Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.

Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.

Abstract: A system for providing electrical power to a load is provided. The system includes at least two inverters and at least two resonant circuits. The inverters are operative to electrically connect to a power source. The resonant circuits are each electrically connected to at least one of the inverters and operative to provide electrical power to the load. The resonant circuits are coupled to each other.

Abstract: Methods of identifying target binding molecules by target guided synthesis are provided. The methods include providing two or more fragments capable of reacting to form the target binding molecule and mixing the fragments with the target. The methods can be used to identify target binding molecules that bind targets such as proteins or nucleic acids, including those that bind shallow binding pockets on the surface of such targets. The methods are applied to the Bcl-XL and Mcl-1 proteins from the Bcl-2 family of proteins. Using thio acid and sulfonyl azide fragments capable of reacting through sulfo-click chemistry, new acyl sulfonamides are identified that bind one or both of the Bcl-XL and Mcl-1 proteins. Pharmaceutical formulations of these target binding molecules are also provided.

Abstract: Formulations of the HIV compounds atazanavir and cobicistat, and methods of treatment utilizing these formulations, are set forth.

Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.

Abstract: Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

Abstract: A system for providing electrical power to a load is provided. The system includes at least two inverters and at least two resonant circuits. The inverters are operative to electrically connect to a power source. The resonant circuits are each electrically connected to at least one of the inverters and operative to provide electrical power to the load. The resonant circuits are coupled to each other.

Abstract: The present disclosure relates to an electrostatic chuck, including: a base having a dielectric first surface to support a substrate thereon during processing; and an electrode disposed within the base proximate the dielectric first surface to facilitate electrostatically coupling the substrate to the dielectric first surface during use, wherein the dielectric first surface is sufficiently hydrophobic to electrostatically retain the substrate to the dielectric first surface when contacted with water. Methods of making and using the electrostatic chuck under wet conditions are also disclosed.

Abstract: Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.

Abstract: Certain aspects of the present disclosure generally relate to wireless communications. In some aspects, a device may determine a peak to average ratio (PAR) value for a portion of a wireless transmission. In some aspects, the device may cause, based on the PAR value, a voltage to be applied to a power amplifier of the device to cause the device to transmit the portion of the wireless transmission.

Abstract: Embodiments of the disclosure relate to a system, apparatus and method for polishing thin substrates with high planarity. The apparatus comprises a chemical mechanical polishing head and a plate. The polishing head comprises a bottom surface, a retaining ring, a workpiece-receiving pocket defined between the bottom surface and the retaining ring, and at least one vacuum port adapted to provide a vacuum to the workpiece-receiving pocket through the bottom surface of the polishing head. The plate is disposed in the workpiece-receiving pocket such that the upper side of the plate faces the bottom surface of the polishing head and the lower side of the plate faces away from the bottom surface of the polishing head. The plate has a geometry or a material property configured to allow fluid to pass between the upper side and the lower side of the plate upon application of vacuum in the workpiece-receiving pocket.

Abstract: An electrostatic chucking force tool is described that may be used on workpiece carriers for micromechanical and semiconductor processing. One example includes a workpiece fitting to hold a workpiece when gripped by an electrostatic chucking force by an electrostatic chuck, an arm coupled to the workpiece fitting to pull the workpiece through the workpiece fitting laterally across the chuck, and a force gauge coupled to the arm to measure an amount of force with which the workpiece fitting is pulled by the arm in order to move the workpiece.

Abstract: A substrate carrier with contacts is described that is balanced for thermal stress. In one example workpiece carrier has a rigid substrate configured to support a workpiece to be carried for processing, a first dielectric layer over the substrate, an electrostatic conductive electrode over the first dielectric layer to electrostatically hold the workpiece to be carried, a second dielectric layer over the electrode to electrically isolate the workpiece from the electrode, and a third dielectric layer under the substrate to counter thermal stress applied to the substrate by the first and second dielectric layers.

Abstract: An intelligent remote touch mechanism is provided. In one aspect, a device with a touch screen initiates remote wireless access of the device by a remote device by receiving a remote access command without using its touch screen. The device authorizes remote wireless access by the remote device based on an authorization code received from the remote device. The device may receive a remote command from the remote device. In another aspect, a device receives a notification regarding the availability of remote wireless access to a touch screen device. The device transmits an authorization code to the touch screen device. The device receives a confirmation that remote wireless access to the touch screen device is enabled. The device receives, by its touch screen, a command for performing a function at the device. The device transmits the command wirelessly to the touch screen device.

Abstract: Certain aspects of the present disclosure generally relate to wireless communications. In some aspects, a device may determine a peak to average ratio (PAR) value for a portion of a wireless transmission. In some aspects, the device may cause, based on the PAR value, a voltage to be applied to a power amplifier of the device to cause the device to transmit the portion of the wireless transmission.

Abstract: A high voltage transformer arrangement for supplying power to a high voltage tank assembly is disclosed. The high voltage transformer arrangement includes a first core arranged in the high voltage tank assembly and a secondary winding configured on the first core, a second core positioned outside of the high voltage tank assembly and at a predefined distance from the first core, and a primary winding configured on the second core. The second core and the primary winding transfers current received from an external power source to the first core and secondary winding for supplying power to the high voltage tank assembly.

Abstract: Various embodiments for calibrating receive chains on a mobile communication device may include identifying a calibrated receive chain and an un-calibrated receive chain of the mobile communication device and obtaining a first series of gain measurements for the calibrated receive chain and a second series of gain measurements for the un-calibrated receive chain. The mobile communication device may determine a path gain difference between the calibrated receive chain and the un-calibrated receive chain based on the first series of gain measurements and the second series of gain measurements, and compensate a gain of the un-calibrated receive chain using the path gain difference.

Abstract: A power generation system includes an input to receive a low-voltage alternating current and a number N of voltage-conversion modules coupled to the input, each electrically connected in series. Each voltage-conversion module includes a transformer configured to convert the low-voltage alternating current into a high voltage alternating current. Each voltage-conversion module includes a multiplier configured to convert the high-voltage alternating current from the transformer into a high-voltage direct current. The multiplier includes a positive multiplier part and a negative multiplier part. The positive multiplier part and the negative multiplier part each includes a. pair of input terminals connected in parallel with the transform and at least one multiplier stage comprising a single diode and a capacitor assembly. The number N is an even number between 4 and 24.

Abstract: A wireless communication device includes: a first communications unit configured to communicate with a first communication network; a second communications unit configured to communicate with a second communication network; a control unit configured to control operation of the wireless communication device; and one or more temperature sensors configured to sense operating temperatures of the first communications unit and the second communications unit and provide temperature signals to the control unit. In response to a determination that an operating temperature of the first communications unit conducting a first call exceeds a predetermined threshold temperature and an operating temperature of the second communications unit does not exceed the predetermined threshold temperature, the control unit is configured to cause the first call on the first communications unit to be switched from a first transceiver chain in the first communications unit to a second transceiver chain in the second communications unit.