Abstract: A clip device includes a clip, including a plurality of arms having sliding grooves; and an intermediate member inserted into the sliding grooves for connecting the plurality of arms; a pressing tube accommodating a proximal end portion of the clip; a connection member connecting with an operation wire at a proximal end side and including an engaging portion engaging with the intermediate member; and a locking mechanism for lock the plurality of arms when the clip is pulled toward the proximal end side by a predetermined distance by the connection member, wherein the clip includes a contact portion formed on a side surface of the arm to be in contact with the engaging portion from a direction orthogonal to an axial direction of the intermediate portion for preventing a deformation of the engaging portion when the intermediate portion slides along the sliding groove before the plurality of arms are locked.

Abstract: A moving body includes: a plurality of wheels capable of rotating around a plurality of rotating shafts disposed on a circumference around a common axis; and a supporting unit supporting the plurality of rotating shafts to be capable of revolving around the axis. A first power source is connected to the plurality of wheels to be capable of transmitting power so as to rotate the plurality of wheels. A second power source is connected to the supporting unit to be capable of transmitting power so as to revolve the plurality of wheels.

Abstract: A clip device includes a tube and a clip having a first arm portion and a second arm portion, and an engagement mechanism including a stepped connector and a hooking structure, and configured to connect to the clip. The stepped connector includes an engaging region connecting two side regions, a width of the engaging region of the stepped connector is smaller than a width of a first of the two side regions of the stepped connector. The hooking structure includes two lateral surfaces connected by a hook surface, and a surface of the engaging region of the stepped connector engages with the hook surface of the hooking structure and each of the two side regions of the stepped connector are adjacent to respective one of the two lateral surfaces of the hooking structure.

Abstract: The present invention provides a clip system that is optimal for suture treatment of living tissue. The clip system includes a clip unit having a first arm and a second arm capable of opening and closing, a wire capable of opening and closing the clip, and a sheath through which the wire can be inserted. The clip unit includes a support portion that swingably supports the first arm and the second arm.

Abstract: A semiconductor device, including a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate, and a board placed over the disposition area with a solder therebetween. The solder has two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other.

Abstract: An electronic device includes a first part, and a circuit plate including a circuit substrate, a plating film made of a plating material and being disposed on a front surface of the substrate. The plating film includes a first part region on which the first part is disposed via a first solder, and a liquid-repellent region extending along a periphery side of the first part region in a surface layer of the plating film, and having a liquid repellency greater than a liquid repellency of the plating film. The liquid-repellent region includes a resist region. The plating film includes a remaining portion between the liquid-repellent region and the front surface of the circuit substrate in a thickness direction of the plating film orthogonal to the front surface. The remaining portion is made of the plating material and is free of the oxidized plating material.

Abstract: A metal base plate is rectangular in plan view, has a joining region set on a front surface, and has a center line, which is parallel to a pair of short sides that face each other, set in a middle interposed between the pair of short sides. A ceramic circuit board includes a ceramic board that is rectangular in plan view, a circuit pattern that is formed on a front surface of the ceramic board and has a semiconductor chip joined thereto, and a metal plate that is formed on a rear surface of the ceramic board and is joined to the joining region by solder. Here, the solder contains voids and is provided with a stress relieving region at one edge portion that is away from the center line. A density of voids included in the stress relieving region is higher than other regions of the solder.

Abstract: An additive manufacturing apparatus includes a powder layer forming portion, an energy beam source, and a contact detection sensor including a plate-like probe. The powder layer forming portion is configured to form a powder layer in a predetermined region. The energy beam source is configured to radiate an energy beam to the powder layer formed by the powder layer forming portion to fuse or sinter the powder layer so that a solidified layer is formed. Presence or absence of a projection portion on a surface of the solidified layer is detected by using the contact detection sensor.

Abstract: An endoscopic treatment device includes a clip unit having a first arm and a second arm connected with each other; a power transmission member; an applicator connected with the clip unit; an engaging portion provided in one of the proximal end portion or the power transmission member; and an engaged portion provided in the other of the proximal end portion or the power transmission member without the engaging portion, wherein the engaging portion includes a hook portion entering the engaged portion so as to be engageable with the engaged portion; a support portion continuing with the hook portion; and a protrusion portion having a dimension so as to be impossible to enter the engaged portion, and at least one of the hook portion and the support portion is deformed to release the engagement between the engaging portion and the engaged portion.

Abstract: A clip device includes a tube and a clip having a first arm portion and a second arm portion, and an engagement mechanism including a stepped connector and a hooking structure, and configured to connect to the clip. The stepped connector includes an engaging region connecting two side regions, a width of the engaging region of the stepped connector is smaller than a width of a first of the two side regions of the stepped connector. The hooking structure includes two lateral surfaces connected by a hook surface, and a surface of the engaging region of the stepped connector engages with the hook surface of the hooking structure and each of the two side regions of the stepped connector are adjacent to respective one of the two lateral surfaces of the hooking structure.

