Abstract: An image processing apparatus is provided with a converter to convert a first color image into lightness information and color information other than the lightness information, a lightness compressor to generate compressed lightness information obtained by decimating a pixel value from the lightness information, a reconverter to combine the compressed lightness information and the color information to generate a second color image, an edge extractor to extract an edge included in the first color image, and a pixel value changer to change a pixel value at a position of the edge in the second color image while maintaining similar colors, to generate a third color image.

Abstract: A semiconductor device includes an insulating circuit substrate including an insulating plate, a first metal layer formed on a top surface of the insulating plate, and a second metal layer formed on a bottom surface of the insulating plate, a heatsink on whose top surface the insulating circuit substrate is disposed; semiconductor elements disposed on the top surface of the first metal layer through a bonding material, and a case that encloses a perimeter of the insulating circuit substrate and the semiconductor elements. The first metal layer includes circuit patterns electrically connected to the semiconductor elements and an annular pattern formed to enclose the perimeter of the circuit patterns with a gap provided with respect to the circuit patterns. The second metal layer is disposed at a spot that surfaces the annular pattern. The housing is affixed to the annular pattern through an adhesive.

Abstract: It is to optimize the initial threshold voltages of each memory area in a semiconductor memory device including a plurality of memory areas. A semiconductor memory device according to the embodiment includes a first memory area for storing data and a second memory area for storing the information related to the first memory area. In the respective memory cells arranged in the first and the second memory areas, the initial threshold voltages of the memory cells arranged in the second memory area are designed to be higher than those of the memory cells arranged in the first memory area.

Abstract: There is provided a liquid supply apparatus eliminating the need for a power supply, having relatively light weight and small footprint, and ensuring a stable liquid supply. The liquid supply apparatus includes a first support member, a second support member, a balloon having one end supported by the first support member and the other end supported by the second support member, and a casing having a constant longitudinal length. The balloon is disposed in the casing and is configured so as to be able to hold a liquid therein and discharge the liquid therefrom. When the balloon holds the liquid, the one end and the other end of the balloon are positioned in the case.

Abstract: An additive manufacturing apparatus includes a powder layer forming portion, an energy beam source, and a contact detection sensor including a plate-like probe. The powder layer forming portion is configured to form a powder layer in a predetermined region. The energy beam source is configured to radiate an energy beam to the powder layer formed by the powder layer forming portion to fuse or sinter the powder layer so that a solidified layer is formed. Presence or absence of a projection portion on a surface of the solidified layer is detected by using the contact detection sensor.

Abstract: In a semiconductor device including a plurality of memory regions formed of split-gate type MONOS memories, threshold voltages of memory cells are set to different values for each memory region. Memory cells having different threshold voltages are formed by forming a metal film, which is a work function film constituting a memory gate electrode of a memory cell in a data region, and a metal film, which is a work function film constituting a memory gate electrode of a memory cell in a code region, of different materials or different thicknesses.

Abstract: It is to optimize the initial threshold voltages of each memory area in a semiconductor memory device including a plurality of memory areas. A semiconductor memory device according to the embodiment includes a first memory area for storing data and a second memory area for storing the information related to the first memory area. In the respective memory cells arranged in the first and the second memory areas, the initial threshold voltages of the memory cells arranged in the second memory area are designed to be higher than those of the memory cells arranged in the first memory area.

Abstract: An image processing apparatus 100 is provided with a converter 102 to convert a first color image into lightness information and color information other than the lightness information, a lightness compressor 104 to generate compressed lightness information obtained by decimating a pixel value from the lightness information, a reconverter 106 to combine the compressed lightness information and the color information to generate a second color image, an edge extractor 108 to extract an edge included in the first color image, and a pixel value changer 110 to change a pixel value at a position of the edge in the second color image while maintaining similar colors, to generate a third color image.

Abstract: A nozzle-clogging determining device is provided for detecting nozzle clogging without causing an increase in the cost. A nozzle-clogging determining device is configured to detect pass of droplets ejected from a plurality of nozzles of a head of an inkjet printer, and includes a droplet detector and a determination controller. The droplet detector includes a light emitter configured to emit detection light for detecting pass of droplets in a direction intersecting with a traveling direction of droplets, and a light receiver configured to receive the detection light. The determination controller consecutively ejects a plurality of droplets from each nozzle of the head at equal intervals, and has a threshold for performing determination on nozzle clogging on the basis of a light interception rate of the detection light which the light receiver receives when droplets are positioned inside a spot of the detection light which the light receiver receives.

Abstract: In order to restrict cracking or the like in a connection member such as solder, provided is a semiconductor device including a first component; a second component that is arranged on a front surface of the first component; and a connection portion that is provided between the first component and the second component and connects the second component to the first component. A first groove and a second groove having different shapes are formed in the front surface of the first component at positions opposite a first corner and a second corner of the second component, and the connection portion is also formed within the first groove and the second groove.

