Abstract: An exposure method provided is a high-resolution and inexpensive method suitable for use in formation of a fine pattern for making up an electronic device. A diffraction grating is located in proximity to a wafer or the like for making up an electronic device, and illumination light with a predetermined incidence angle property is applied onto the diffraction grating to effect exposure on the wafer. The exposure is done while changing a positional relation between the semiconductor wafer and the diffraction grating according to need.

Abstract: An exposure apparatus for exposing a bright-dark pattern on a substrate via a projection optical system includes a position detection system which detects a plurality of predetermined positions in a unit exposure field of the substrate. A plurality of reference detection positions fall within a range substantially equal to the unit exposure field. A deformation calculation unit calculates a state of deformation in the unit exposure field based on the detection result of the position detection system. A shape modification unit modifies a shape of the bright-dark pattern to be exposed on the substrate based on the deformation state calculated by the deformation calculation unit.

Abstract: An exposure method enabling deformation occurring in a unit exposure field to be measured rapidly and accurately and enabling a plurality of patterns to be superimposed on a substrate with high accuracy. The exposure method of the present embodiment for exposing a bright-dark pattern on the substrate using a projection optical system includes a position detection process for detecting the positions of a plurality of position detection marks, relative to a substrate-in-plane-direction of the substrate, arranged in at least one functional element in a unit exposure field of the substrate, a deformation calculation process for calculating the state of deformation occurring in the unit exposure field based on information related to the positions of the position detection marks obtained in the position detection process, and a shape modification process for modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation process.

Abstract: An object is to provide a high-resolution and economical exposure method suitable for use in formation of a fine pattern for making up an electronic device. Two diffraction gratings (P1, P2) are located in series in an optical path; the two diffraction gratings (P1, P2) and a wafer or the like (W) for making up an electronic device are arranged with a predetermined spacing; a light-dark pattern of interference fringes generated by the diffraction gratings (P1, P2) is transferred onto the wafer or the like (W) to effect exposure. The exposure is done while changing a positional relation between the wafer or the like (W) and the diffraction gratings (P1, P2) according to need.

Abstract: An exposure method facilitating the formation of a fine pattern on a plate. The exposure method illuminates a mask with illumination light and exposes a plate using a mask pattern of the mask. The method includes scanning the plate relative to the mask in a scanning direction, which is an in-plane direction of the plate, and exposing the plate while scanning the plate relative to the mask. The exposing of the plate while scanning the plate relative to the mask includes performing fine period exposure with a fine period mask pattern formed in a first region of the mask and middle density exposure with a middle density mask pattern formed in a second region of the mask. The first region and the second region are arranged adjacent to each other in the scanning direction.

Abstract: An exposure method for exposing a bright-dark pattern onto each exposure region of a substrate via a projection optical system includes a position detection process for detecting positions of a plurality of microscopic regions in a unit exposure field of the substrate, a deformation calculation step of calculating a state of deformation in the unit exposure field based on information related to the positions of the plurality of microscopic regions obtained in the position detection step, and a shape modification step of modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation step. The microscopic regions detected in the position detection step include a circuit pattern formed in the unit exposure field.

Abstract: A method for processing data for a mask pattern. The method includes analyzing data of the mask pattern and specifying a pattern region having a predetermined shape and a predetermined dimension from the mask pattern. The pattern region functions as an alignment mark.

Abstract: A method of manufacturing a display device permits use of a high-performance and flexible substrate, without need for a high-temperature process. In a manufacturing method of an active matrix type display device having a plurality of display elements arrayed two-dimensionally, materials (SR0-SR4) of active elements are not formed by direct deposition or the like on a substrate (PL1) forming display elements, but the active elements are formed by separately forming materials of a semiconductor or the like and distributing them on the substrate. The active element materials distributed at locations except for desired locations are subjected to a process of substantially removing electrical continuity thereof so as to prevent undesired electrical continuity.

Abstract: An exposure method and exposure apparatus optimal for the formation of a fine pattern of an electronic device, such as a flat panel display. The exposure method and apparatus provides a high resolution and is inexpensive. The exposure method exposes a pattern onto a substrate with the use of an optical system that performs interference exposure for exposing a pattern parallel to a predetermined scanning direction with an interference optical system and variable shaping exposure with a variable shaping optical system while performing relative scanning in the scanning direction.

Abstract: A catadioptric optical system forms an image of a first surface onto a second surface. The system includes a first lens having a first optical axis, a combination of a concave mirror and a second lens, the combination having a second optical axis, a third lens having a third optical axis, a first reflection plane that is arranged in an optical path between the first lens and the combination, and a second reflection plane that is arranged in an optical path between the combination and the third lens. An intersection line of an extension plane of the first reflection plane and an extension plane of the second reflection plane is set up so that the first optical axis, the second optical axis and the third optical axis intersect at one point. In addition, at least one of the first lens and the third lens is movable.

