Abstract: The present invention relates to a flash memory array. The flash memory array includes at least two word lines of gate electrode material. At least one of the word lines is connected through a first metal level to a discharge circuit, while other word line(s) may connect to a discharge circuit through a first and second metal level. The memory array further includes a shorting path between the word lines of the memory array. The shorting path is a high resistance layer of undoped gate electrode material. The resistance value of the gate electrode material is such that the word lines can be used to read, write, or erase without effecting each other, but that during the formation of a first metal level, as charges will build up on a first word line which requires a second metal level to connect to its discharge junction circuit, it will short the first word line to an adjacent second word line that has a connection to its junction circuit on the first metal level.

Abstract: Systems and/or methods that facilitate discharging bit lines (BL) associated with memory arrays in nonvolatile memory at a controlled rate are presented. A discharge component facilitates discharging the BL at a desired rate thus preventing the “hot switching” phenomenon from occurring within a y-decoder component(s) associated with the nonvolatile memory. The discharge component can be comprised of, in part, a discharge transistor component that controls the rate of BL discharge wherein the gate voltage of the discharge transistor component can be controlled by a discharge controller component. The rate of BL discharge can be determined by the size of discharge transistor component used in the design, the strength and/or size of the y-decoder component, the number of erase errors that occur for a particular memory device, and/or other factors in order to facilitate preventing hot switching from occurring.

Abstract: A memory device includes a sense amplifier to sense the state of a bitcell. The sense amplifier includes two input terminals connected via a switch. One of the input terminals is connected to a node, whereby a current through the node represents a difference in current drawn by a bitcell and a reference current. During a first phase, the switch between the input terminals of the sense amplifier is closed, so that a common voltage is applied to both input terminals. During a second phase, the switch is opened, and the sense amplifier senses a state of information stored at the bitcell based on the current through the node. By using the switch to connect and disconnect the inputs of the sense amplifier in the two phases, the accuracy and speed with which the state of the information stored at the bitcell can be determined is improved.

Abstract: A method of forming a capacitor for use as a charge pump with flash memory, comprising: (a) concurrently forming polysilicon gates on a semiconductor body in a core region and a polysilicon middle capacitor plate in a peripheral region, (b) forming a first dielectric layer over the polysilicon gates and the middle capacitor plate, (c) planarizing the first dielectric layer to expose a top portion of the polysilicon gates and a top portion of the middle capacitor plate, (d) forming a second dielectric layer over the top portion of the middle capacitor layer, (e) concurrently forming patterning a second polysilicon layer in the core region and a third capacitor plate in the periphery region and (f) connecting the third capacitor plate to the source/drain well.

Abstract: One embodiment of the invention relates to a method for accessing a memory cell. In this method, at least one bit of the memory cell is erased. After erasing the at least one bit, a soft program operation is performed to bias the memory cell thereby improving the reliability of data stored in the memory cell. Other methods and systems are also disclosed.

Abstract: A fast reference circuit having active feedback includes a bias supply circuit and a variable divider circuit connected by an active feedback path to the bias supply circuit, and a comparator circuit connected to the variable divider circuit, the bias supply circuit, and a reference node of the variable divider circuit. In one embodiment, a start-up circuit initially discharges a potential at the bias supply and comparator circuits, then initializes a reference voltage at the reference node at about zero volts to improve repeatability. In one embodiment, the variable voltage divider comprises an impendence that is trimmed based on a sheet resistance of a process used to fabricate the fast reference circuit, and further comprises a variable reference current circuit coupled to the impedance and configured to generate a current having a value based on a desired reference voltage and to conduct the current through the impedance, thereby generating the reference voltage associated therewith.

Abstract: A system and method for manufacturing a semiconductor device including multi-layer bitlines. The location of the bitlines in multiple layers provides for increased spacing and increased width thereby overcoming the limitations of the pitch dictated by the semiconductor fabrication process used. The bitlines locations in multiple layers thus allows the customization of the spacing and width according to the use of a semiconductor device.

Abstract: Systems and/or methods that accessing data to/from a memory are presented. A memory component can employ an optimized buffer component that can provide a single precharge control signal to facilitate precharging a bitline(s), a y-decoder component(s), an input/output line(s), and/or other lines or components associated with a buffer cell(s) in the optimized buffer component to facilitate optimized timing control associated with execution of operations to facilitate reducing errors that can be caused by charge sharing problems. The optimized buffer component can include an x-decoder component that can employ a JIT power component that can facilitate enabling a wordline associated with a buffer cell(s) only for the length of time access to the buffer cell is desired to read data therefrom or write data thereto to facilitate minimizing the access time and thereby minimize power consumption and/or thermal loading.

Abstract: A semiconductor device is disclosed and provided. The semiconductor device includes a pad metal layer having a perimeter area and a center area. Further, the semiconductor device has a lower metal layer having a plurality of apertures below the center area of the pad metal layer. Moreover, an interlayer dielectric is formed between the pad metal layer and the lower metal layer. In an embodiment, the semiconductor device also includes a plurality of vias formed in the interlayer dielectric. The vias electrically couple the pad metal layer and the lower metal layer. Additionally, the vias are located below the perimeter area of the pad metal layer.

Abstract: A semiconductor memory device (104) selectably connectable to an external high voltage power supply (122) is provided. The semiconductor memory device (104) includes a switch (314), a detector (316) and a timing device (318). The switch (314) is connected to external voltage supply signals and selectably couples the external voltage supply signals to memory cells (305) of the semiconductor memory device (104) for memory operations thereof. The external voltage supply signals including a high voltage signal (412) provided from the external high voltage power supply (122) and an operational voltage signal Vcc (402). The detector (316) is connected to the external voltage supply signals for generating a timer activation signal (404) in response to detecting an operational voltage power-on period.