Abstract: A clip device includes a clip, including a plurality of arms having sliding grooves; and an intermediate member inserted into the sliding grooves for connecting the plurality of arms; a pressing tube accommodating a proximal end portion of the clip; a connection member connecting with an operation wire at a proximal end side and including an engaging portion engaging with the intermediate member; and a locking mechanism for lock the plurality of arms when the clip is pulled toward the proximal end side by a predetermined distance by the connection member, wherein the clip includes a contact portion formed on a side surface of the arm to be in contact with the engaging portion from a direction orthogonal to an axial direction of the intermediate portion for preventing a deformation of the engaging portion when the intermediate portion slides along the sliding groove before the plurality of arms are locked.

Abstract: A semiconductor device includes an insulating circuit substrate including an insulating plate, a first metal layer formed on a top surface of the insulating plate, and a second metal layer formed on a bottom surface of the insulating plate, a heatsink on whose top surface the insulating circuit substrate is disposed; semiconductor elements disposed on the top surface of the first metal layer through a bonding material, and a case that encloses a perimeter of the insulating circuit substrate and the semiconductor elements. The first metal layer includes circuit patterns electrically connected to the semiconductor elements and an annular pattern formed to enclose the perimeter of the circuit patterns with a gap provided with respect to the circuit patterns. The second metal layer is disposed at a spot that surfaces the annular pattern. The housing is affixed to the annular pattern through an adhesive.

Abstract: A medical device includes a clip having an arm member and a pressing tube configured to receive the arm member; an applicator having an operation wire configured to advance and retract to open and close the arm member and a sheath configured to accommodate the operation wire; and a link configured to engage the operation wire with the clip and transition between an engagement configuration in which the clip and the operation wire is engaged with each other and a release configuration in which the engagement of the clip and the operation wire is released.

Abstract: In a semiconductor device including a plurality of memory regions formed of split-gate type MONOS memories, threshold voltages of memory cells are set to different values for each memory region. Memory cells having different threshold voltages are formed by forming a metal film, which is a work function film constituting a memory gate electrode of a memory cell in a data region, and a metal film, which is a work function film constituting a memory gate electrode of a memory cell in a code region, of different materials or different thicknesses.

Abstract: Provided is an endoscope clip and an operation method for a clip. The clip includes a clip arm that is configured to be transitioned between a first, second and third configurations. The clip includes a slider to operate the clip arm to be transitioned between the configurations, and a limiter configured to restrict movement of the slider so as to restrict the transition of the clip arm from one configuration to another of the configurations.

Abstract: An electronic device includes a first part, and a circuit plate including a circuit substrate, a plating film made of a plating material and being disposed on a front surface of the substrate. The plating film includes a first part region on which the first part is disposed via a first solder, and a liquid-repellent region extending along a periphery side of the first part region in a surface layer of the plating film, and having a liquid repellency greater than a liquid repellency of the plating film. The liquid-repellent region includes a resist region. The plating film includes a remaining portion between the liquid-repellent region and the front surface of the circuit substrate in a thickness direction of the plating film orthogonal to the front surface. The remaining portion is made of the plating material and is free of the oxidized plating material.

Abstract: A treatment device has an arm member having a plurality of arms to have an open state and a closed state; a wire having a distal end connected to the arm member and the distal end is attachable and detachable to the arm member; a sheath through which the wire is inserted; an operator connected to a proximal end of the sheath; a slider connected to the wire and attached to the operator to be slidable toward a distal end or a proximal end of the operator, wherein the slider makes the plurality of arms to be in the closed state when the slider is disposed in a first range, and the slider makes the plurality of arms to be in the open state when the slider is disposed in a second range; and a slider restriction mechanism provided between the distal end of the operator and the slider.

Abstract: After the step of polishing, a part of each of each gate electrode is removed such that the upper surface of each gate electrode is located closer than the damaged region formed in the gate insulating film located between the gate electrodes to the main surface of the semiconductor substrate in cross-section view. Thus, it is possible to suppress the occurrence of a short-circuit defect during the operation of the semiconductor device.

Abstract: A semiconductor device, including a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate, and a board placed over the disposition area with a solder therebetween. The solder has two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other.

Abstract: After the step of polishing, a part of each of each gate electrode is removed such that the upper surface of each gate electrode is located closer than the damaged region formed in the gate insulating film located between the gate electrodes to the main surface of the semiconductor substrate in cross-section view. Thus, it is possible to suppress the occurrence of a short-circuit defect during the operation of the semiconductor device.