Abstract: Provided is a full color image forming method wherein high color reproducibility especially on a blue system and a green system can be obtained and an excellent gradation property can be obtained in a full color image to be obtained. The full color image forming method for forming a full color image by using at least yellow toner, magenta toner, and two kinds of cyan toners (1, 2) is characterized in that a toner image formed by the cyan toner (1) alone has the value of the maximum color saturation (C*) of not less than 50 and the value of lightness (L*) in a color space represented by an L*a*b* colorimetric system of not less than 30 and not more than 52, and that a toner image formed by the cyan toner (2) alone has the value of the maximum color saturation (C*) of not less than 50 and the value of the lightness (L*) in the color space represented by the L*a*b* calorimetric system of not less than 58 and not more than 75.

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 ?m. The reason is as follows. If the diameter of the mesh hole is less than 75 ?m, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 ?m, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 ?m. The reason is as follows. If the distance is less than 100 ?m, the solid layer cannot function. If the distance exceeds 2000 ?m, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.

Abstract: A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

Abstract: A cyan ink for inkjet recording comprising at least one of a phthalocyanine compound represented by Formula (1) and a phthalocyanine compound represented by Formula (2), Z being represented by Formula (3):

Abstract: Disclosed is a method for forming color image, in which one of the yellow, magenta, cyan and black toners is a high water content toner, and one of the yellow, magenta, cyan and black toners is a toner low water content toner, water content of the high water content toner is 1.2 to 2.5% by weight based on the high water content toner, and water content of the low water content toner is 0.1 to 1.2% by weight based on the low water content toner.

Abstract: The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Abstract: An electrostatic latent image developing toner comprising at least a resin, a wax and a colorant, wherein the wax comprises 40 to 98% by mass of a first release agent comprising an ester wax and 2 to 60% by mass of a second release agent comprising a hydrocarbon having at least one of a branched chain structure and a cyclic structure; and the colorant comprises a silicon phthalocyanine represented by Formula (I):

Abstract: Provided is a set of toners comprising a yellow toner, a magenta toner, a cyan toner and a black toner for forming a full color image with an electrophotographic method, wherein the yellow toner comprises toner particles containing at east one pigment selected from the group consisting of C. I. Pigment Yellow 74, C. I. Pigment Yellow 139, C. I. Pigment Yellow 180, C. I. Pigment Yellow 185 and C. I.

Abstract: Provided is a toner comprising toner particles containing a binder resin and coloring matters, wherein the coloring matters comprise a dye represented by Formula (X-1), a metal compound represented by Formula (1) and a quinacridone pigment represented by Formula (2):

Abstract: A set of toners comprising a yellow toner, a magenta toner, a cyan toner and a black toner for forming a full color image with an electrophotographic method, wherein the yellow toner comprises toner particles containing at least one pigment selected from the group consisting of C. I. Pigment Yellow 74, C. I. Pigment Yellow 139, C. I. Pigment Yellow 155, C. I. Pigment Yellow 180 and C. I.

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 ?m or more.

Abstract: Provided is a toner for an electrostatic charge image development having toner particles which contain: a binder resin; a colorant; and a compound represented by Formula (1) in an amount of 0.1 to 65 ppm based on the total weight of the toner particles: wherein R1 and R2 each respectively represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group.

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 ?m or more.

Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 ?m. The reason is as follows. If the diameter of the mesh hole is less than 75 ?m, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 ?m, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 ?m. The reason is as follows. If the distance is less than 100 ?m, the solid layer cannot function. If the distance exceeds 2000 ?m, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

Abstract: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.