Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a plurality of first metal bumps on a first surface, and a plurality of second metal bumps on a second surface, wherein at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps, comprises a solder. The method also includes forming a metal region including indium and tin, on at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps. The method also includes positioning the first metal bumps on the second metal bumps, and heating the metal bumps and the metal region and melting the solder. Other embodiments are described and claimed.

Abstract: Methods and apparatus to improve flux air cap and/or spray nozzle designs are described. In one embodiment, a flux nozzle may include a cylindrical portion and a conical portion. Other embodiments are also described.

Abstract: A method, system, and apparatus, the apparatus including a metal layer on silicon, photo-resist material disposed on the metal layer, a bump pad reservoir adjacent to the metal layer, a quantity of interconnect metal disposed in the bump pad reservoir, and a resist opening in resist material disposed on a surface of the bump metal and adjacent the interconnect metal. The resist opening may be wider at an open end thereof than at an end in contact with the interconnect metal.

Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract: A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

Abstract: A method, system, and apparatus, the apparatus including a metal layer on silicon, photo-resist material disposed on the metal layer, a bump pad reservoir adjacent to the metal layer, a quantity of interconnect metal disposed in the bump pad reservoir, and a resist opening in resist material disposed on a surface of the bump metal and adjacent the interconnect metal. The resist opening may be wider at an open end thereof than at an end in contact with the interconnect metal.

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a plurality of first metal bumps on a first surface, and a plurality of second metal bumps on a second surface, wherein at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps, comprises a solder. The method also includes forming a metal region including indium and tin, on at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps. The method also includes positioning the first metal bumps on the second metal bumps, and heating the metal bumps and the metal region and melting the solder. Other embodiments are described and claimed.

Abstract: A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

Abstract: A method and apparatus for mounting semiconductor die and integral heat spreader are disclosed. In one embodiment, thermal expansion of the integral heat spreader is restricted by physical constraints during the process of heating interface material that bonds the integral heat spreader and semiconductor die together. In an alternative embodiment, thermal expansion of the integral hat spreader is restricted by applying an external compressive force to the integral heat spreader while heating interface material that bonds the integral heat spreader and semiconductor die together.

Abstract: A method and apparatus for mounting semiconductor die and integral heat spreader are disclosed. In one embodiment, thermal expansion of the integral heat spreader is restricted by physical constraints during the process of heating interface material that bonds the integral heat spreader and semiconductor die together. In an alternative embodiment, thermal expansion of the integral hat spreader is restricted by applying an external compressive force to the integral heat spreader while heating interface material that bonds the integral heat spreader and semiconductor die together.

Abstract: A bridge clip can provide off center loading between a lid and a semiconductor package during curing of adhesive for attachment of the lid to the integrated circuit die. This may be done, in some embodiments, without requiring an inventory of different parts and a variety of different assembly techniques by providing a leaf spring on the bridge clip which may be adapted for off center loading. The leaf spring may have its apex or centroid displaced with respect to the length of the bridge clip, transversely thereto or some combination thereof as needed. Thus, in some embodiments, a different leaf spring is all that needs to be provided to implement off center loading.