Patents by Inventor Naoki Azuma

Naoki Azuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9227387
    Abstract: In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: January 5, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Naoki Azuma, Masayuki Kuwabara
  • Publication number: 20150349203
    Abstract: A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of ?10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 3, 2015
    Applicant: NICHIA CORPORATION
    Inventors: Tomohiro SHIMOOKA, Masahiko SANO, Naoki AZUMA
  • Publication number: 20150176779
    Abstract: In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 25, 2015
    Inventors: Naoki AZUMA, Masayuki KUWABARA
  • Patent number: 8823031
    Abstract: A semiconductor light emitting device includes a semiconductor structure, a transparent electrically-conducting layer, a dielectric film, and a metal reflecting layer. The semiconductor structure includes an active region. The transparent electrically-conducting layer is formed on the upper surface of the semiconductor structure. The dielectric film is formed on the upper surface of the transparent electrically-conducting layer. The metal reflecting layer is formed on the upper surface of the dielectric film. The dielectric film has at least one opening whereby partially exposing the transparent electrically-conducting layer. The transparent electrically-conducting layer is electrically connected to the metal reflecting layer through the opening. A barrier layer is partially formed and covers the opening so that the barrier layer is interposed between the transparent electrically-conducting layer and the metal reflecting layer.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: September 2, 2014
    Assignee: Nichia Corporation
    Inventors: Takeshi Kususe, Naoki Azuma, Toshiaki Ogawa, Hisashi Kasai
  • Publication number: 20140185299
    Abstract: Provided is a bandpass filter for a light emitting device that can improve the light emission efficiency in use for a light emitting device, and a light emitting device that can obtain the high light emission efficiency by using the bandpass filter. The light emitting device includes a substrate; a light emitting element disposed over the substrate; a phosphor-containing layer containing at least one kind of phosphor; and a bandpass filter disposed over a surface of the phosphor-containing layer on the light emitting element side, the bandpass filter including a multilayer film having a plurality of first and second dielectric layers, the second dielectric layer being disposed over the first dielectric layer.
    Type: Application
    Filed: December 24, 2013
    Publication date: July 3, 2014
    Applicant: NICHIA COPRORATION
    Inventors: Daisuke SANGA, Tomonori Morizumi, Naoki Azuma, Keisuke Sejiki, Kunihito Sugimoto
  • Publication number: 20130049053
    Abstract: A semiconductor light emitting device includes a semiconductor structure, a transparent electrically-conducting layer, a dielectric film, and a metal reflecting layer. The semiconductor structure includes an active region. The transparent electrically-conducting layer is formed on the upper surface of the semiconductor structure. The dielectric film is formed on the upper surface of the transparent electrically-conducting layer. The metal reflecting layer is formed on the upper surface of the dielectric film. The dielectric film has at least one opening whereby partially exposing the transparent electrically-conducting layer. The transparent electrically-conducting layer is electrically connected to the metal reflecting layer through the opening. A barrier layer is partially formed and covers the opening so that the barrier layer is interposed between the transparent electrically-conducting layer and the metal reflecting layer.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Applicant: NICHIA CORPORATION
    Inventors: Takeshi KUSUSE, Naoki Azuma, Toshiaki Ogawa, Hisashi Kasai
  • Patent number: 7964690
    Abstract: A methacrylic resin comprising 80 to 98.5 wt % of methyl methacrylate monomer unit and 1.5 to 20 wt % of at least one different vinyl monomer unit copolymerizable with methyl methacrylate, characterized in that the methacrylic resin has a weight average molecular weight measured by gel permeation chromatography (GPC) of 60,000 to 230,000 and comprises 7 to 30% of a component having a weight average molecular weight of ? or less of a peak weight average molecular weight (Mp) obtained from a GPC elution curve based on the methacrylic resin component.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: June 21, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Naoki Azuma, Kohei Okumura, Kazunori Kozawa
  • Publication number: 20110008875
    Abstract: The present invention provides a method of preparing frozen or lyophilized microbial cells which can inhibit damages or death of microbial cells and have high viabilities in freezing or lyophilizing process. A method of preparing frozen or lyophilized microbial cells having high viabilities, characterized by using a permeate which is obtained by filtering milk or whey with ultra-filtration (UF) membrane, as a protecting agent at the time of freezing or lyophilizing.
    Type: Application
    Filed: February 3, 2009
    Publication date: January 13, 2011
    Applicant: SNOW BRAND MILK PRODUCTS CO., LTD.
    Inventors: Naoki Azuma, Masayuki Watanabe, Hiroshi Ueno, Toshimitsu Yoshioka
  • Publication number: 20090239050
    Abstract: A methacrylic resin comprising 80 to 98.5 wt % of methyl methacrylate monomer unit and 1.5 to 20 wt % of at least one different vinyl monomer unit copolymerizable with methyl methacrylate, characterized in that the methacrylic resin has a weight average molecular weight measured by gel permeation chromatography (GPC) of 60,000 to 230,000 and comprises 7 to 30% of a component having a weight average molecular weight of ? or less of a peak weight average molecular weight (Mp) obtained from a GPC elution curve based on the methacrylic resin component.
    Type: Application
    Filed: November 17, 2006
    Publication date: September 24, 2009
    Applicant: Asahi Kasei Chemicals Corporation
    Inventors: Naoki Azuma, Kohei Okumura, Kazunori Kozawa
  • Patent number: 6625379
    Abstract: Disclosed is a light-conducting plate which comprises a transparent resin containing a carbonic acid gas and which has a carbonic acid gas content of from 0.01 to 2% by weight based on the weight of the light-conducting plate. The plate used in a planar light emitting device exhibits increased luminance, improved luminance uniformity, and reduced color unevenness. Also disclosed is a method of producing the light-conducting plate.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: September 23, 2003
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventor: Naoki Azuma