Abstract: A measuring apparatus includes an optical image input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus, which inspects defects of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, a design data input unit to input design data of the pattern on the target object, a reference image generation unit to generate reference image data to be compared with the optical image data, by performing image development of the design data, a positional deviation distribution generation unit to generate positional deviation distribution by measuring a positional deviation amount of the pattern on the target object, by using the optical image data obtained from the pattern inspection apparatus and the reference image data having been generated, and an output unit to output generated positional deviation distribution of the pattern.

Abstract: A pattern inspection method includes: scanning an inspection substrate, to be inspected, to detect a secondary electron group emitted from the inspection substrate due to irradiation with the multiple beams; correcting individually distortion of a first region image obtained from a detection signal of secondary electrons corresponding to a corresponding first region for each beam of the multiple beams; correcting distortion of a corresponding second region image corresponding to a second region larger than the first region for each of the second region images, using data of each of the first region images in which the distortion of the corresponding first region image has been corrected; and comparing an inspection image to be inspected, in which the distortion of each of the plurality of second region images has been corrected, with a reference image of a same region to output a result thereof.

Abstract: A pattern inspection apparatus includes a data processing circuitry to input detection data based on a secondary electron from a substrate for each irradiation unit region, where n1×m1 irradiation unit regions in irradiation unit regions configure one of n2×m2 image reference regions configuring an inspection measurement image, to calculate, for each of the n2×m2 image reference regions, a statistic value acquired from the detection data of all the n1×m1 irradiation unit regions in one of the n2×m2 image reference regions, and to define the statistic value as image reference data for the image reference region, and a comparison processing circuitry to receive transmission of the image reference data for each image reference region, and to compare, using a reference image corresponding to the inspection measurement image composed of the n2×m2 image reference regions, the measurement image with the reference image for each image reference region.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: An inspection object is supported by a table. Light is emitted from a light source to illuminate the inspection object. An optical unit illuminates the inspection object with light, wherein the light is transmitted through the inspection object. Another optical unit illuminates the inspection object with light, wherein the light is reflected by the inspection object. Light transmitted through the inspection object is incident to a first sensor. Light reflected by the inspection object is incident to a second sensor. A defect of a pattern of the inspection object is detected using optical image data output from at least one of the sensors. A line width error is obtained by comparing line widths obtained from design data and optical image data of the pattern. A polarized beam splitter is disposed, movable between the inspection object and the first sensor, and between the inspection object and the second sensor.

Abstract: A pattern inspection method according to one aspect of the present invention includes generating a first positional deviation amount map by using data acquired by a pre-scan, generating a second positional deviation amount map by using data acquired by a full scan, generating a first positional deviation difference map by calculating a difference between the first positional deviation amount map and the second positional deviation amount map, generating a third positional deviation amount map from the first positional deviation difference map and the second positional deviation amount map, and judging existence of a value exceeding an allowable value, in values defined by the third positional deviation amount map.

Abstract: An inspection apparatus includes an optical image acquisition unit to acquire an optical image of a photomask on which a plurality of figure patterns are formed, a first measurement unit to measure a first positional deviation amount in the horizontal direction at each position on the photomask accompanying deflection of the surface of the photomask generated by supporting the photomask using a support method which is used for acquiring the optical image, a second measurement unit to measure a second positional deviation amount of each of the plurality of figure patterns, by using the optical image, and a difference map generation unit to generate a difference map in which a difference value obtained by subtracting the first positional deviation amount from the second positional deviation amount is used as a map value, with respect to a region on the surface of the photomask.

Abstract: An inspection object is supported by a table. Light is emitted from a light source to illuminate the inspection object. An optical unit illuminates the inspection object with light, wherein the light is transmitted through the inspection object. Another optical unit illuminates the inspection object with light, wherein the light is reflected by the inspection object. Light transmitted through the inspection object is incident to a first sensor. Light reflected by the inspection object is incident to a second sensor. A defect of a pattern of the inspection object is detected using optical image data output from at least one of the sensors. A line width error is obtained by comparing line widths obtained from design data and optical image data of the pattern. A polarized beam splitter is disposed, movable between the inspection object and the first sensor, and between the inspection object and the second sensor.

Abstract: An inspection method includes: irradiating a first portion of a sample to be inspected with a lighting light; obtaining a first optical image in which the lighting light transmitted through the first portion is imaged or a second optical image in which the lighting light reflected by the first optical image is imaged; based on a first defect determination threshold, performing a first comparison between a first reference image referred to the first optical image and the first optical image or a second comparison between a second reference image referred to the second optical image and the second optical image; determining whether the first portion includes a first defect; storing a first coordinate of the first defect, the first defect determination threshold, the first optical image or the second optical image, and the first reference image or the second reference image in a case where the first portion is determined to have the first defect; calculating the number of first defects in the first portion as a

Abstract: An inspection apparatus includes a lighting unit, an imaging unit, an optical image comparison unit, a map creation unit, a map storage unit, a first storage unit, a map comparison unit, and a first determination unit. The lighting unit irradiates a sample including a defect to be inspected with a lighting light. The imaging unit obtains either or both of a first optical image formed by the lighting light transmitted through the sample to be inspected and a second optical image formed by the lighting light reflected by the sample to be inspected and obtains either or both of a third optical image formed by the lighting light transmitted through the sample to be inspected and having a corrected defect and a fourth optical image formed by the lighting light reflected by the sample to be inspected and having a corrected defect.