Abstract: When a roughened pattern is formed on an image protection layer, a thermal transfer sheet is protected from being damaged or broken. A thermal head 18 is driven and controlled such that an image protection layer 15e of a thermal transfer sheet 15 is thermally transferred to a printing medium 14, and that a roughened pattern 40 is formed on the image protection layer 15e. The roughened pattern 40 is made based on a corrected pattern 40B that is obtained by correcting a basic pattern 40A that is a pattern including an island portion formed of a mass of a plurality of high-energy pixels 40a, such that the high-energy pixel 40a surrounded by the high-energy pixels 40a forming an edge area of the island portion is converted to a low-energy pixel 40b.

Abstract: There is provided a liquid supply apparatus eliminating the need for a power supply, having relatively light weight and small footprint, and ensuring a stable liquid supply. The liquid supply apparatus includes a first support member, a second support member, a balloon having one end supported by the first support member and the other end supported by the second support member, and a casing having a constant longitudinal length. The balloon is disposed in the casing and is configured so as to be able to hold a liquid therein and discharge the liquid therefrom. When the balloon holds the liquid, the one end and the other end of the balloon are positioned in the case.

Abstract: A semiconductor device includes an external lead-out terminal having an external terminal and an internal terminal connected to a connecting portion of the external terminal. By forming a resin fixed portion linked to a horizontal resin portion in the vicinity of a leading end of the internal terminal, a gap under the internal terminal when cutting the terminal coupling portion off from the internal terminal can be restricted.

Abstract: A semiconductor device includes a cooling plate made of metal, one or more laminated substrates each formed by laminating a circuit board, an insulating board, and a metal board, and one or more first semiconductor elements each made of a wide-band-gap semiconductor and disposed over outer peripheral edge portions of the circuit board. The metal board and the cooling plate are joined by the use of a joining material. As a result, even if temperature rises due to the operation of the one or more first semiconductor elements and heat radiation is not performed properly, the one or more first semiconductor elements operate stably.

Abstract: In order to restrict cracking or the like in a connection member such as solder, provided is a semiconductor device including a first component; a second component that is arranged on a front surface of the first component; and a connection portion that is provided between the first component and the second component and connects the second component to the first component. A first groove and a second groove having different shapes are formed in the front surface of the first component at positions opposite a first corner and a second corner of the second component, and the connection portion is also formed within the first groove and the second groove.

Abstract: A nozzle-clogging determining device is provided for detecting nozzle clogging without causing an increase in the cost. A nozzle-clogging determining device is configured to detect pass of droplets ejected from a plurality of nozzles of a head of an inkjet printer, and includes a droplet detector and a determination controller. The droplet detector includes a light emitter configured to emit detection light for detecting pass of droplets in a direction intersecting with a traveling direction of droplets, and a light receiver configured to receive the detection light. The determination controller consecutively ejects a plurality of droplets from each nozzle of the head at equal intervals, and has a threshold for performing determination on nozzle clogging on the basis of a light interception rate of the detection light which the light receiver receives when droplets are positioned inside a spot of the detection light which the light receiver receives.

Abstract: A semiconductor device includes a laminated substrate having circuit boards, an insulating plate, and a metal plate laminated, and warped convexly to the circuit board side; semiconductor chips fixed to the corresponding circuit boards; a base plate having a predetermined disposition region in which the laminated substrate is disposed, grooves disposed in the outer periphery of the disposition region, and projections disposed in positions in the disposition region adjacent to and inside the grooves. The grooves has on the projection side an inclination corresponding to an inclination caused by the warp of the laminated substrate. A joining material fills the space between the metal plate and the disposition region and covers the grooves and projections.

Abstract: A semiconductor device includes a cooling plate made of metal, one or more laminated substrates each formed by laminating a circuit board, an insulating board, and a metal board, and one or more first semiconductor elements each made of a wide-band-gap semiconductor and disposed over outer peripheral edge portions of the circuit board. The metal board and the cooling plate are joined by the use of a joining material. As a result, even if temperature rises due to the operation of the one or more first semiconductor elements and heat radiation is not performed properly, the one or more first semiconductor elements operate stably.

Abstract: A semiconductor device includes a laminated substrate having circuit boards, an insulating plate, and a metal plate laminated, and warped convexly to the circuit board side; semiconductor chips fixed to the corresponding circuit boards; a base plate having a predetermined disposition region in which the laminated substrate is disposed, grooves disposed in the outer periphery of the disposition region, and projections disposed in positions in the disposition region adjacent to and inside the grooves. The grooves has on the projection side an inclination corresponding to an inclination caused by the warp of the laminated substrate. A joining material fills the space between the metal plate and the disposition region and covers the grooves and projections.

Abstract: A semiconductor device includes an external lead-out terminal having an external terminal and an internal terminal connected to a connecting portion of the external terminal. By forming a resin fixed portion linked to a horizontal resin portion in the vicinity of a leading end of the internal terminal, a gap under the internal terminal when cutting the terminal coupling portion off from the internal terminal can be restricted.