Abstract: A light source apparatus according to an aspect of the present disclosure includes a first light source section that outputs first light containing a first polarized component and a second polarized component, a second light source section that outputs second light, a wavelength converter that converts the first light into third light, a light combiner that combines the first light, the second light, and the third light, and a filter that attenuates light of the third wavelength band. The light combiner reflects the first polarized component and transmits the second polarized component to cause one of he first polarized component and the second polarized component to exit toward the wavelength converter, and transmits the first light and the second light or the third light and reflects the third light or the first light and the second light. The filter is movable.

Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.

Abstract: A high frequency module includes a mounting substrate, a plurality of components, a resin layer, and a ground electrode. The plurality of components include a first component, a second component, and a third component. The first component is any one of a first filter and a first power amplifier. The second component is any one of a second filter and a second power amplifier. A top surface of the first component and a top surface of the second component are connected to the ground electrode. The first component and the second component are configured to be capable of performing simultaneous transmission. The third component is configured not to perform a simultaneous transmission operation together with the first component and the second component. The third component is disposed between the first component and the second component in plan view from a thickness direction of the mounting substrate.

Abstract: A switch circuit includes: first through third common terminals; a first selection terminal that can be connected to the first through third common terminals; second and third selection terminals that can be connected to the first and third common terminals via a first node and can be connected to the first and second common terminals via a second node; first through third switches connected between the first through third common terminals and the first selection terminal; fourth through fifth switches connected between the first and third common terminals and the first node; sixth and seventh switches connected between the first and second common terminals and the second node; eighth and ninth switches connected between the second and third selection terminals and the first node; and tenth and eleventh switches connected between the second and third selection terminals and the second node.

Abstract: Provided is a machining jig on which a carbon film (3) is formed on a machining surface of a rigid substrate (1), in which the carbon film (3) indicates a Raman spectroscopy spectrum with an intensity ratio, represented by the formula: ID/IG (where ID is the maximum peak intensity at 1333±10 cm?1 in the Raman spectroscopy spectrum of the carbon film surface, and IG is the maximum peak intensity at 1500±100 cm?1 in the Raman spectroscopy spectrum of the carbon film surface), exceeding 0.6. Also provided is a method of manufacturing seamless can bodies, the method including a step of using a mold machining member, on which a diamond film is formed on a machining surface, to press work a metal material onto the machining surface of the mold machining member in a state where a coolant is interposed.

Abstract: A conveyance seat capable of suppressing wrinkles or saggings from occurring on a surface of a seat main body is provided. A conveyance seat S includes a seat back and a movable body which is attached inside the seat back, is disposed at an outer position in relation to a center portion of the seat back, and is operated so that a side portion of the seat back protrudes toward a seated occupant side (seat front side). The movable body is disposed on a back surface of a cushion material in the side portion. An end portion (rear end portion) on the side opposite to the seated occupant side of the movable body is disposed on the seated occupant side (seat front side) in relation to a seating surface of the center portion of the seat back.

Abstract: A metallic worked article suppressing the worked surfaces from being scratched during the plastic work that is conducted aiming at reducing the thickness or decreasing the diameter. The metallic worked article has a reduced thickness or a decreased diameter as obtained through the plastic work, wherein on the worked surface thereof, the ratio Ra1/Ra2 of an arithmetic mean roughness Ra1 measured in a direction at right angles with the direction of working and an arithmetic mean roughness Ra2 measured in the direction of working, is from 0.5 to 1.5.

Abstract: A first filter is prevented from being affected by the coplanarity of a mounting substrate and a degradation of the filter characteristics of the first filter is reduced. A first filter, a second filter, a third filter, and a first switch are mounted on a first principal surface of a mounting substrate. The first filter passes a first high-frequency signal and a second high-frequency signal, the second filter passes a third high-frequency signal, and the third filter passes a fourth high-frequency signal. The first switch is capable of simultaneously connecting the first filter and the second filter to an antenna terminal. In a plan view from a thickness direction of the mounting substrate, the first filter is larger than the second filter and the third filter and located between the second filter and the third filter. A first wire and a second wire are each shorter than a third wire.

Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.

Abstract: A radio frequency module includes: a module substrate having a main surface; a conductive member to partition the main surface into regions in a plan view of the main surface, and being set to ground electric potential; a switch disposed in one of the regions and connected to an antenna connection terminal; a power amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch; and a low-noise amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch.

Abstract: A light irradiation apparatus focuses light on a surface or an inside of an object to observe or process the object, and includes a laser light source, a lens, a lens, a mask, a wave plate, and a lens. The mask is a multi-ring mask for spatially intensity-modulating input light in a beam cross-section and outputting modulated light, and includes a plurality of ring-shaped light-shielding areas provided around a center position, and a transmitting area provided between two adjacent light-shielding areas out of the plurality of light-shielding areas. A radial width of each of the two adjacent light-shielding areas out of the plurality of light-shielding areas is larger than a radial width of the transmitting area provided between the two light-shielding areas.

