Abstract: A chemical mechanical polishing composition for polishing silicon dioxide over silicon nitride includes certain acidic heterocyclic nitrogen compounds having a pK value of 5 of less. Also, methods for polishing a substrate to remove some of the silicon dioxide and silicon nitride are disclosed.

Abstract: A broadband provisioning system configured for bulk provisioning of communications services is provided. The system includes an order manager that includes machine executable instructions stored on machine readable media, the instructions for: receiving a request to provision a plurality of telephone numbers with communications services; creating details for the request and setting an initial state for the request; and upon commencement of processing of the request, updating the state of the request to indicate ongoing processing, provisioning each telephone number in the request by associating resources therewith, and updating a status for each telephone number provisioned; and upon completion of processing, changing the state of the request to indicate completion.

Abstract: The present invention provides aqueous chemical mechanical planarization polishing (CMP polishing) compositions comprising one or more dispersions of aqueous colloidal silica particles, preferably, spherical colloidal silica particles, one or more amine carboxylic acids having an isolectric point (pI) below 5, preferably, an acidic amino acid or a pyridine acid, and one or more ethoxylated anionic surfactants having a C6 to C10 alkyl, aryl or alkylaryl hydrophobic group, wherein the compositions have a pH of from 3 to 5. The compositions enable good silicon nitride removal and selectivity of nitride to oxide removal in polishing.

Abstract: A refrigeration system includes an evaporator within which a refrigerant absorbs heat, a gas cooler/condenser within which the refrigerant rejects heat, a compressor operable to circulate the refrigerant between the evaporator and the gas cooler/condenser, a high pressure valve operable to control a pressure of the refrigerant at an outlet of the gas cooler/condenser, and a controller. The controller is configured to automatically generate a setpoint for a measured or calculated variable of the refrigeration system based on a measured temperature of the refrigerant at the outlet of the gas cooler/condenser. The setpoint is generated using a stored relationship between the measured temperature and a maximum estimated coefficient of performance (COP) that can be achieved at the measured temperature. The controller is configured to operate the high pressure valve to drive the measured or calculated variable toward the setpoint.

Abstract: Techniques are disclosed herein for reconciling planned data for a network (such as a fiber optic network) with data describing the deployed network. Network probing and planning components obtain a snapshot of the deployed network and organize the snapshot into three “layers”: the “link layer,” which represents the physical links that underlie the network, the “digital layer,” which includes optical channel groups that divide the total capacity of the physical links, and the “service layer,” which includes the services delivered over the network. The techniques involve comparing the planned data to the deployed data in the order of link layer, digital layer, and service layer. Differences considered to be “minor” are reconciled automatically. Differences that are “major” are reconciled after receiving instructions from a planner or administrator regarding whether to update the planned data based on what was originally in the planned data or what is in the deployed network.

Abstract: The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions comprising one or more dispersions of colloidal silica particles having a zeta potential of from +5 to +50 mV and having one or more aminosilane group, preferably, elongated, bent or nodular colloidal silica particles, or, more preferably, such particles which contain a cationic nitrogen atom, and at least one amine heterocycle carboxylic acid having an isolectric point (pI) of from 2.5 to 5, preferably, from 3 to 4. The compositions have a pH of from 2.5 to 5.3. Preferably, the amine heterocycle carboxylic acid is an amine-containing heterocyclic monocarboxylic acid, such as nicotinic acid, picolinic acid, or isonicotinic acid. The compositions enable enhanced oxide:nitride removal rate ratios.

Abstract: A control processor for a video encode-decode engine is provided that includes an instruction pipeline. The instruction pipeline includes an instruction fetch stage coupled to an instruction memory to fetch instructions, an instruction decoding stage coupled to the instruction fetch stage to receive the fetched instructions, and an execution stage coupled to the instruction decoding stage to receive and execute decoded instructions. The instruction decoding stage and the instruction execution stage are configured to decode and execute a set of instructions in an instruction set of the control processor that are designed specifically for accelerating video sequence encoding and encoded video bit stream decoding.

