Patents by Inventor Nicholas Sporck
Nicholas Sporck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8872534Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.Type: GrantFiled: July 8, 2011Date of Patent: October 28, 2014Assignee: FormFactor, Inc.Inventors: Tommie Edward Berry, Alistair Nicholas Sporck
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Patent number: 8400176Abstract: A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.Type: GrantFiled: August 18, 2009Date of Patent: March 19, 2013Assignee: FormFactor, Inc.Inventors: Brian J. Arkin, Alistair Nicholas Sporck
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Publication number: 20110267085Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.Type: ApplicationFiled: July 8, 2011Publication date: November 3, 2011Applicant: FORMFACTOR, INC.Inventors: Tommie Edward Berry, A. Nicholas Sporck
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Patent number: 7977959Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.Type: GrantFiled: September 27, 2007Date of Patent: July 12, 2011Assignee: FormFactor, Inc.Inventors: Tommie Edward Berry, Alistair Nicholas Sporck
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Patent number: 7952375Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.Type: GrantFiled: June 6, 2006Date of Patent: May 31, 2011Assignee: FormFactor, Inc.Inventors: Benjamin N Eldridge, A. Nicholas Sporck, Charles A Miller
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Publication number: 20110043233Abstract: A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.Type: ApplicationFiled: August 18, 2009Publication date: February 24, 2011Inventors: Brian Arkin, Alistair Nicholas Sporck
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Patent number: 7852094Abstract: Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.Type: GrantFiled: December 6, 2006Date of Patent: December 14, 2010Assignee: FormFactor, Inc.Inventors: Matthew E. Chraft, Benjamin N. Eldridge, Roy J. Henson, A. Nicholas Sporck
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Patent number: 7821255Abstract: A test system for testing electronic devices can include a plurality of testers and a test station. The test station can include probes to contact the devices and the tester can control testing. Test data can be received by the test station from the testers using wireless communications links.Type: GrantFiled: June 16, 2009Date of Patent: October 26, 2010Assignee: FormFactor, Inc.Inventors: Igor Y. Khandros, Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck
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Patent number: 7675311Abstract: One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.Type: GrantFiled: May 15, 2007Date of Patent: March 9, 2010Assignee: FormFactor, Inc.Inventors: Igor Y. Khandros, Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck
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Patent number: 7659736Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.Type: GrantFiled: June 12, 2007Date of Patent: February 9, 2010Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Barbara Vasquez, Makarand S. Shinde, Gaetan L. Mathieu, A. Nicholas Sporck
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Patent number: 7649366Abstract: A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.Type: GrantFiled: September 1, 2006Date of Patent: January 19, 2010Assignee: FormFactor, Inc.Inventors: Roy J. Henson, A. Nicholas Sporck
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Publication number: 20100000080Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.Type: ApplicationFiled: June 3, 2009Publication date: January 7, 2010Inventors: Benjamin N. Eldridge, Gary W. Grube, Eric D. Hobbs, Gaetan L. Mathieu, Makarand S. Shinde, Alexander H. Slocum, A. Nicholas Sporck, Thomas N. Watson
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Patent number: 7616016Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.Type: GrantFiled: April 1, 2008Date of Patent: November 10, 2009Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Igor Y. Khandros, A. Nicholas Sporck
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Publication number: 20090251162Abstract: A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.Type: ApplicationFiled: June 16, 2009Publication date: October 8, 2009Inventors: Igor Y. Khandros, Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck
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Patent number: 7592821Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.Type: GrantFiled: October 23, 2007Date of Patent: September 22, 2009Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Eric D. Hobbs, Gaetan L. Mathieu, Makarand S. Shinde, Alexander H. Slocum, A. Nicholas Sporck, Thomas N. Watson
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Patent number: 7550842Abstract: In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.Type: GrantFiled: December 12, 2002Date of Patent: June 23, 2009Assignee: FormFactor, Inc.Inventors: Igor Y. Khandros, Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck, Gary W. Grube, Gaetan L. Mathieu
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Patent number: 7548055Abstract: A method and apparatus for testing a set of electronic devices can comprise placing electronic devices into a test station. A plurality of testers can provide test data to the test station. The test station can test the electronic devices using test data received from the plurality of testers. One of the testers can communication with another of the testers regarding the testing of the electronic devices. Probes can be used to contact the electronic devices, and one of the electronic devices can be contacted by more than one of the probes.Type: GrantFiled: April 4, 2007Date of Patent: June 16, 2009Assignee: FormFactor, Inc.Inventors: Igor Y. Khandros, Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck
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Publication number: 20090085590Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.Type: ApplicationFiled: September 27, 2007Publication date: April 2, 2009Applicant: FORMFACTOR, INC.Inventors: Tommie Edward Berry, A. Nicholas Sporck
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Publication number: 20080180121Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.Type: ApplicationFiled: April 1, 2008Publication date: July 31, 2008Inventors: Igor Y. Khandros, A. Nicholas Sporck, Benjamin N. Eldrdge
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Publication number: 20080136432Abstract: Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.Type: ApplicationFiled: December 6, 2006Publication date: June 12, 2008Inventors: Matthew E. Chraft, Benjamin N. Eldridge, Roy J. Henson, A. Nicholas Sporck