Abstract: A projection exposure apparatus includes a projection optical system, which is arranged in an optical path between a first surface and a second surface, projects a pattern on a negative plate arranged on the first surface onto a workpiece arranged on the second surface and exposes the pattern thereon. The projection optical system includes a first imaging optical subsystem having a dioptric imaging optical system; a second imaging optical subsystem having a concave reflecting system; a third imaging optical subsystem having a dioptric imaging optical system; a first folding mirror arranged in an optical path between the first imaging optical subsystem and the second imaging optical subsystem; and a second folding mirror arranged in an optical path between the second imaging optical subsystem and the third imaging optical subsystem. The first imaging optical subsystem forms a first intermediate image and the second imaging optical subsystem forms a second intermediate image.

Abstract: A catadioptric optical system forms an image of a first surface onto a second surface. The system includes a first lens having a first optical axis, a combination of a concave mirror and a second lens, the combination having a second optical axis, a third lens having a third optical axis, a first reflection plane that is arranged in an optical path between the first lens and the combination, and a second reflection plane that is arranged in an optical path between the combination and the third lens. An intersection line of an extension plane of the first reflection plane and an extension plane of the second reflection plane is set up so that the first optical axis, the second optical axis and the third optical axis intersect at one point. In addition, at least one of the first lens and the third lens is movable.

Abstract: An illumination optical apparatus, used in a projection exposure apparatus for projecting and exposing a pattern arranged in a first plane to a second plane, for supplying the first surface with illumination light from a light source comprises an optical path combiner arranged in an optical path between the light source and the first surface, for combining a plurality of light beams different from each other from the light source such that the first and second light beams illuminate the first surface closely to each other. The optical path combiner includes a discrete point positioned on or near a third surface optically conjugate with the first surface. The plurality of light beams travel by way of a plurality of regions sectioned by the discrete point, respectively.

Abstract: A method of manufacturing a display device permits use of a high-performance and flexible substrate, without need for a high-temperature process. In a manufacturing method of an active matrix type display device having a plurality of display elements arrayed two-dimensionally, materials (SR0-SR4) of active elements are not formed by direct deposition or the like on a substrate (PL1) forming display elements, but the active elements are formed by separately forming materials of a semiconductor or the like and distributing them on the substrate. The active element materials distributed at locations except for desired locations are subjected to a process of substantially removing electrical continuity thereof so as to prevent undesired electrical continuity.

Abstract: An exposure apparatus and method in which a mark on an object is illuminated, and plural pairs of two diffractive beams of same order are generated and directed to different reference gratings to detect positional information of the mark. Beams received from the different reference gratings have different order.

Abstract: An illumination optical apparatus and projection exposure apparatus capable of reducing a light quantity loss when a mask is illuminated with a polarized illumination light. An illumination optical system for illuminating a reticle with an illumination light and a projection optical system for projecting the pattern image of the reticle onto a wafer are provided. An illumination light emitted from an exposure light source in a linearly polarized state in the illumination optical system passes through first and second birefringent members having different fast axis directions and is converted into a polarized state that is substantially linearly polarized in a circumferential direction with the optical axis as the center in an almost specific annular area, and them illuminates the reticle under an annular illuminating condition after passing through a fly-eye lens.

Abstract: In an exposure apparatus and method, an object is exposed through a projection optical system with an exposure beam irradiated on a mask. An illumination system illuminates a mark on the object and a detecting system detects the illuminated mark. Various illumination and exposure wavelengths are used. The mark is moved relative to illumination beams to enable determining positional information of the mark.

Abstract: In a barrel of an optical unit a ring shaped support member is integrally arranged, and three projected portions are arranged on the upper surface of the support member. The projected portions support a lower surface of a parallel flat plate supported in direct contact. In this supported state, the parallel flat plate opposes a surface of the support member with a clearance of several ?m in between. With this arrangement, the space in one side of the parallel flat plate is substantially isolated from the space in the other side. Accordingly, for example, even if gas environment in the space on one side of the parallel flat plate is different from the other side, gases can be effectively kept from mixing. In addition, since the parallel flat plate is supported at three coplanar points, deformation of the parallel flat plate can be suppressed due to the force supporting the parallel flat plate, thereby suppressing the index of refraction from varying.

Abstract: An exposure apparatus able to maintain reflectances of mirrors and transmittances of lenses and to maintain initial performance over a long period by using exposure light of a wavelength of the vacuum ultraviolet region to illuminate a mask and transfer images of patterns on the mask to a substrate, provided with a gas feed unit for supplying a light path space through which the exposure light passes with a gas mainly comprised of an inert gas or rare gas and introducing a predetermined concentration of hydrogen into the gas fed to at least part of the light path space.

Abstract: An exposure apparatus and method to expose an object with an illumination beam irradiated on a mask from a light source disposes an optical unit between the light source and an optical integrator of an illumination optical system to illuminate the mask with an illumination beam, of which an intensity distribution on a Fourier transform plane with respect to a pattern on the mask has an increased intensity portion apart from the optical axis relative to a portion of the intensity distribution on the optical axis.