Abstract: Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less.

Abstract: According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.

Abstract: There are provided a metal particulate spraying step to spray metal particulates over a substrate having an insulating pattern formed of thermosetting resin, a heating step to heat and dissolve the resin pattern and fix the metal particulates on the resin pattern, and a metal particulate eliminating step to eliminate metal particulates attached on the surface of the substrate excluding the resin pattern.

Abstract: According to one mode of the present invention, a method of producing an electronic circuit, comprising forming an integrated resin layer having a prescribed thickness by repeating a resin layer forming process a number of times so that resin layers are layered to be integrated with all the resin layers on a substrate, wherein the resin forming process comprises charging the surface of a photoconductor; forming an electrostatic latent image having a prescribed pattern on the surface of the charged photoconductor; forming a visible image by electrostatically attaching charged particles composed of resin on the surface of the photoconductor on which the electrostatic latent image is formed; transferring the visible image formed on the surface of the photoconductor and composed of the charged particles onto the substrate; and fixing said visible image transferred onto said substrate on said substrate to form the resin layer on said substrate, is provided.

Abstract: A wiring board formed by an electrophotographic system of transferring a visible image to a substrate, the wiring board including: a substrate to which a visible image is transferred; a nonconductive metal-containing resin layer selectively formed on the substrate and containing metal particulates dispersed therein; a conductive conductor metal layer formed on the metal-containing resin layer; and a resin layer formed contiguously to the metal-containing resin layer on the substrate.

Abstract: According to one aspect of the invention, a contact sheet for testing electronic parts, comprising an insulating porous layer; and a connection electrode which is disposed on the insulating porous layer and electrically connect the electrode or terminal of the electronic parts and the terminal of a test apparatus; wherein the connection electrode is embedded below at least one main surface of the insulating porous layer.

Abstract: A percolation sheet 1 is constituted of a laminated sheet comprising a long-fiber nonwoven fabric 2 with a basis weight of 5 to 30 g/m2, at least a portion of which is formed from synthetic fibers of a high-melting-point resin, and a short-fiber nonwoven fabric 3 with a weight of 3 to 15 g/m2, at least a portion of which is formed from synthetic fibers of a low-melting-point resin. The short-fiber nonwoven fabric 3 is formed from a nonwoven fabric in which fibers with a fiber length of 3 to 15 mm are randomly dispersed and deposited using a dry process, and these fibers are thermally bonded to each other. In a diagram illustrating the relationship between the pore size of the voids in the percolation sheet and the distribution rate thereof, the distribution rate of the maximum peak is ten times or more of the distribution rate of the other peaks.

Abstract: A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.

Abstract: A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer.

Abstract: An electronic device module comprises a wiring substrate having an insulating substrate with a porous structure including continuous pores and wiring conductors selectively formed in the porous structure; and an electronic device directly connected to said wiring conductors formed in the porous structure.

Abstract: An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

Abstract: According to a fabricating method of the present invention, a cap shaped cover plate having a concaved portion on the inner surface is mounted on the rear surface of a semiconductor chip. After solder bumps are formed on a connecting pad of a wiring substrate, a fluid resin layer is formed on the bump formed surface. Thereafter, the semiconductor chip with the cover plate adhered is mounted with a face down on the resin layer formed surface of the wiring substrate. The solder bumps on the chip side and the solder bumps on the substrate side are contacted. At that time, the peripheral portion of the cover plate is contacted and adhered to the wiring substrate. Thereafter, while the bumps on the chip side and the bumps on the substrate side are being heated, melted, and connected, the fluid resin layer on the wiring substrate is hardened. Thus, the space between the semiconductor chip and the wiring substrate (namely, the height of the bumps) is controlled to a predetermined value.

Abstract: Fungicidally active sulfonyl azoles of the formula ##STR1## in which X represents hydrogen, alkyl, halogen, alkoxy or aryl,Y represents hydrogen, alkyl, halogen, nitro or alkoxy,Z represents hydrogen, alkyl, halogen or alkoxy, orY and Z may together represent an optionally substituted cyclic ring which can contain hetero atoms andQ represents a radical of the formula ##STR2## in which A represents a -N.dbd. radical or a ##STR3## radical, R.sup.1 represents hydrogen, alkyl or aryl, andR.sup.2 and R.sup.3 each represent hydrogen, alkyl, halogen or nitro with the proviso that R.sup.1, R.sup.2 and R.sup.3 may all simultaneously be hydrogen only if Y and Z together represent an optionally substituted ring, orQ represents 1H-benzotriazol-1-yl radical or 1H-tetrazol-1-yl radical.

Abstract: Novel benzoxazines of the formula (I) ##STR1## wherein X is hydrogen or halogen,R.sup.1 is hydrogen or C.sub.1 -C.sub.2 -alkyl,R.sup.2 is cyano, trimethylsilyl, trimethylsilylmethoxycarbonyl, C.sub.1 -C.sub.4 -alkylthio or cyclopropyl andQ is ##STR2## and the use of the novel compounds as herbicides, and intermediates for the preparation of the novel benzoxazines.

Abstract: Novel dialkylmaleimides of the formula (I) ##STR1## and the use of the novel compounds as herbicides.

Abstract: Novel substituted phenylsulfonylazoles of the formula (I) ##STR1## wherein X represents N or a CH-group,R represents halogen, lower alkyl, lower alkoxy, trifluoromethyl, nitrol, optionally halogeno-substituted phenyl or cycloalkyl, andn represents 2 or 3, and furthermore, in case that R is not a methyl group, also represents 1,and the use of the new compounds as agricultural and horticultural fungicides.

Abstract: Plant growth-regulating and fungicidally active triazolo-(3,2-c)perhydroxazin-8-ones of the formula ##STR1## in which R.sup.1 represents a hydrogen atom,R.sup.2 represents a hydrogen atom a phenoxy group substituted by a halogen atom or a phenyl group, or a benyl group substituted by a halogen atom, or R.sup.1, together with R.sup.2, may form a halogen-substituted benzylidene group or a cyclohexyl-methylidene group, andR.sup.3 represents a tert-butyl group or a phenyl group substituted by a halogen atom.

Abstract: 2-Pyridyloxyacetanilides of the formula ##STR1## in which X is hydrogen, C.sub.1 -C.sub.4 alkyl or C.sub.1 -C.sub.4 halogenoalkyl,Y each independently is halogen, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy or C.sub.1 -C.sub.4 halogenoalkyl, andn is 0, 1, 2 or 3which possess herbicidal and plant-growth regulating activity.

Abstract: 2-Pyridyloxyacetanilides of the formula ##STR1## in which X is hydrogen, halogen, C.sub.1 -C.sub.4 alkyl or C.sub.1 -C.sub.4 halogenoalkyl,R is C.sub.1 -C.sub.4 alkyl,Y each independently is halogen, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy or C.sub.1 -C.sub.4 halogenoalkyl, andn is 0, 1, 2 or 3which possess herbicidal and plant-growth regulating activity.