Patents by Inventor Nobuaki Ogawa

Nobuaki Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110265948
    Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.
    Type: Application
    Filed: July 14, 2011
    Publication date: November 3, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuhiro ISEBO, Norio SAKAI, Kenji KAWAKAMI, Nobuaki OGAWA
  • Publication number: 20110229282
    Abstract: A machining section of a gear machining apparatus includes a workpiece support in the form of a shaft that pivotally supports the workpiece gear and a cutter support in the form of a shaft that supports the chamfering cutter so that the chamfering cutter meshes with the workpiece gear attached to the shaft. The shaft is angled so that the chamfering cutter meshes with the workpiece gear at an axis-crossing angle to being zero degree and machining teeth of the chamfering cutter do not interfere with a tooth face the workpiece gear. A gear machining method is also provided.
    Type: Application
    Filed: July 30, 2008
    Publication date: September 22, 2011
    Applicants: HONDA MOTOR CO., LTD., SANYOMACHINE CO., LTD.
    Inventors: Katsuyoshi Ohno, Tatsuo Yokoi, Nobuaki Ogawa, Kenji Narahashi, Shimpei Nakada
  • Patent number: 8012287
    Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: September 6, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuhiro Isebo, Norio Sakai, Kenji Kawakami, Nobuaki Ogawa
  • Publication number: 20110194965
    Abstract: The present invention provides a scroll compressor in which the reliabilities of the eccentric ball bearing and the main ball bearing are enhanced by controlling an amount of oil supplied from the high pressure region to the back pressure chamber and an amount of oil from the high pressure region to the eccentric ball bearing and the main ball bearing. The scroll compressor includes a back pressure chamber oil-supply path 25 through which lubricating oil 7 is supplied from the high pressure region 21 to the back pressure chamber 22, and a compression chamber oil-supply path 26 through which lubricating oil 7 is supplied from the back pressure chamber 22 to the compression chamber, and the one opening 25c of the back pressure chamber oil-supply path 25 reciprocates, and comes into and comes out from the sealing member 24.
    Type: Application
    Filed: January 28, 2010
    Publication date: August 11, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Sadayuki Yamada, Nobuaki Ogawa, Yoshifumi Abe, Atsushi Sakuda, Takashi Morimoto
  • Patent number: 7820916
    Abstract: A composite ceramic substrate includes a ceramic substrate having surface-mounted components mounted thereon, external terminal electrodes connecting wiring patterns disposed on the ceramic substrate and surface electrodes of a motherboard, and a convex leg portion made of resin and arranged such that an end surface supports the external terminal electrodes, and the external terminal electrodes are connected to the wiring patterns via a via-hole conductor provided in the leg portion.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: October 26, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Nobuaki Ogawa
  • Patent number: 7708532
    Abstract: A lead wire of a motor is prevented from being damaged, and the reliability of an electric compressor is enhanced. The electric compressor 1 is provided with a division wall 80b which divides a discharge chamber 62 and a connection space 65 which connects a sealed terminal 90 and a lead wire 5c of a motor 5. With this configuration, it is possible to prevent discharge gas from directly flowing into the connection space 65, and to prevent the discharge gas from flowing into a wire passage 64 through which the lead wire 5c is passed. Therefore, vibration of lead wire 5c caused by gas pulse can be suppressed, the lead wire can be prevented from being damaged, and the reliability of the electric compressor can be enhanced.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: May 4, 2010
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuaki Ogawa, Masahiko Makino, Yukihiro Fujiwara
  • Patent number: 7656677
    Abstract: A multilayer electronic component includes a multilayer substrate having a first main surface and a second main surface, a resin layer having a mounting surface and a contact surface bonded to the first main surface, a via conductor provided inside the resin layer, and an external terminal electrode disposed on the mounting surface so as to come in contact with the via conductor. The external terminal electrode has a first region on a main surface facing the mounting surface and a second region on a main surface facing away from the mounting surface. The first region is connected to the via conductor while the second region is provided with a bonding member. The second region is arranged such that, when the first region is projected through to the main surface facing away from the mounting surface, the second region is spaced from and does not overlap with a region in which the first region is projected.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: February 2, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuaki Ogawa, Norio Sakai
  • Publication number: 20090320986
    Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.
    Type: Application
    Filed: September 15, 2009
    Publication date: December 31, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuhiro ISEBO, Norio SAKAI, Kenji KAWAKAMI, Nobuaki OGAWA
  • Patent number: 7488897
    Abstract: A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic multilayer substrate has a penetrating hole, and the cavity is formed by fitting the protrusion portion of the resin portion to an end portion of the penetrating hole of the ceramic multilayer substrate.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: February 10, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuaki Ogawa, Yoshihiko Nishizawa
  • Patent number: 7473079
    Abstract: In an electric compressor, an inverter case of an inverter is externally attached to an end wall of a housing in an axial direction on the side of a suction port to a compression mechanism. An intake passage for leading fluid returned from the outside into the suction port is provided in the inverter case. The intake passage has a thermal binding portion for thermally binding the intake passage to the inverter. According to the above structure, an exclusive part in the housing is eliminated even though the inverter is installed in the electric compressor, and the inverter is cooled efficiently.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: January 6, 2009
    Assignee: Panasonic Corporation
    Inventors: Nobuaki Ogawa, Yukihiro Fujiwara, Masahiko Makino, Makoto Yoshida, Yasuhiro Asaida
  • Publication number: 20080283279
    Abstract: A composite ceramic substrate includes a ceramic substrate having surface-mounted components mounted thereon, external terminal electrodes connecting wiring patterns disposed on the ceramic substrate and surface electrodes of a motherboard, and a convex leg portion made of resin and arranged such that an end surface supports the external terminal electrodes, and the external terminal electrodes are connected to the wiring patterns via a via-hole conductor provided in the leg portion.