Abstract: An inspection apparatus according to embodiments includes a lightening unit, an imaging unit, a first storage unit, a comparison unit, and a first determination unit. The lighting unit irradiates a sample including a defect to be inspected with a lighting light. The imaging unit obtains an optical image formed by the lightening light transmitted through or reflected by the sample to be inspected. The first storage unit stores information on a defect correction method for the defect. The comparison unit compares the optical image and a reference image based on the information on the defect correction method. The first determination unit determines, based on a comparison result by the comparison unit and the information on the defect correction method, whether correction of the defect is appropriate.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: A mask has an inspection region virtually divided by a plurality of stripes. A position error-correcting unit is disposed on a stage in a region different from the mask, formed with patterns divided virtually by the plurality of stripes. A first deviation amount acquiring circuit acquires a first deviation amount from the optical image and the reference image of the position error correction unit. A second deviation amount acquiring circuit acquires a second deviation amount. A position correcting circuit corrects a positional relationship between the mask and the position error correction unit based on the first deviation amount, and obtains a fluctuation value of position coordinates of each pattern in the inspection region of the mask based on the second deviation amount and corrects the position coordinates.

Abstract: A mask inspection apparatus includes an optical image acquisition unit configured to acquire an optical image by irradiating light on a mask, a reference image generation unit configured to generate a reference image from design data of the mask, a comparison circuit configured to compare the optical image with the reference image, a pattern data extraction unit configured to obtain coordinates of a defective portion determined to be defective by the comparison unit and to extract, from the design data, pattern data of a predetermined dimension range including the coordinates, and an interface unit configured to supply an aerial image measurement apparatus with information associated with the defect, the information including the defect coordinates and the extracted pattern data.

Abstract: An inspection sensitivity evaluation method includes generating a reference design image where plural figure patterns are arranged, based on reference design data, generating plural position shift design images whose positional deviation amounts are mutually different such that positions of the plural figure patterns in the reference design image are uniformly shifted, acquiring an optical image of a photo mask fabricated based on the reference design data where there is no positional deviation from the plural figure patterns, calculating a first positional deviation amount between the reference design image and the optical image, calculating plural second positional deviation amounts each of which is a respective positional deviation amount between a corresponding position shift design image of the plural position shift design images and the optical image, and acquiring a detectable positional deviation amount by using the first and the plural second positional deviation amounts.

Abstract: An inspection method comprising, virtually dividing a sample, in which a plurality of chip patterns are formed, into a plurality of strip-shaped stripes along a predetermined direction to acquire an optical image of the chip pattern in each of the stripes, performing filtering based on design data of the chip pattern to produce a reference image corresponding to the optical image, comparing the chip pattern using a die-to-database method and comparing a repetitive pattern portion in the chip pattern using a cell method, obtaining at least one of a dimension difference and a dimension ratio between a pattern of the optical image and a pattern of the reference image compared to the pattern of the optical image by the die-to-database method; and obtaining a dimension distribution of the plurality of chip patterns from at least one of the dimension difference and the dimension ratio.

Abstract: An inspection method comprising, virtually dividing a sample, in which a plurality of chip patterns are formed, into a plurality of strip-shaped stripes along a predetermined direction to acquire an optical image of the chip pattern in each of the stripes, performing filtering based on design data of the chip pattern to produce a reference image corresponding to the optical image, comparing the chip pattern using a die-to-database method and comparing a repetitive pattern portion in the chip pattern using a cell method, obtaining at least one of a dimension difference and a dimension ratio between a pattern of the optical image and a pattern of the reference image compared to the pattern of the optical image by the die-to-database method; and obtaining a dimension distribution of the plurality of chip patterns from at least one of the dimension difference and the dimension ratio.

Abstract: An inspection apparatus comprising, a light source configured to emit an inspection light, a table configured to mount an inspection target thereon, an illumination optical system configured to direct the inspection light from the light source toward the target, an objective lens unit configured to gather transmitting or reflected light generated after the illumination optical system illuminates the target with the inspection light, a light receiving unit configured to capture an optical image formed from the light illuminated through the objective lens unit, a chamber configured to house the table, light receiving unit, illumination optical system and objective lens unit, a temperature adjustment unit configured to adjust a temperature in the chamber, and a gas supply unit configured to be connected to the objective lens unit to supply an inert gas at a predetermined temperature into the unit.

Abstract: A sample, which has a mesa portion having a pattern thereon, is placed on a Z table. Light is irradiated to the mesa portion through an optical system and light reflected by the mesa portion is received to measure a height of the mesa portion. A height map of the mesa portion is created based on a height of a corner position. A height using the height map is corrected based on a deviation of a measured value from a target value, and a temporal variation of a focal position of light irradiated to the mesa portion. An optical image of the pattern is obtained based on the corrected height of the mesa portion. The optical image is compared with a reference image and a defect is determined when a difference value between the optical image and the reference image is more than a predetermined threshold value.

Abstract: An inspection apparatus includes an optical image acquisition unit to acquire an optical image of a photomask on which a plurality of figure patterns are formed, a first measurement unit to measure a first positional deviation amount in the horizontal direction at each position on the photomask accompanying deflection of the surface of the photomask generated by supporting the photomask using a support method which is used for acquiring the optical image, a second measurement unit to measure a second positional deviation amount of each of the plurality of figure patterns, by using the optical image, and a difference map generation unit to generate a difference map in which a difference value obtained by subtracting the first positional deviation amount from the second positional deviation amount is used as a map value, with respect to a region on the surface of the photomask.