Patents by Inventor Nan Tu

Nan Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200357515
    Abstract: A method and apparatus include receiving, by a device, medical information associated with a user. Inquiry information is determined based on the medical information associated with the user and a reinforcement learning model. The inquiry information is provided to permit response information to be received. The response information is received based on providing the inquiry information. Diagnosis information is determined based on the medical information and the response information using a machine learning model. The diagnosis information is provided to a set of devices via a network.
    Type: Application
    Filed: May 10, 2019
    Publication date: November 12, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Xiaozhong CHEN, Kun Wang, Nan Du, Min Tu, Shangqing Zhang, Yusheng Xie, Wei Fan
  • Publication number: 20200342056
    Abstract: A method for processing unstructured Chinese-language medical text includes identifying a medical entity in the unstructured Chinese-language medical text using an attention-based named-entity recognition (NER) model, structuring the identified medical entity using a multiple-dimensional entity understanding framework, normalizing the structured medical entity using a medical knowledge graph, and outputting the normalized medical entity.
    Type: Application
    Filed: April 26, 2019
    Publication date: October 29, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Tao YANG, Min TU, Yaliang LI, Yusheng XIE, Shangqing ZHANG, Kun WANG, Nan DU, Wei FAN
  • Publication number: 20200343289
    Abstract: An image sensor device is provided. The image sensor device includes a semiconductor substrate having a first side, a second side opposite to the first side, and at least one light-sensing region close to the first side. The image sensor device includes a dielectric feature covering the second side and extending into the semiconductor substrate. The dielectric feature in the semiconductor substrate surrounds the light-sensing region. The image sensor device includes a reflective layer in the dielectric feature in the semiconductor substrate, wherein a top portion of the reflective layer protrudes away from the second side, and a top surface of the reflective layer and a top surface of the insulating layer are substantially coplanar.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh FANG, Ming-Chi WU, Ji-Heng JIANG, Chi-Yuan WEN, Chien-Nan TU, Yu-Lung YEH, Shih-Shiung CHEN, Kun-Yu LIN
  • Publication number: 20200337643
    Abstract: In a method for correcting the interference in respiratory navigation, transmitting, during magnetic resonance scanning, a respiratory signal generated by a radio frequency signal generator to a human body; acquiring, as a measured respiratory signal, a respiratory signal passing through the human body and acquired in a local coil, wherein the measured respiratory signal is constituted by a real respiratory signal and an interference signal; determining, according to a respiratory signal coil sensitivity of the real respiratory signal and an interference signal coil sensitivity of the interference signal, a signal relation that is satisfied by the real respiratory signal, the interference signal and the measured respiratory signal; and calculating the signal relation to obtain the real respiratory signal.
    Type: Application
    Filed: April 24, 2020
    Publication date: October 29, 2020
    Applicant: Siemens Healthcare GmbH
    Inventors: Nan Xiao, De He Weng, Yan Tu Huang, Qiong Zhang
  • Publication number: 20200327964
    Abstract: A method of medical data auto collection segmentation and analysis, includes collecting, from a plurality of sources, unstructured medical data in a plurality of formats, recognizing a medical name entity of each piece of the unstructured medical data, using a medical dictionary, and performing semantic text segmentation on each piece of the unstructured medical data so that each piece of the unstructured medical data is partitioned into groups sharing a same topic. The method further includes generating, as structured medical data, each piece of the unstructured medical data of which the medical name entity is recognized, each piece of the unstructured medical data being partitioned into the groups, and indexing the structured medical data into elastic search clusters.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 15, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Shangqing ZHANG, Min TU, Nan DU, Yusheng XIE, Yaliang LI, Tao YANG, Wei FAN
  • Publication number: 20200327985
    Abstract: A method of performing a heart abnormalities analysis, includes learning text information from an electronic medical record (EMR) and/or an electronic health record (EHR) of a user, learning signal information from electrocardiography (ECG) signal data of the user, merging the learned text information and the learned signal information to generate one or more representations of the text information and the signal information that are merged, and performing the heart abnormalities analysis on the generated one or more representations.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 15, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Nan DU, Kun Wang, Min Tu, Shangqing Zhang, Hui Tang, Shih-Yao Lin, Wei Fan
  • Publication number: 20200327992
    Abstract: A method and apparatus include receiving information associated with a bug bite. Information that identifies the bug bite is determined using a model, based on receiving the information associated with the bug bite. Information that identifies the bug bite is provided, based on determining the information that identifies the bug bite.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 15, 2020
    Applicant: Tencent America LLC
    Inventors: Lianyi HAN, Nan DU, Kun WANG, Min TU, Shangqing ZHANG, Hui TANG, Shih-Yao LIN, Wei FAN
  • Patent number: 10803129
    Abstract: The present disclosure relates to a method for processing online user distribution. The method includes acquiring a map for displaying online user distribution; determining the projection algorithm of the map; determining intermediate coordinates of at least one of the points according to a longitude and a latitude and the projection algorithm, and acquiring, by using a fitting algorithm, approximate solutions of functions of mapping the intermediate coordinates to the coordinates on the map. The method further includes calculating coordinates of each online user on the map according to the projection algorithm and the approximate solutions of the mapping functions; and assembling distribution data of online users on the map according to coordinates of all the online users on the map. The present disclosure further provides an apparatus for processing online user distribution.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: October 13, 2020
