is configured to indicate whether a transport block scheduled by the downlink control signaling is a new transport block, and the second information domain is configured to indicate a coding block group scheduled by the downlink control signaling; determining, by the terminal, a number of coding block groups included in the new transport block according to the first information domain and the second information domain. The embodiments of the disclosure is beneficial to determine a number of bits of an uplink control signaling that is fed back and reduce an uplink control signaling overhead.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: June 21, 2022
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Ya'nan Lin
  • Publication number: 20220190122
    Abstract: A semiconductor device includes a metal layer, an insulating layer disposed above the metal layer, and a multi-layer diffusion barrier disposed on the metal layer between the metal layer and the insulating layer. The multi-layer diffusion barrier includes a first material layer including a metallic nitride and a second material layer including a metallic oxide.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 16, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jyh-nan LIN, Ding-I Liu, Yuh-Ta Fan
  • Publication number: 20220181203
    Abstract: A method for improving reliability of interconnect structures for semiconductor devices is disclosed. The method includes forming a contact structure on a transistor and forming a metallization layer on the contact structure. The forming the metallization layer includes depositing an inter-metal dielectric (IMD) layer on the transistor, forming an opening within the IMD layer to expose a top surface of the contact structure, depositing a metallic layer to fill the opening, forming an electron barrier layer within the IMD layer, and forming a capping layer within the metallic layer. The electron barrier layer has a hole carrier concentration higher than a hole carrier concentration of a portion of the IMD layer underlying the electron barrier layer. The capping layer has a hole carrier concentration higher than a hole carrier concentration of a portion of the metallic layer underlying the capping layer.
    Type: Application
    Filed: February 28, 2022
    Publication date: June 9, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Jen Chen, Kai-Shiung Hsu, Ding-I Liu, Jyh-nan Lin
  • Publication number: 20220173763
    Abstract: A data transmission method for use between a wireless transmitter and a wireless receiver of a wireless peripheral device is provided. In a frequency hopping procedure, the wireless transmission data is re-transmitted through a secondary transmission channel. Consequently, a transmission delay problem is reduced. Moreover, the wireless receiver issues a special acknowledgement packet with loadable information to the wireless transmitter. Consequently, the master control power of the frequency hopping procedure is switched from the wireless transmitter to the wireless receiver. In addition, the information control capability of the wireless receiver to control the wireless transmitter in the communication application level can be increased.
    Type: Application
    Filed: March 25, 2021
    Publication date: June 2, 2022
    Inventor: Chien-Nan Lin
  • Patent number: 11349135
    Abstract: A method of preparation and application for a glass ceramic sealing thin strip with high sealing performance, differing from using conventional glass ceramic packaging paste applied to the junction of the cell stack assembly and connecting plates. The glass ceramic sealing thin strip of present invention utilizes tape casting to produce a single layer or multi-layer stacking in accordance with the required thickness of the glass-ceramic sealing thin strip, and cutting the glass ceramic sealing thin strips from molds in accordance with the geometry of cell stacks with equal thickness of the glass ceramic sealing thin strip for SOFC cell stack assembly, aiming to overcome the setbacks of the conventional dispensing method with glass ceramic packaging paste that makes the thickness difficult to control, and to effectively improve sealing performance of the cell stack assembly and the power generation efficiency, and achieve commercial application with mass production.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: May 31, 2022
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Tai-Nan Lin, Szu-Han Wu, Yi-Jing Wu, Min-Fang Han, Wei-Xin Kao, Hong-Yi Kuo, Chun-Yen Yeh, Yung-Neng Cheng, Ruey-Yi Lee
  • Publication number: 20220166651
    Abstract: A wireless communication device for a transmission end of a wireless communication system is provided. The wireless communication device includes a wireless analog transmission unit, for transmitting a data packet on a data transmission channel; and a packet generating unit, for generating the data packet and at least one protection packet; wherein before transmitting the data packet on the data transmission channel, the wireless communication device transmits the at least one protection packet on at least one adjacent channel of the data transmission channel to indicate to at least one user of the at least one adjacent channel to stop using the at least one adjacent channel before transmission of the data packet is completed, and at least one frequency band of the at least one adjacent channel overlaps a frequency band of the data transmission channel.
    Type: Application
    Filed: May 6, 2021
    Publication date: May 26, 2022
    Inventors: Shen-Chung Lee, Wei-Hsuan Chang, Wen-Yung Lee, Yu-Nan Lin, Chih-Heng Tsai, Tzu-Hao Tai
  • Patent number: 11334339
    Abstract: A USB device and a firmware updating method for the USB device are provided. The firmware updating method includes the following steps. Firstly, a communication protocol is provided. Then, the communication protocol is installed in the at least one microcontroller unit of the USB device. Then, an application program is produced according to the communication protocol. The application program is installed in an electronic computer. The application program contains at least one update firmware information. Then, the at least one update firmware information is transmitted from the electronic computer to the at least one microcontroller unit through the communication protocol. Consequently, at least one original firmware information in the at least one microcontroller unit is replaced by the at least one update firmware information.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: May 17, 2022
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Chih-Feng Chien, Yun-Jung Lin, Chien-Nan Lin
  • Publication number: 20220148975
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Application
    Filed: December 28, 2020
    Publication date: May 12, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • Patent number: 11329017
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first electronic component having an active surface and a backside surface opposite to the active surface and a first antenna layer disposed on the backside surface of the first electronic component. The semiconductor device package further includes a first dielectric layer covering the first antenna layer and a second antenna layer disposed over the first antenna layer. The second antenna layer is spaced apart from the first antenna layer by the first dielectric layer. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: May 10, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Tung Chang, Cheng-Nan Lin
  • Patent number: 11322397
    Abstract: In a method of manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, an adhesion enhancement layer is formed on a surface of the first dielectric layer, and a second dielectric layer is formed on the adhesion enhancement layer.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 3, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsiao-Min Chen, Jyh-Nan Lin, Kai-Shiung Hsu, Ding-I Liu
  • Publication number: 20220130099
    Abstract: Raytracing can be used to generate high quality, physics-based water caustics patterns in real time. A caustics map is generate to represent locations and normals of points across a water surface. Rays from a light source that are reflected and refracted from these points, as determined by the locations and normals, and can generate hit points on a surface. Neighboring points can be used to help determine the resulting caustics pattern. In one embodiment, information for neighboring points in the caustics map can be used to generate scale factors for geometric regions to be projected onto the surface for each hit point. In another embodiment, these points serve as vertices of a caustic mesh that can be projected onto the surface, where the brightness at a primitive is determined by the size of the primitive area defined by the vertices of the caustics mesh.
    Type: Application
    Filed: October 22, 2020
    Publication date: April 28, 2022
    Inventors: Xueqing Yang, Nan Lin
  • Patent number: 11316274
    Abstract: A semiconductor device package includes a substrate, a first molding compound and antenna layer. The substrate has a first surface and a second surface opposite to the first surface. The first molding compound is disposed on the first surface of the substrate. The antenna layer is disposed on the first molding compound. The substrate, the first molding compound and the antenna layer define a cavity.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: April 26, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Nan Lin, Hsu-Nan Fang
  • Patent number: 11315829
    Abstract: A method includes depositing an etch stop layer over a first conductive feature, performing a first treatment to amorphize the etch stop layer, depositing a dielectric layer over the etch stop layer, etching the dielectric layer to form an opening, etching-through the etch stop layer to extend the opening into the etch stop layer, and filling the opening with a conductive material to form a second conductive feature.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: April 26, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jyh-Nan Lin, Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu