Patents by Inventor Nicholas P Cowley

Nicholas P Cowley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11037896
    Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 15, 2021
    Assignee: Intel Corporation
    Inventors: Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Richard J. Goldman
  • Publication number: 20210006216
    Abstract: Various embodiments are directed to apparatuses and methods to generate a first signal representing modulation data and a second signal representing an amplitude of the modulation data, the first signal and the second signal to depend on an output signal and vary a power supply voltage to a gain stage in proportion to the amplitude of the modulation data.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 7, 2021
    Applicant: Intel Corporation
    Inventors: Nicholas P. Cowley, Isaac Ali, William L. Barber
  • Patent number: 10715092
    Abstract: Various embodiments are directed to apparatuses and methods to generate a first signal representing modulation data and a second signal representing an amplitude of the modulation data, the first signal and the second signal to depend on an output signal and vary a power supply voltage to a gain stage in proportion to the amplitude of the modulation data.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: July 14, 2020
    Assignee: Intel Corporation
    Inventors: Nicholas P. Cowley, Isaac Ali, William L. Barber
  • Patent number: 10683189
    Abstract: Processes, apparatuses, and systems associated with usage and contextual-based elevator operations management that have the capability to learn and to constantly adapt to usage patterns on a temporal basis through continuous monitoring of elevator journeys. An elevator journey may include a start and termination floor for an individual. Elevator journey data may be used to predict patterns of usage and maybe used, for example, to optimize the number of elevators operational at any time, determine the optimal parking position of each elevator, and/or determine an efficient allocation of elevators to groups or related floors.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: June 16, 2020
    Assignee: Intel Corporation
    Inventors: Ruchir Saraswat, Nicholas P. Cowley, Richard J. Goldman
  • Patent number: 10568530
    Abstract: Described is an apparatus which comprises: a source to generate a first current having AC and DC components; a current-to-voltage converter to convert the first current or a copy of the first current to a first voltage proportional to a resistance, the first voltage having AC and DC components that correspond to the AC and DC components of the first current; a sample-and-hold circuit to filter the AC component from the first voltage and for providing an output voltage with the DC component; and an amplifier to receive the output voltage.
    Type: Grant
    Filed: June 27, 2015
    Date of Patent: February 25, 2020
    Assignee: Intel Corporation
    Inventors: Craig P. Finlinson, Mohammad U. Abbasi, Nicholas P. Cowley, Mark S. Mudd
  • Patent number: 10541652
    Abstract: Described is an apparatus which comprises: an amplifier to receive a reference voltage; and calibration logic which is operable to receive a first voltage and to provide the reference voltage to the amplifier, wherein the calibration logic is operable to generate a look-up table (LUT) that maps the first voltage to a drive current.
    Type: Grant
    Filed: June 27, 2015
    Date of Patent: January 21, 2020
    Assignee: Intel Corporation
    Inventors: Craig P. Finlinson, Nicholas P. Cowley, Mark S. Mudd
  • Patent number: 10455308
    Abstract: Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Valluri Bob Rao, Tor Lund-Larsen, Nicholas P. Cowley
  • Patent number: 10403511
    Abstract: A patch antenna system comprising: an integrated circuit die having an active side including an active layer, and a backside; a dielectric layer formed on the backside; and a redistribution layer formed on the dielectric layer wherein the redistribution layer forms an array of patches. The patch antenna further comprises a plurality of through-silicon vias (TSV), wherein the TSVs electrically connect the array of patches to the active layer.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: September 3, 2019
    Assignee: Intel Corporation
    Inventors: Ruchir Saraswat, Nicholas P. Cowley, Uwe Zillmann
  • Publication number: 20190260337
    Abstract: Various embodiments are directed to apparatuses and methods to generate a first signal representing modulation data and a second signal representing an amplitude of the modulation data, the first signal and the second signal to depend on an output signal and vary a power supply voltage to a gain stage in proportion to the amplitude of the modulation data.
    Type: Application
    Filed: January 18, 2019
    Publication date: August 22, 2019
    Applicant: Intel Corporation
    Inventors: Nicholas P. Cowley, Isaac Ali, William L. Barber
  • Patent number: 10320215
    Abstract: In an embodiment, a system includes voltage sensing logic to determine a first source voltage Vfirst source corresponding to a first source, and a controller to receive an indication of Vfirst source from the voltage sensing logic. The controller is to, responsive to Vfirst source>a first output voltage (V1), select a first source first regulator to input Vfirst source and provide V1; responsive to Vfirst source>a second output voltage (V2), select a first source second voltage regulator that inputs Vfirst source, and provide V2; responsive to Vfirst source?V1, select a second source first voltage regulator that inputs a second source voltage Vsecond source that corresponds to a second source and is substantially constant in time where Vsecond source>V1, and provide V1 independent of the first source first regulator and the first source second voltage regulator. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: June 11, 2019
    Assignee: Intel Corporation
    Inventors: Viacheslav Suetinov, Hans Joakim Bangs, Nicholas P. Cowley, Mark S. Mudd, Ruchir Saraswat, Richard J. Goldman
  • Patent number: 10290598
    Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: May 14, 2019
    Assignee: Intel Corporation
    Inventors: Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Richard J. Goldman
  • Publication number: 20190109107
    Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 11, 2019
    Applicant: Intel Corporation
    Inventors: Kevin J. LEE, Ruchir SARASWAT, Uwe ZILLMANN, Nicholas P. COWLEY, Richard J. GOLDMAN
  • Patent number: 10224883
    Abstract: Various embodiments are directed to apparatuses and methods to generate a first signal representing modulation data and a second signal representing an amplitude of the modulation data, the first signal and the second signal to depend on an output signal and vary a power supply voltage to a gain stage in proportion to the amplitude of the modulation data.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 5, 2019
    Assignee: INTEL CORPORATION
    Inventors: Nicholas P. Cowley, Isaac Ali, William L. Barber
  • Patent number: 10070816
    Abstract: Embodiments of the present disclosure provide techniques and configurations for an orthotic device. In one instance, the device may include an orthotic device body and at least two sensors spatially disposed inside the orthotic device body. A first sensor may provide a first output responsive to pressure resulting from application of mechanical force to the orthotic device body. A second sensor may provide a second output responsive to flexing resulting from the application of mechanical force to the orthotic device body. The device may also include a control unit communicatively coupled with the sensors to receive and process the outputs provided by the sensors in response to pressure and flexing. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Nicholas P. Cowley, Ruchir Saraswat, Richard J. Goldman
  • Patent number: 10045721
    Abstract: Systems, apparatuses and methods may provide for a transmit circuit including a light source and a receive circuit including a photodetector and a transimpedance amplifier (TIA) coupled to the photodetector. Additionally, a calibration circuit may be coupled to the transmit circuit and the receive circuit, wherein the calibration circuit includes a current controller to set an operational current of the light source to a minimum value that results in a target output voltage of the receive circuit. In one example, the gain of the TIA remains substantially constant during calibration of the receive circuit.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 14, 2018
    Assignee: Intel Corporation
    Inventors: Mohammad U. Abbasi, Sendill K. Gnanaeswaran, Nicholas P. Cowley
  • Patent number: 10045735
    Abstract: Technologies for the sensing of biofeedback signals of a user include a body area network (BAN) system comprising one or more biofeedback sensors and one or more BAN controllers. The biofeedback sensors are configured to sense BAN signals, which may include biofeedback signals and body-coupled communication (BCC) signals. To facilitate communication, the biofeedback sensors may demultiplex the sensed BAN signals into biofeedback signals and incoming BCC signals. Similarly, the biofeedback sensors may multiplex outgoing BCC signals with sensed biofeedback signals. The BAN controller may communicate in a similar manner. Additionally, the BAN controller may process incoming BCC signals and provide feedback to the user based on BCC signals received from the biofeedback sensors.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: August 14, 2018
    Assignee: Intel Corporation
    Inventors: Nicholas P. Cowley, Ruchir Saraswat, Richard J. Goldman
  • Publication number: 20180198425
    Abstract: Various embodiments are directed to apparatuses and methods to generate a first signal representing modulation data and a second signal representing an amplitude of the modulation data, the first signal and the second signal to depend on an output signal and vary a power supply voltage to a gain stage in proportion to the amplitude of the modulation data.
    Type: Application
    Filed: July 26, 2017
    Publication date: July 12, 2018
    Applicant: Intel Corporation
    Inventors: Nicholas P. Cowley, Isaac Ali, William L. Barber
  • Patent number: 10013025
    Abstract: Embodiments of the present disclosure provide techniques and configurations for a wearable device with power state control. In one instance, the device a functional module to operate in a first power state or in a second power state that is different from the first power state; a power source coupled with the functional module to provide operational power to the functional module; and a power state control module coupled with the functional module, to cause the functional module to transition from the first power state to the second power state in response to an input. The power state control module may comprise a power generating device to generate power responsive to the input, independent of the power source, and in response to the generated power, cause the functional module to transition from the first power state to the second power state. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: July 3, 2018
    Assignee: Intel Corporation
    Inventors: Nicholas P. Cowley, Ruchir Saraswat, Richard Goldman, Ryan Palmer
  • Patent number: 9948186
    Abstract: Described is an apparatus which comprises: a first bridge to be coupled to a first load; a first Pulse Width Modulation (PWM) circuit to drive the first bridge; a second bridge to be coupled to a second load; and a second PWM circuit to drive the second bridge, wherein the first PWM circuit is controlled by a first digital word separate from a second digital word, wherein the second PWM circuit is controlled by the second digital, and wherein the second digital word is derived from the first digital word.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: April 17, 2018
    Assignee: INTEL CORPORATION
    Inventors: Nicholas P. Cowley, Harish K. Krishnamurthy, Ruchir Saraswat
  • Patent number: 9911689
    Abstract: Techniques are disclosed for forming a through-body-via (TBV) isolated coaxial capacitor in a semiconductor die. In some embodiments, a cylindrical capacitor provided using the disclosed techniques may include, for example, a conductive TBV surrounded by a dielectric material and an outer conductor plate. The TBV and outer plate can be formed, for example, so as to be self-aligned with one another in a coaxial arrangement, in accordance with some embodiments. The disclosed capacitor may extend through the body of a host die such that its terminals are accessible on the upper and/or lower surfaces thereof. Thus, in some cases, the host die can be electrically connected with another die to provide a die stack or other three-dimensional integrated circuit (3D IC), in accordance with some embodiments. In some instances, the disclosed capacitor can be utilized, for example, to provide integrated capacitance in a switched-capacitor voltage regulator (SCVR).
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: March 6, 2018
    Assignee: INTEL CORPORATION
    Inventors: Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Andre Schaefer, Rinkle Jain, Guido Droege