Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.

Abstract: A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components and 3b thereon; a substrate electrode formed on one main surface of the wiring substrate; a columnar conductor connected at one end to the substrate electrode; an intermediate coating formed to cover an outer peripheral surface of the columnar conductor; and a first sealing resin layer provided to cover one main surface of the wiring substrate and the intermediate coating. The intermediate coating has a coefficient of linear expansion which is between that of the columnar conductor and that of the first sealing resin layer.

Abstract: A scroll compressor includes a back pressure chamber oil-feeding path for feeding lubricating oil from a high-pressure region to a back pressure chamber, and a compression chamber oil-feeding path for feeding lubricating oil from the back pressure chamber to a compression chamber. One phase in which the back pressure chamber oil-feeding path is communicated from the high-pressure region to the back pressure chamber and another phase in which the compression chamber oil-feeding path is communicated from the back pressure chamber to the compression chamber are shifted from each other, so that the back pressure chamber oil-feeding path and the compression chamber oil-feeding path are never put into the communicating state simultaneously. Thus, after a halt of the compressor, under-communication oil-feeding of the lubricating oil from the high-pressure region via the back pressure chamber to the compression chamber can be prevented.

Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

Abstract: The present disclosure enhances the design flexibility of a multilayer electronic device. A multilayer electronic device is formed by alternately stacking, in a top-bottom direction, substrate layers in which substrates are disposed and a component layer in which at least one component is disposed. A non-superposing region in which a substrate of a first substrate layer positioned on the upper side of a first component layer is not superposed on a substrate of a second substrate layer positioned on the lower side of the first component layer, as viewed from above, is formed in the substrate. Accordingly, within the multilayer electronic device, a space in which the substrate of the second substrate layer is not located can be formed in a region under the non-superposing region of the substrate of the first substrate layer. By using this space, the design flexibility of the multilayer electronic device can be enhanced.

Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Abstract: In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.

Abstract: An electric compressor includes a hermetic container 103, an electric motor drive circuit section 201, a through hole 120, a hermetic terminal 207, a conductive terminal 301, a connecting terminal 302, and a housing 300. The terminal connecting portion connects the conductive terminal 301 and the cluster terminal 302 to each other. The housing is composed of a plurality of structure bodies. A convexo-concave shape is provided between bonding surfaces of the plurality of structure bodies. The housing 300 is provided with a cylindrical structure 311 into which the conductive terminal 301 is inserted. A convex structure 316 which comes into contact with the wire 306 is formed on an inner surface of the wire-insertion hole 307.

Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.

Abstract: In a scroll compressor of the present invention, a fixed scroll 11 and an orbiting scroll 12 are meshed with each other such that spiral laps of the fixed scroll 11 and the orbiting scroll 12 inwardly face each other, an Oldham ring 26 is provided between the main bearing member 19 and the orbiting scroll 12, and a key portion of the Oldham ring 26 is inserted into a key groove 19a of the main bearing member 19. Grooves 19b are formed in Oldham ring 26 sliding surfaces on both sides of the key groove 19a. According to this configuration, the Oldham ring 26 and the main bearing member 19 can be restrained from coming into contact with each other in the vicinity of the bearing key groove 19a, and restrained from vibrating, and it is possible to provide an inexpensive scroll compressor of low noise.

Abstract: A plating layer of a Cu—M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu—M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu—M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Abstract: An electric compressor comprising a casing in which a compressing mechanism 4, an electric motor portion for driving the compressing mechanism 4, and an inverter portion 8 for driving the electric motor portion are incorporated, wherein a surface of the casing is provided with a collided portion 3d, the collided portion 3d is provided only on a portion of the casing other than a portion thereof in which the electric motor portion is incorporated and a portion of the casing other than a portion thereof in which the inverter portion 8 is incorporated. According to this, it is possible to provide the electric compressor 1 capable of preventing a high voltage portion from being exposed to an impact load applied to the electric compressor 1 when a vehicle collides without increasing a weight, an external size and a cost of the electric compressor 1.

Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Abstract: The present invention provides a scroll compressor in which the reliabilities of the eccentric ball bearing and the main ball bearing are enhanced by controlling an amount of oil supplied from the high pressure region to the back pressure chamber and an amount of oil from the high pressure region to the eccentric ball bearing and the main ball bearing. The scroll compressor includes a back pressure chamber oil-supply path 25 through which lubricating oil 7 is supplied from the high pressure region 21 to the back pressure chamber 22, and a compression chamber oil-supply path 26 through which lubricating oil 7 is supplied from the back pressure chamber 22 to the compression chamber, and the one opening 25c of the back pressure chamber oil-supply path 25 reciprocates, and comes into and comes out from the sealing member 24.

Abstract: A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component 102 and the terminal assembly 10 mounted on the one principal surface of the wiring substrate 101, with a first resin layer 103. Also, since the plurality of connection terminals 11 are merely supported by the support body 12, the support body 12 can be easily removed from the plurality of connection terminals 11. Accordingly, the manufacturing time of the module 100 is decreased.

Abstract: When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).

Abstract: In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.

Abstract: An inverter-integrated electric compressor is structured to include a suction refrigeration path (61) for intensively flowing a sucked refrigerant (30) therethrough, such that the suction refrigerant path (61) is provided only in the vicinity of a switching device module (105), which is a main heat source in an inverter device portion (101), so that the sucked refrigerant is concentrated in only the vicinity of the switching device module, which is the main heat source in the inverter device portion. This enables effectively cooling the inverter device portion, with the sucked refrigerant, without involving adjustments of operating conditions for a refrigeration cycle.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: A scroll compressor includes a back pressure chamber oil-feeding path for feeding lubricating oil from a high-pressure region to a back pressure chamber, and a compression chamber oil-feeding path for feeding lubricating oil from the back pressure chamber to a compression chamber. One phase in which the back pressure chamber oil-feeding path is communicated from the high-pressure region to the back pressure chamber and another phase in which the compression chamber oil-feeding path is communicated from the back pressure chamber to the compression chamber are shifted from each other, so that the back pressure chamber oil-feeding path and the compression chamber oil-feeding path are never put into the communicating state simultaneously.