Abstract: A radio frequency module, capable of simultaneously transporting a transmission signal in a communication band B for TDD and a reception signal in a communication band A for FDD, includes a filter connected to an antenna connection terminal and having a pass band, the communication band B, a filter connected to the antenna connection terminal and having a pass band, a reception band of the communication band A, a switch to change over between the filter and a transmission input terminal to receive a transmission signal in the communication band B from an outside and the filter and a reception output terminal to supply a reception signal in the communication band B to the outside, and a band elimination filter connected between the transmission input terminal and the switch and having a stop band including the reception band of the communication band A.

Abstract: A radio frequency module includes: a radio frequency input terminal for receiving an amplified transmission signal from the outside; radio frequency output terminals for supplying a reception signal to the outside; a filter connected between the radio frequency input terminal/the radio frequency output terminal and an antenna connection terminal, and having a passband including communication band D for TDD; and a filter connected between the radio frequency output terminal and the antenna connection terminal and having a passband including at least part of communication band A allowed for simultaneous communication with communication band D. The radio frequency input terminal is arranged in a region extending along a side of the module substrate, and the radio frequency output terminal is arranged in a region extending along a side facing the side of the module substrate.

Abstract: A radio-frequency module includes a mount board, an acoustic wave filter, a metal block, a resin layer, and a shield layer. The mount board has a first principal surface and a second principal surface opposite to each other, and has a ground layer. The acoustic wave filter is mounted on the first principal surface of the mount board. The metal block is disposed on the first principal surface of the mount board, and is connected to the ground layer. The resin layer is disposed on the first principal surface of the mount board, and covers the periphery of the acoustic wave filter and the periphery of the metal block. The shield layer covers the principal surface, which is on the opposite side to the mount board side, of the acoustic wave filter, the resin layer, and the metal block. The metal block is in contact with the shield layer.

Abstract: A high frequency module includes a mounting substrate, an acoustic wave filter, a protection member, a resin layer, and a shield layer. The acoustic wave filter is mounted on a first main surface of the mounting substrate. The protection member is disposed on a main surface of the acoustic wave filter that is far from the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter and an outer peripheral surface of the protection member. The shield layer covers the resin layer and the protection member. The protection member is in contact with both the acoustic wave filter and the shield layer. The acoustic wave filter includes a piezoelectric substrate. A main surface of the piezoelectric substrate that is far from the mounting substrate is in contact with the protection member.

Abstract: Provided is a manufacturing method of a bottomed cylindrical body, which can achieve both severe can making processing such as conventional drawing and ironing, and cost reduction and environmental load reduction in a washing step. A manufacturing method of a bottomed cylindrical body includes a drawing step of drawing a metal sheet by use of forming members each of which has a hardness of Hv 1500 to 12000 at its processing surface, and an ironing step of ironing a workpiece into the bottomed cylindrical body via a coolant by use of forming members each of which has a carbon film at its processing surface, and the coolant is a water-soluble coolant or a coolant having a boiling point of lower than 300° C.

Abstract: There is provided a method for manufacturing a bottomed cylindrical body, the method being capable of achieving both a conventional hard can manufacturing process such as drawing and ironing and reduction in the cost and the environmental load in a degreasing step. The method for manufacturing a bottomed cylindrical body includes a lubricant application step of applying liquid (lubricant) having a viscosity of lower than 200 mPa·s to a surface of a metal plate, a drawing step of drawing the metal plate to which. the lubricant has been applied, with use of a forming member having a processing surface having a hardness of Hv 1000 to 12000, an ironing step of ironing, with use of another forming member having a processing surface having a hardness of Hv 1500 to 12000, a workpiece with a coolant interposed between the workpiece and the another forming member, to form a bottomed cylindrical body, and a degreasing step of degreasing oil on a surface of the bottomed cylindrical body with use of a cleaning agent.

Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.

Abstract: A radio-frequency module includes a mount board, an electronic component, an external connection terminal, and an acoustic wave filter. The mount board has a first principal surface and a second principal surface facing each other. The electronic component is arranged on the first principal surface of the mount board. The external connection terminal is arranged on the second principal surface of the mount board. The acoustic wave filter is arranged on the second principal surface of the mount board. The acoustic wave filter is a bare-chip acoustic wave filter. The radio-frequency module is suppressed in height along a thickness of the mount board.

Abstract: Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The acoustic wave filter is arranged near the first main surface of the mounting substrate. The resin layer is arranged on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter. The shield layer covers the resin layer and the acoustic wave filter. The shield layer is in contact with a second main surface of the acoustic wave filter that is far from the mounting substrate.