    Type: Application
    Filed: July 5, 2005
    Publication date: November 20, 2008
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Nobuaki Ogawa
  • Patent number: 7446262
    Abstract: A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: November 4, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuaki Ogawa, Norio Sakai, Yoshihiko Nishizawa
  • Publication number: 20070178279
    Abstract: A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic multilayer substrate has a penetrating hole, and the cavity is formed by fitting the protrusion portion of the resin portion to an end portion of the penetrating hole of the ceramic multilayer substrate.
    Type: Application
    Filed: April 12, 2007
    Publication date: August 2, 2007
    Applicant: MURATA MANUFACTURING CO., LTD.,
    Inventors: Nobuaki OGAWA, Yoshihiko NISHIZAWA
  • Patent number: 7179068
    Abstract: A cooling space in an inverter case is disposed at a position opposed to a stationary scroll of a scroll compressor. A refrigerant having low temperature is allowed to flow in and out between the cooling space and the stationary scroll through a seal, thereby cooling an inverter.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: February 20, 2007
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Masahiko Makino, Nobuaki Ogawa, Yukihiro Fujiwara
  • Publication number: 20070026196
    Abstract: A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.
    Type: Application
    Filed: January 6, 2005
    Publication date: February 1, 2007
    Inventors: Nobuaki Ogawa, Norio Sakai, Yoshihiko Nishizawa
  • Publication number: 20060281297
    Abstract: A multilayer electronic component includes a multilayer substrate having a first main surface and a second main surface, a resin layer having a mounting surface and a contact surface bonded to the first main surface, a via conductor provided inside the resin layer, and an external terminal electrode disposed on the mounting surface so as to come in contact with the via conductor. The external terminal electrode has a first region on a main surface facing the mounting surface and a second region on a main surface facing away from the mounting surface. The first region is connected to the via conductor while the second region is provided with a bonding member. The second region is arranged such that, when the first region is projected through to the main surface facing away from the mounting surface, the second region is spaced from and does not overlap with a region in which the first region is projected.
    Type: Application
    Filed: January 5, 2005
    Publication date: December 14, 2006
    Inventors: Nobuaki Ogawa, Norio Sakai
  • Patent number: 7147443
    Abstract: It is an object of the present invention to provide an electric compressor capable of enhancing the mountability with respect to a vehicle without increasing the compressor in size when the electric compressor and a motor-driving circuit which drives a motor of the electric compressor are integrally formed together. A suction chamber 61 which is in communication with a fixed panel suction port 16 provided in a fixed scroll 11 from a suction port 8 provided in a sub-casing 102, and a discharge chamber 62 which is in communication with a communication passage 63 from a fixed panel discharge port 31 provided in the fixed scroll 11 are disposed on the same plane in a radial direction of a compressor, and the motor-driving circuit 101 is disposed in an axial direction of the compressor so that an IPM 105 which is a heat generating part of the circuit substrate 103 can be brought into tight contact with the suction chamber 61.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: December 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuaki Ogawa, Masahiko Makino, Yukihiro Fujiwara
  • Publication number: 20060275156
    Abstract: A lead wire of a motor is prevented from being damaged, and the reliability of an electric compressor is enhanced. The electric compressor 1 is provided with a division wall 80b which divides a discharge chamber 62 and a connection space 65 which connects a sealed terminal 90 and a lead wire 5c of a motor 5. With this configuration, it is possible to prevent discharge gas from directly flowing into the connection space 65, and to prevent the discharge gas from flowing into a wire passage 64 through which the lead wire 5c is passed. Therefore, vibration of lead wire 5c caused by gas pulse can be suppressed, the lead wire can be prevented from being damaged, and the reliability of the electric compressor can be enhanced.
    Type: Application
    Filed: May 16, 2006
    Publication date: December 7, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Nobuaki Ogawa, Masahiko Makino, Yukihiro Fujiwara
  • Publication number: 20060083649
    Abstract: It is an object of the present invention to make an oil-reservoir chamber independent from a motor chamber into which a refrigerant compressed by a compressor mechanism is introduced, thereby reducing a compressor in size. In a compressor 1, a partition member 7 is provided in a housing 3 on the opposite side from a compressor mechanism 4 with respect to a motor 5. The partition member 7 is pushed by a stator 5a of the motor 5, thereby liquid-tightly fixing the partition member 7 to the housing 3. The oil-reservoir chamber 6 is formed independently from a motor chamber 2 in which the motor 5 is accommodated, and lubricant oil is efficiently separated from a refrigerant with a simple structure.
    Type: Application
    Filed: October 14, 2005
    Publication date: April 20, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Masahiko Makino, Nobuaki Ogawa, Yukihiro Fujiwara, Minoru Fukumoto, Tatsuhisa Taguchi
  • Patent number: 7018185
    Abstract: Lubricating liquid fed from a reservoir to a compression mechanism is collected by a circumferential wall that surrounds the drive shaft of the compression mechanism and rotates synchronously with it immediately after liquid is discharged into the space inside the housing with or without compressed fluid. Liquid is then urged outward under centrifugal force from an outlet formed at a preset axial location of the circumferential wall. Exiting liquid is received by a fixed liquid return cover that surrounds the circumferential wall near its outlet and led back to the reservoir.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: March 28, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiko Makino, Minoru Kajitani, Nobuaki Ogawa, Yoshifumi Abe, Yukihiro Fujiwara