Abstract: An optical system attains good optical performance without substantially receiving the effects of birefringence even when using an optical material having intrinsic birefringence. An optical system that includes at least one radiation transmissive member that transmits light having a wavelength of 200 nm or less has an optical axis that substantially coincides with a crystal axis [100] or a crystal axis optically equivalent to the crystal axis [100].

Abstract: An optical system assures excellent optical performance with substantially no effect of birefringence, even when a birefringent crystal material such as fluorite is used. An optical system includes a plurality of crystal optical elements which are formed with crystals belonging to a cubic system. The optical system includes crystal optical elements with a first crystal axis coinciding with the optical axis and crystal optical elements with a second crystal axis, differing from the first crystal axis, coinciding with the optical axis.

Abstract: A projection exposure apparatus includes a projection optical system, which is arranged in an optical path between a first surface and a second surface, projects a pattern on a negative plate arranged on the first surface onto a workpiece arranged on the second surface and exposes the pattern thereon. The projection optical system includes a first imaging optical subsystem having a dioptric imaging optical system; a second imaging optical subsystem having a concave reflecting system; a third imaging optical subsystem having a dioptric imaging optical system; a first folding mirror arranged in an optical path between the first imaging optical subsystem and the second imaging optical subsystem; and a second folding mirror arranged in an optical path between the second imaging optical subsystem and the third imaging optical subsystem.

Abstract: An optical system attains good optical performance in effect without receiving the effects of birefringence even when using a birefringent crystal material such as fluorite The optical system is provided with a first lens group having a plurality of crystal lenses in which the optical axis and the crystal axis [111] are made to coincide, and a second lens group comprising a plurality of crystal lenses in which the optical axis and the crystal axis [100] are made to coincide. The first lens group has a first A lens group and a first B lens group that have a positional relationship rotated by a first angle relative to each other, and the second lens group has a second lens A group and a second lens B group that have a positional relationship rotated by a second angle relative to each other.

Abstract: A projection exposure apparatus consists of: an illumination-optical system, including a light source, for irradiating a mask; a projection optical system for projecting a hyperfine pattern image on a substrate; an optical integrator for illuminating the mask in a homogeneous illuminance distribution; and a luminous flux distributing member for distributing the luminous fluxes from the integrator into two luminous fluxes in two different directions for focusing intensity distributions over the Fourier transform surface or the surface in the vicinity thereof on two portions part from the optical axis of the illumination optical system.

Abstract: A photomask producing method according to the present invention segments a parent pattern which is an &agr;-magnification of an original pattern which is a &bgr;-magnification of a circuit pattern into &agr; lengthwise and breadthwise, thereby forming parent patterns on data. The parent patterns are written on a substrate at equal magnification by using an electron beam lithography system, thereby producing master reticles. Reduced images of the parent patterns of the master reticles are transferred on a substrate while performing screen linking, thereby producing working reticle. This photomask producing method can form an original pattern with a high precision and in a short period of time.

Abstract: A projection exposure apparatus including an irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing

Abstract: A projection exposure apparatus consists of: an illumination optical system, including a light source, for irradiating a mask; a projection optical system for projecting a hyperfine pattern image on a substrate; an optical integrator for illuminating the mask in a homogeneous illuminance distribution; and a luminous flux distributing member for distributing the luminous fluxes from the integrator into two luminous fluxes in two different directions for focusing intensity distributions over the Fourier transform surface or the surface in the vicinity thereof on two portions part from the optical axis of the illumination optical system.

Abstract: Illuminating light at a pupil plane of an illumination optical system for illuminating a position detection mark on a substrate is limited to an annular area centered at an optical axis, and a member substantially blocks an image-forming light beam distributed over an area on a pupil plane of an image-forming optical system for forming an image of the position detection mark on an imaging device by receiving light generated from the mark, the area being in image-forming relation to the annular area on the pupil plane of the illumination optical system. Alternatively, a member gives a phase difference of approximately &pgr;/2 [rad] between the image-forming light beam distributed over the area which is in image-forming relation to the annular area on the pupil lane of the illumination optical system and the image-forming light beam distributed over the area other than that area.