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Qidong Zhuang, Junhong Tu, Xiaojun Liu, Jie Yang, Ming Rao, Nan Qin
  • Publication number: 20200315547
    Abstract: Method and apparatus for vertebral artery dissection risk analysis using hemodynamic variable based four dimensional magnetic resonance flow imaging, comprising obtaining four-dimensional phase-contrast magnetic resonance imaging data, performing pre-processing of the four-dimensional phase-contrast magnetic resonance imaging data, obtaining at least one blood hemodynamic marker from the four-dimensional phase-contrast magnetic resonance imaging data, classifying the at least one blood hemodynamic marker as a hemodynamic predictor of vertebral artery dissection, and creating a comprehensive risk evaluation of vertebral artery dissection using the hemodynamic predictor.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 8, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Zhen QIAN, Hui TANG, Nan DU, Min TU, Kun WANG, Lianyi HAN, Wei FAN
  • Publication number: 20200315465
    Abstract: A method of determining a risk probability of vertebral artery dissection (VAD) in a patient, including receiving medical image information of the patient and clinical report information of the patient; extracting at least one biomarker corresponding to a vertebral artery segment included in the medical image information; extracting patient history information from the clinical report information; and determining the risk probability of VAD using a deep learning classification model based on the extracted at least one biomarker and the extracted patient history information.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 8, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Hui Tang, Nan Du, Min Tu, Kun Wang, Lianyi Han, Wei Fan
  • Publication number: 20200264969
    Abstract: A method and apparatus are provided that includes, in a same framework, storing an artificial intelligence (AI) model, loading the AI model into a serving platform, loading and testing a test unit against the AI model loaded into the serving platform, and collecting reports from results of storing the AI model, loading the AI model into the serving platform and testing the test unit.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 20, 2020
    Applicant: Tencent America LLC
    Inventors: Min Tu, Shangqing Zhang, Tao Yang, Yaliang Li, Nan Du, Yusheng Xie, Wei Fan
  • Publication number: 20200265959
    Abstract: A method and apparatus are provided that includes iteratively sampling candidates from medical records and evaluating whether ones of the candidates better explain a member from the medical records. The iterations replace the member with the candidates and depending on whether the candidates better explain the member from the medical records may be weighted in a next iteration.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 20, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Yusheng XIE, Tao YANG, Min TU, Nan DU, Shih-Yao LIN, Wei FAN
  • Patent number: 10734427
    Abstract: A method for forming an image sensor device is provided. The method includes providing a semiconductor substrate including a front surface, a back surface opposite to the front surface, at least one light-sensing region close to the front surface, and a first trench surrounding the light-sensing region. The method includes forming an insulating layer over the back surface and in the first trench. A void is formed in the insulating layer in the first trench, and the void is closed. The method includes removing the insulating layer over the void to open up the void. The opened void forms a second trench partially in the first trench. The method includes filling a reflective structure in the second trench. The reflective structure has a light reflectivity ranging from about 70% to about 100%.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: August 4, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Fang, Ming-Chi Wu, Ji-Heng Jiang, Chi-Yuan Wen, Chien-Nan Tu, Yu-Lung Yeh, Shih-Shiung Chen, Kun-Yu Lin
  • Publication number: 20200229771
    Abstract: There is included an apparatus and system including an intra-heartbeat (HB) extraction code configured to extract intra-HB features from electrocardiography (ECG) signals, and an inter-HB extraction code configured to extract inter-HB features from the ECG signals, and at least one attention mechanism code configured to control at least one of the intra-HB extraction code and inter-HB extraction code based on at least one attention mechanism.
    Type: Application
    Filed: January 22, 2019
    Publication date: July 23, 2020
    Applicant: TENCENT AMERICA LLC
    Inventors: Kun WANG, Nan DU, Yusheng XIE, Min TU, Shangqing ZHANG, Yaliang LI, Tao YANG, Hui TANG, Lianyi HAN, Wei FAN
  • Patent number: 10707361
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: July 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Publication number: 20200111923
    Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 9, 2020
    Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
  • Publication number: 20200083390
    Abstract: An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Inventors: Ming-Chi Wu, Chien Nan Tu, Kun-Yu Lin, Shih-Shiung Chen
  • Publication number: 20200083389
    Abstract: An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Inventors: Ming-Chi Wu, Chien Nan Tu, Kun-Yu Lin, Shih-Shiung Chen
  • Publication number: 20200052014
    Abstract: A device includes two BSI image sensor elements and a third element. The third element is bonded in between the two BSI image sensor elements using element level stacking methods. Each of the BSI image sensor elements includes a substrate and a metal stack disposed over a first side of the substrate. The substrate of the BSI image sensor element includes a photodiode region for accumulating an image charge in response to radiation incident upon a second side of the substrate. The third element also includes a substrate and a metal stack disposed over a first side of the substrate. The metal stacks of the two BSI image sensor elements and the third element are electrically coupled.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Inventors: Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng
  • Patent number: 10553628
    Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: February 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Chang Huang, Chien Nan Tu, Ming-Chi Wu, Yu-Lung Yeh, Ji Heng Jiang