Abstract: The present application relates to compounds of Formula (I) and salts thereof. The compounds of Formula (I) have antibacterial and anti-biofilm activities. The present application also relates to compositions comprising the compounds of Formula (I) or salts thereof, methods of treating or preventing bacterial infections using the compounds of Formula (I) or salts thereof, and methods of inhibiting biofilm formation using the compounds of Formula (I) or salts thereof.

Abstract: The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions that comprise a mixture of (a) one or more alkoxylated diamines having a number average molecular weight (Mn) of from 1,000 to 20,000, or, preferably, from 1000-15000 and having four (poly)alkoxy ether groups each containing from 5 to 100 alkoxy repeat units; (b) from 0.01 to 2 wt. % or, preferably, from 0.1 to 1.5 wt. %, as solids, based on the total weight of the compositions, of one or more aqueous dispersions of elongated, bent or nodular colloidal silica particles, preferably, having a secondary particle size as determined by dynamic light scattering (DLS) of from 20 to 60 nm; and (c) ammonia or an amine base, wherein the compositions have a pH ranging from 9 to 11. The compositions are substantially free of metals, such as alkali or alkaline earth metals that can damage substrates in polishing.

Abstract: The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallylamine salt having a cationic amine group, such as a diallylammonium halide, or a diallylalkylamine salt having a cationic amine group, such as a diallylalkylammonium salt, or mixtures of the copolymers, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallylamine salt having a cationic amine group comprises a copolymer of diallylammonium chloride and sulfur dioxide and the copolymer of the diallylalkylamine salt having a cationic amine group comprises a copolymer of diallylmonomethylammonium halide, e.g. chloride, and sulfur dioxide.

Abstract: A computerized method comprising: providing a SaaS-based Platform that provides a DevOPS enabled framework to implement an end to end orchestration of a complex multi-vendor network solution on cloud-computing infrastructure, wherein the SaaS-based platform comprises an orchestrator engine and a deployer module, and wherein the deployer module provides a means to do a one touch deployment of a set of virtual test-beds in a computer network and the cloud-computing infrastructure; installing and configuring a database and queue in each of a plurality of nodes of the computer network; installing and configuring a backend server in each of another plurality of nodes of the computer network; installing and configuring a frontend server in each the other plurality of nodes of the computer network; and installing a service load balancer and configuring each of the set of frontend servers as a backend server.

Abstract: Methods and systems for managing a public perspective of an entity by analyzing online posts and automatically performing actions in response to these online posts are described herein. Real-time feeds of online posts may be streamed from social media servers. Online posts that are determined to be related to the entity may be extracted from the feeds and accumulated for analysis. A sentiment analysis may be performed on the online posts to determine the public perspective toward the entity. Content of the online posts may be analyzed to determine whether it is related to a prohibited transaction or an inquiry for a product or a service offered by the entity. Actions may be automatically performed to prevent the prohibited transaction from occurring. Resources related to the product or the service may be offered in response to the online post.

Abstract: A view definition analyzer maps a plurality of timing views for a circuit design into compatibility groups having shared operating conditions of their respective process corners. An ETM generator then extracts an extracted timing model from a block of the circuit design for each compatibility group, containing timing arcs representing each combination of interface path in the circuit block and timing view in the compatibility group, where at least one timing arc in the ETM is a merged version of multiple timing arcs for an interface path across multiple timing views in the compatibility group. Timing arcs are merged when each timing characteristic in a first timing arc matches, within a tolerance threshold, a corresponding timing characteristic in a second timing arc. The ETM may then be used to model any timing view in the compatibility group. The ETM generator thus produces a minimal set of extracted timing models.