Abstract: In projection exposure of isolated pattern such as a contact hole, in order to increase the depth of focus a coherence reducing member is disposed on a Fourier transform plane in an image-forming optical path between a mask and a sensitized base, so that coherence is reduced between image-forming beams respectively passing through a plurality of different, concentric regions around the optical axis of the projection optical system on the Fourier transform plane. The coherence reducing member may be a polarization state control member for making a difference in polarization state, a member for making a difference in optical path length, or space filters with different shapes.

Abstract: A projection exposure apparatus including an irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing

Abstract: A projection exposure apparatus including an irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing

Abstract: A projection exposure apparatus including an Irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing

Abstract: A projection exposure apparatus consists of: an illumination optical system, including a light source, for irradiating a mask; a projection optical system for projecting a hyperfine pattern image on a substrate; an optical integrator for illuminating the mask in a homogeneous illuminance distribution; and a luminous flux distributing member for distributing the luminous fluxes from the integrator into two luminous fluxes in two different directions for focusing intensity distributions over the Fourier transform surface or the surface in the vicinity thereof on two portions part from the optical axis of the illumination optical system.

Abstract: A mark for position detection formed on a substrate has a first pattern disposed near the center of the mark and having periodicity in a Y-axis direction, and second patterns respectively disposed near both sides of the first pattern in an X-axis direction and each having periodicity in the X-axis direction. The position of the first pattern is detected by aligning the detection center of a detecting optical system, that is, the minimal aberration point of the detecting optical system, with the center of the first pattern. The positions of the second patterns are detected at respective points symmetric with respect to the minimal aberration point, and the detected values for the positions of the second patterns are averaged. An apparatus for detecting the mark for position detection detects the first and second patterns by image processing when the mark is in a stationary state.

Abstract: A body of the exposure device including a lighting optical system 2 through a wafer stage 8 is contained in a constant temperature room 100 of a chamber 1. A gas A2 whose temperature has risen by the heat generated by the body of the exposure device is supplied from the constant temperature room 100 to the fluid supply device 11 mounted on the floor below the floor of the chamber 1 through the exhaust duct 17. The temperature of the gas A2 is then adjusted at a predetermined temperature, and the gas is supplied to the blow duct 16. The supplied gas A4 is led into the temperature control room 23 mounted on the ceiling of the chamber, and a Peltier element 18 inside the temperature control room 23 correctly adjusts the temperature into a target temperature. Thus, a gas A5 set at a constant temperature is blown into the constant temperature room 100 through a dust filter 21 in a filter room 22b.

Abstract: An exposure substrate includes a position detection mark having a recessed or projecting portion formed on the substrate with a difference h in depth.

Abstract: A method and apparatus for exposing an image of a pattern formed in a mask onto a sensitive substrate. The mask is irradiated with an irradiation light. Data is computed relating to the thermal expansion saturation point of the mask due to absorption of the irradiation light. The mask is expanded to the thermal expansion saturation point based on the computed data, and the image of the mask pattern is exposed onto the sensitive substrate.

Abstract: A projection exposure apparatus having an illuminating system for irradiating a mask, which has a pattern, with illuminating light for exposure and a projection optical system having a plurality of optical elements arranged along an optical axis to project an image of a pattern illuminated with light onto a substrate. One of a plurality of optical plates having different optical characteristics is interposed between the pattern and the substrate depending on the pattern. An adjusting system adjusts a characteristic of the projected image based on a calculation using one of a plurality of parameters corresponding to the optical plates, the one parameter being selected in accordance with the one optical plate to compensate for a change in an optical property of the projection optical system caused by the change of the optical plate.

Abstract: The exposure apparatus has an illumination optical system equipped with an illuminance-uniformity unit (3A) composed of a diffusion plate (31), a conical prism (32), a reflecting member (34) in a columnar form, a reflecting member (33) in a cylindrical form, a fly-eye lens (35) and a stop (36). The exposure apparatus is for use in a lithography process for manufacturing semiconductors and so on. The illumination light from an optical system of a previous stage has an illuminance distributed in a uniform manner to some extent by multiple reflection between the reflecting plane of the reflecting member (34) and the reflecting plane of the reflecting member (33) via the diffusion plate (31) and the conical prism (32), and the illumination light is then led to a reticle at a high degree of illuminance through the fly-eye lens (35) and the stop (36).