Patents by Inventor Naoki Azuma

Naoki Azuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10821468
    Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: November 3, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshinori Isobata, Masayuki Mantani, Naoki Azuma, Seiji Mizuoka, Takahiro Endo
  • Patent number: 10461222
    Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: October 29, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Makoto Abe, Keisuke Higashitani, Naoki Azuma, Akiyoshi Kinouchi
  • Publication number: 20190242558
    Abstract: A light emitting component mounter includes a luminance distribution measurer, a head moving mechanism, and a component mounting processor. The luminance distribution measurer causes the light to emit a light and measures a luminance distribution of a light emitter and detects a position of a luminance distribution center in the light emitter based on the measured luminance distribution. The head moving mechanism moves a mounting head. The component mounting processor controls the head moving mechanism based on the position detected by the luminance distribution measure.
    Type: Application
    Filed: January 15, 2019
    Publication date: August 8, 2019
    Inventors: HIDEAKI KATOU, KOJI SAKURAI, MASANORI IKEDA, NAOKI AZUMA
  • Publication number: 20190200460
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Application
    Filed: March 1, 2019
    Publication date: June 27, 2019
    Inventors: Ryota INOUE, Naoki AZUMA
  • Patent number: 10271436
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: April 23, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Inoue, Naoki Azuma
  • Patent number: 10263152
    Abstract: A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of ?10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: April 16, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Tomohiro Shimooka, Masahiko Sano, Naoki Azuma
  • Publication number: 20180272378
    Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.
    Type: Application
    Filed: February 19, 2018
    Publication date: September 27, 2018
    Inventors: YOSHINORI ISOBATA, MASAYUKI MANTANI, NAOKI AZUMA, SEIJI MIZUOKA, TAKAHIRO ENDO
  • Publication number: 20180062036
    Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.
    Type: Application
    Filed: August 30, 2017
    Publication date: March 1, 2018
    Applicant: NICHIA CORPORATION
    Inventors: Makoto ABE, Keisuke HIGASHITANI, Naoki AZUMA, Akiyoshi KINOUCHI
  • Publication number: 20180047874
    Abstract: A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of ?10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.
    Type: Application
    Filed: September 25, 2017
    Publication date: February 15, 2018
    Applicant: NICHIA CORPORATION
    Inventors: Tomohiro SHIMOOKA, Masahiko SANO, Naoki AZUMA
  • Patent number: 9806232
    Abstract: A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of ?10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 31, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Tomohiro Shimooka, Masahiko Sano, Naoki Azuma
  • Patent number: 9773946
    Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 26, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Makoto Abe, Keisuke Higashitani, Naoki Azuma, Akiyoshi Kinouchi
  • Patent number: 9693495
    Abstract: A tape feeder is provided for pitch-feeding a carrier tape that holds a component in a pocket of the carrier tape and supplying the component to a pickup position for a mount head. The tape feeder includes a guide section that guides the carrier tape with an upper portion of the carrier tape covered, in a vicinity of the pickup position, and a lower receiving section that is positioned below the guide section and receives the pocket of the carrier tape from a lower surface side of the pocket. The lower receiving section includes a suction section that sucks the component from below and a leaf spring member that allows the suction section to contact a bottom of pocket from the lower surface side of the pocket. The component is sucked and held from below by the suction section through a hole section formed in the bottom of the pocket.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: June 27, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Inoue, Naoki Azuma
  • Patent number: 9572295
    Abstract: In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: February 14, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Naoki Azuma, Masayuki Kuwabara
  • Patent number: 9553238
    Abstract: A method of manufacturing a semiconductor light emitting element includes forming a semiconductor stacked layer body on a substrate, the semiconductor stacked layer body including a first semiconductor layer and a second semiconductor layer; removing a portion of the semiconductor stacked layer body and exposing the first semiconductor layer such that the second semiconductor layer includes an extending portion that extends in a plane direction; forming a conductor layer electrically connecting the first semiconductor layer and the extending portion of the second semiconductor layer; forming a first electrode electrically connected to the first semiconductor layer and a second electrode electrically connected to the second semiconductor layer; forming a protective film covering at least a portion of the first electrode and at least a portion of the second electrode; and after forming the protective film, removing a portion of the exposed portion of the extending portion.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 24, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Kazuki Kashimoto, Masafumi Itasaka, Hisashi Kasai, Naoki Azuma
  • Patent number: 9518718
    Abstract: Provided is a bandpass filter for a light emitting device that can improve the light emission efficiency in use for a light emitting device, and a light emitting device that can obtain the high light emission efficiency by using the bandpass filter. The light emitting device includes a substrate; a light emitting element disposed over the substrate; a phosphor-containing layer containing at least one kind of phosphor; and a bandpass filter disposed over a surface of the phosphor-containing layer on the light emitting element side, the bandpass filter including a multilayer film having a plurality of first and second dielectric layers, the second dielectric layer being disposed over the first dielectric layer.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: December 13, 2016
    Assignee: NICHIA CORPORATION
    Inventors: Daisuke Sanga, Tomonori Morizumi, Naoki Azuma, Keisuke Sejiki, Kunihito Sugimoto
  • Publication number: 20160255753
    Abstract: A tape feeder is provided for pitch-feeding a carrier tape that holds a component in a pocket of the carrier tape and supplying the component to a pickup position for a mount head. The tape feeder includes a guide section that guides the carrier tape with an upper portion of the carrier tape covered, in a vicinity of the pickup position, and a lower receiving section that is positioned below the guide section and receives the pocket of the carrier tape from a lower surface side of the pocket. The lower receiving section includes a suction section that sucks the component from below and a leaf spring member that allows the suction section to contact a bottom of pocket from the lower surface side of the pocket. The component is sucked and held from below by the suction section through a hole section formed in the bottom of the pocket.
    Type: Application
    Filed: December 29, 2015
    Publication date: September 1, 2016
    Inventors: Ryota INOUE, Naoki AZUMA
  • Publication number: 20160255752
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Application
    Filed: December 29, 2015
    Publication date: September 1, 2016
    Inventors: Ryota Inoue, Naoki Azuma
  • Publication number: 20160240738
    Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 18, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Makoto ABE, Keisuke HIGASHITANI, Naoki AZUMA, Akiyoshi KINOUCHI
  • Publication number: 20160149085
    Abstract: A method of manufacturing a semiconductor light emitting element includes forming a semiconductor stacked layer body on a substrate, the semiconductor stacked layer body including a first semiconductor layer and a second semiconductor layer; removing a portion of the semiconductor stacked layer body and exposing the first semiconductor layer such that the second semiconductor layer includes an extending portion that extends in a plane direction; forming a conductor layer electrically connecting the first semiconductor layer and the extending portion of the second semiconductor layer; forming a first electrode electrically connected to the first semiconductor layer and a second electrode electrically connected to the second semiconductor layer; forming a protective film covering at least a portion of the first electrode and at least a portion of the second electrode; and after forming the protective film, removing a portion of the exposed portion of the extending portion.
    Type: Application
    Filed: November 20, 2015
    Publication date: May 26, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Kazuki KASHIMOTO, Masafumi ITASAKA, Hisashi KASAI, Naoki AZUMA
  • Publication number: 20160081243
    Abstract: In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.
    Type: Application
    Filed: November 25, 2015
    Publication date: March 17, 2016
    Inventors: Naoki AZUMA, Masayuki KUWABARA