Abstract: The present invention provides aqueous chemical mechanical planarization polishing (CMP polishing) compositions comprising one or more dispersions of a plurality of elongated, bent or nodular anionic functional colloidal silica particles or their mixture with one or more dispersions of anionic functional spherical colloidal silica particles, one or more amine carboxylic acids having an isoelectric point (pI) below 5, preferably, an acidic amino acid or pyridine acid, and, preferably, one or more ethoxylated anionic surfactants having a C6 to C16 alkyl, aryl or alkylaryl hydrophobic group, wherein the compositions have a pH of from 3 to 5. The compositions enable good silicon nitride removal and selectivity of nitride to oxide removal in polishing.

Abstract: The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions comprising one or more dispersions of colloidal silica particles having a zeta potential of from +5 to +50 mV and having one or more aminosilane group, preferably, elongated, bent or nodular colloidal silica particles, or, more preferably, such particles which contain a cationic nitrogen atom, and at least one amine heterocycle carboxylic acid having an isolectric point (pI) of from 2.5 to 5, preferably, from 3 to 4. The compositions have a pH of from 2.5 to 5.3. Preferably, the amine heterocycle carboxylic acid is an amine-containing heterocyclic monocarboxylic acid, such as nicotinic acid, picolinic acid, or isonicotinic acid. The compositions enable enhanced oxide:nitride removal rate ratios.

Abstract: The present invention provides aqueous chemical mechanical planarization polishing (CMP polishing) compositions, such as for semiconductor substrates, comprising an abrasive of one or more dispersions of elongated, bent or nodular colloidal silica particles which contain a cationic nitrogen atom, and one or more amine carboxylic acids having an isoelectric point (pI) below 5, preferably, acidic amine carboxylic acids or pyridine acids, wherein the compositions have a pH of from 2 to 5. The compositions enable polishing at a high oxide:nitride removal rate ratio.

Abstract: The present invention provides aqueous chemical mechanical planarization polishing (CMP polishing) compositions comprising one or more dispersions of aqueous colloidal silica particles, preferably, spherical colloidal silica particles, one or more amine carboxylic acids having an isolectric point (pI) below 5, preferably, an acidic amino acid or a pyridine acid, and one or more ethoxylated anionic surfactants having a C6 to C10 alkyl, aryl or alkylaryl hydrophobic group, wherein the compositions have a pH of from 3 to 5. The compositions enable good silicon nitride removal and selectivity of nitride to oxide removal in polishing.

Abstract: A portable communication device comprises a housing having therein: a microphone interface for receiving a first audio signal generated by a microphone connected thereto; an audio processing block in electronic communication with the microphone interface so as to receive the first audio signal, the audio processing block configured to generate a second audio signal corresponding to the first audio signal; a transmitter in electronic communication with the audio processing block so as to be configured to transmit the second audio signal; a receiver configured to receive third audio signals; an audio receive block in electronic communication with the receiver so as to generate a plurality of fourth audio signals, each fourth audio signal corresponding to a respective one of the third audio signals; and a speaker interface for connection to a speaker configured to emit audio corresponding to the fourth audio signals.

Abstract: A damping system and apparatus are disclosed for dampening acoustic pressure oscillations of a gas flow in a combustor of a gas turbine engine having at least one combustor with a combustor liner. A second inner cap portion is disposed on the at least one combustor. The second inner cap portion can have a hot surface, a cold surface, at least one burner opening protruding from the cold surface, and at least one neck ring having an internal opening and protruding from the cold surface. At least one extended resonating tube having a resonating tube neck is integrated with and protruding from the at least one neck ring. The at least one extended resonating tube is disposed between adjacent burner openings, and is configured such that the radial dimension is less than the axial dimension.

Abstract: The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular colloidal silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallyldimethylammonium salt, such as a diallyldimethylammonium halide, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallyldimethylammonium salt comprises a copolymer of diallyldimethylammonium chloride (DADMAC) and sulfur dioxide. The slurry compositions demonstrate good oxide selectivity in the CMP polishing of pattern wafers having nitride and silicon patterns.