Abstract: A monetary risk prediction apparatus according to an embodiment includes: a predictive model recording unit that records a predictive model to predict time-series data showing a future asset amount of a user; and prediction means for receiving evaluation data that is time-series data including an asset amount and a numeric value showing a health condition of the user, inputting the evaluation data to the predictive model recorded on the predictive model recording unit, and outputting the time-series data showing the future asset amount of the user predicted by the predictive model according to the input.

Abstract: A method of producing an amorphous alloy ribbon having a composition of Fe100-a-bBaSibCc (13.0 atom %?a?16.0 atom %, 2.5 atom %?b?5.0 atom %, 0.20 atom %?c?0.35 atom %, and 79.0 atom %?(100-a-b)?83.0 atom %) includes: preparing an alloy ribbon; and, in a state in which the alloy ribbon is tensioned with a tensile stress of from 5 MPa to 100 MPa, increasing a temperature of the alloy ribbon to from 410° C. to 480° C., at an average temperature increase rate of from 50° C./sec to less than 800° C./sec, and decreasing a temperature of the thus heated alloy ribbon to a temperature of a heat transfer medium for temperature-decreasing, at an average temperature decrease rate of from 120° C./sec to less than 600° C./sec, wherein the temperature increase and decrease are performed by contacting the traveling alloy ribbon with a heat transfer medium.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: The present disclosure provides a laminated structure with a through hollow structure having heat insulation, a light weight, durability, and sound absorption performance to reduce wind noise, transmitted noise, and the like. The laminated structure of the present disclosure has a foamed resin layer having continuous pores containing fused resin foam particles, and an air-impermeable outer layer provided on one side of the foamed resin layer, where a part of the foamed resin layer of the laminated structure cut out with a diameter of 41.5 mm? has an amount of air permeability of 2.5 cm3/(cm2·s) to 40 cm3/(cm2·s) measured by the Frazier method in which the foamed resin layer is set as an air introduction side.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

Abstract: An analysis system includes inference processer circuitry configured to infer a corresponding classification by inputting part of frequency spectrum data corresponding to reference measurement data to a learned model having learned a relation between part of frequency spectrum data corresponding to sample measurement data and a classification related to noise corresponding to the part, causal component identification processer circuitry configured to identify causal component data of noise from a component data list based on the inferred classification, and a presentation information generator configured to generate presentation information for a user based on the causal component data.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A method for manufacturing a laser diode element includes preparing a stacked body including a nitride semiconductor substrate, a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. Element regions are defined by planned cleavage lines and planned division lines. The stacked body defines protrusions each including first and second side surfaces, and a ridge. Lower ends of the first and second side surfaces are located below a lower surface of the active layer. A first distance from the first side surface to the ridge is different from a second distance from the second side surface to the ridge. The first distance is the same for all of the protrusions in the at least one of the element regions. The stack body is cleaved from the first side surface to the second side surface.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

Abstract: An analysis system includes inference processer circuitry configured to infer a corresponding classification by inputting part of frequency spectrum data corresponding to reference measurement data to a learned model having learned a relation between part of frequency spectrum data corresponding to sample measurement data and a classification related to noise corresponding to the part, causal component identification processer circuitry configured to identify causal component data of noise from a component data list based on the inferred classification, and a presentation information generator configured to generate presentation information for a user based on the causal component data.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.

Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.

Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: The present disclosure provides a laminated structure with a through hollow structure having heat insulation, a light weight, durability, and sound absorption performance to reduce wind noise, transmitted noise, and the like. The laminated structure of the present disclosure has a foamed resin layer having continuous pores containing fused resin foam particles, and an air-impermeable outer layer provided on one side of the foamed resin layer, where a part of the foamed resin layer of the laminated structure cut out with a diameter of 41.5 mm? has an amount of air permeability of 2.5 cm3/(cm2·s) to 40 cm3/(cm2·s) measured by the Frazier method in which the foamed resin layer is set as an air introduction side.

Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.