Abstract: A memory device includes a sense amplifier to sense the state of a bitcell. The sense amplifier includes two input terminals connected via a switch. One of the input terminals is connected to a node, whereby a current through the node represents a difference in current drawn by a bitcell and a reference current. During a first phase, the switch between the input terminals of the sense amplifier is closed, so that a common voltage is applied to both input terminals. During a second phase, the switch is opened, and the sense amplifier senses a state of information stored at the bitcell based on the current through the node. By using the switch to connect and disconnect the inputs of the sense amplifier in the two phases, the accuracy and speed with which the state of the information stored at the bitcell can be determined is improved.

Abstract: Methods and apparatus are disclosed for erasing memory cells in a virtual ground memory core, wherein a row decoder apparatus employs a protective voltage to wordlines of a sector of cells while concurrently providing an erase voltage to selected wordlines of the same physical sector. Decoder circuitry and methods are disclosed for selecting a memory cell sector to be erased and adjacent sectors to be protected, which may be used in single bit and dual bit memory devices, and which enable column decoder circuitry to reduce the number of sector select circuits.

Abstract: A method and apparatus are provided for high performance, high voltage memory operations on selected memory cells (200) of a semiconductor memory device (100). A high voltage generator (106) during program or erase operations provides a continuous high voltage level (702) on selected word lines (502) and maintains a continuous high voltage level supply to a bit line decoder (120) which sequentially provides the high voltage level (706) to a first portion of bit lines (504) and discharges (708) those bit lines (504) before providing the high voltage level to a second portion (710).

Abstract: One embodiment of the present invention relates to a flash memory array. The flash memory array comprises at least two word lines of gate electrode material. At least one of the word lines is connected through a first metal level to a discharge circuit, while other word line(s) may connect to a discharge circuit through a first and second metal level. The memory array further comprises a shorting path between the word lines of the memory array. The shorting path is a high resistance layer of undoped gate electrode material. The resistance value of the gate electrode material is such that the word lines can be used to read, write, or erase without effecting each other, but that during the formation of a first metal level, as charges will build up on a first word line which requires a second metal level to connect to its discharge junction circuit, it will short the first word line to an adjacent second word line that has a connection to its junction circuit on the first metal level.

Abstract: Commonly, read times of a memory line are slowed due to voltage overshoot and/or voltage undershoot. To eliminate these problems, a control component can manage voltage while a leakage component manages timing of voltage. This allows for a line pre-charge that produces increase read times. The control component can implement as a variable resistor that modifies value to compensate for temperature. The leakage component can include a capacitor configuration that allows voltage to pass.

Abstract: Systems and/or methods that accessing data to/from a memory are presented. A memory component can employ an optimized buffer component that can provide a single precharge control signal to facilitate precharging a bitline(s), a y-decoder component(s), an input/output line(s), and/or other lines or components associated with a buffer cell(s) in the optimized buffer component to facilitate optimized timing control associated with execution of operations to facilitate reducing errors that can be caused by charge sharing problems. The optimized buffer component can include an x-decoder component that can employ a JIT power component that can facilitate enabling a wordline associated with a buffer cell(s) only for the length of time access to the buffer cell is desired to read data therefrom or write data thereto to facilitate minimizing the access time and thereby minimize power consumption and/or thermal loading.

Abstract: Systems and methodologies are provided herein for increasing operation speed uniformity in a flash memory device. Due to the characteristics of a typical flash memory array, memory cells in a memory array may experience distributed substrate resistance that increases as the distance of the memory cell from an edge of the memory array increases. This difference in distributed substrate resistance can vary voltages supplied to different memory cells in the memory array depending on their location, which can in turn cause non-uniformity in the speed of high voltage operations on the memory array such as programming. The systems and methodologies provided herein reduce this non-uniformity in operation speed by providing compensated voltage levels to memory cells in a memory array based at least in part on the location of each respective memory cell.

Abstract: Systems and/or methods that facilitate discharging bit lines (BL) associated with memory arrays in nonvolatile memory at a controlled rate are presented. A discharge component facilitates discharging the BL at a desired rate thus preventing the “hot switching” phenomenon from occurring within a y-decoder component(s) associated with the nonvolatile memory. The discharge component can be comprised of, in part, a discharge transistor component that controls the rate of BL discharge wherein the gate voltage of the discharge transistor component can be controlled by a discharge controller component. The rate of BL discharge can be determined by the size of discharge transistor component used in the design, the strength and/or size of the y-decoder component, the number of erase errors that occur for a particular memory device, and/or other factors in order to facilitate preventing hot switching from occurring.

Abstract: Methods and apparatus are disclosed for erasing memory cells in a virtual ground memory core, wherein a row decoder apparatus employs a protective voltage to wordlines of a sector of cells while concurrently providing an erase voltage to selected wordlines of the same physical sector. Decoder circuitry and methods arc disclosed for selecting a memory cell sector to be erased and adjacent sectors to be protected, which may be used in single bit and dual bit memory devices, and which enable column decoder circuitry to reduce the number of sector select circuits.

Abstract: A hybrid memory system is provided that combines the advantages of NAND flash memory devices with the advantages of NOR flashes memory devices. The system includes a NAND flash memory portion to provide mass storage and fast programming/erasure capabilities of conventional NAND flash memory devices. The system further comprises a NOR flash memory portion to provide code storage and fast random reading capabilities of conventional NOR flash memory devices. Accordingly, the hybrid memory system provides both mass storage and code storage. along with fast programming/erasure speeds and fast random access speeds.