Abstract: A pattern evaluation method comprising the steps of, illuminating light from a light source constituting an optical system and acquiring an optical image of a sample having a repeated pattern with a period not more than a resolution of the optical system, allocating a gradation value to each pixel of the optical image and obtaining at least one of an average gradation value for each predetermined unit region and deviation of the gradation value in the unit region, and performing at least one of a process of converting the average gradation value into average line width information in the region of the repeated pattern and a process of converting the deviation of the gradation value into roughness of the repeated pattern and creating a map representing distribution of at least one of the average line width information and the roughness with the use of an obtained converted value.

Abstract: An inspection apparatus and method, which can perform defect determination and estimate a defect on a mask and the resultant influence on a wafer. Each of the transfer images is reviewed in order of following (1) to (3): (1) when the degree of defect identified in the first comparing unit is at or exceeding a third threshold and an error ratio corresponding to the defect is at or exceeding a fourth threshold; (2) when the degree of a defect identified in the first comparing unit is less than the third threshold, and an error ratio corresponding to the defect is at or exceeding a fourth threshold; and (3) when the degree of a defect identified in the first comparing unit is at or exceeding a third threshold, and an error ratio corresponding to the defect is less than the fourth threshold.

Abstract: A measuring apparatus includes an optical image input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus, which inspects defects of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, a design data input unit to input design data of the pattern on the target object, a reference image generation unit to generate reference image data to be compared with the optical image data, by performing image development of the design data, a positional deviation distribution generation unit to generate positional deviation distribution by measuring a positional deviation amount of the pattern on the target object, by using the optical image data obtained from the pattern inspection apparatus and the reference image data having been generated, and an output unit to output generated positional deviation distribution of the pattern.

Abstract: A measuring apparatus includes an input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus which inspects a defect of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, and to input reference image data generated from design data of the pattern by the pattern inspection apparatus to be compared with the optical image data, from the pattern inspection apparatus, a positional deviation distribution generation unit to generate positional deviation distribution by measuring positional deviation of the pattern on the target object, by using the optical image data and the reference image data input from the pattern inspection apparatus, and an output unit to output generated positional deviation distribution of the pattern on the target object, wherein the measuring apparatus is arranged independently from the pattern inspection apparatus.

Abstract: An inspection sensitivity evaluation method includes generating a reference design image where plural figure patterns are arranged, based on reference design data, generating plural position shift design images whose positional deviation amounts are mutually different such that positions of the plural figure patterns in the reference design image are uniformly shifted, acquiring an optical image of a photo mask fabricated based on the reference design data where there is no positional deviation from the plural figure patterns, calculating a first positional deviation amount between the reference design image and the optical image, calculating plural second positional deviation amounts each of which is a respective positional deviation amount between a corresponding position shift design image of the plural position shift design images and the optical image, and acquiring a detectable positional deviation amount by using the first and the plural second positional deviation amounts.

Abstract: An inspection apparatus comprising, a light source configured to emit an inspection light, a table configured to mount an inspection target thereon, an illumination optical system configured to direct the inspection light from the light source toward the target, an objective lens unit configured to gather transmitting or reflected light generated after the illumination optical system illuminates the target with the inspection light, a light receiving unit configured to capture an optical image formed from the light illuminated through the objective lens unit, a chamber configured to house the table, light receiving unit, illumination optical system and objective lens unit, a temperature adjustment unit configured to adjust a temperature in the chamber, and a gas supply unit configured to be connected to the objective lens unit to supply an inert gas at a predetermined temperature into the unit.

Abstract: An inspection region of a mask is virtually divided by stripes, and a pattern on a position error correcting unit is also virtually divided by stripes. Then, a stage is moved such that all the stripes of both the mask and the position error correcting unit are continuously scanned, so that optical images of these stripes are acquired. Fluctuation values of position coordinates of the patterns formed on the position error correcting unit are acquired from the optical images of the position error correcting unit. Based upon the fluctuation values, fluctuation values of the position coordinates of the respective patterns in the inspection region of the mask are obtained so that the position coordinates are corrected. Thereafter, a map is generated from the fluctuation values of the position coordinates of the respective patterns in the inspection region of the mask.

Abstract: A first output value evaluation device obtains an average value of output values of optical image data for each of unit regions and creates a distribution map of an average value in an inspected region. A first defect history management device creates a distribution map related with the shape of the pattern from the distribution map of the average value and holds the created distribution map. A second output value evaluation device obtains at least one of a variation value and deviation of the output value of each pixel in the unit region. A defect determination device compares the obtained value with a threshold value. A second defect history management device holds information of the output value determined as a defect in the defect determination device. A defect/defect history analysis device analyzes, and checks the information from the first defect history management device and the second defect history management device.

Abstract: A pattern evaluation method comprising the steps of, illuminating light from a light source constituting an optical system and acquiring an optical image of a sample having a repeated pattern with a period not more than a resolution of the optical system, allocating a gradation value to each pixel of the optical image and obtaining at least one of an average gradation value for each predetermined unit region and deviation of the gradation value in the unit region, and performing at least one of a process of converting the average gradation value into average line width information in the region of the repeated pattern and a process of converting the deviation of the gradation value into roughness of the repeated pattern and creating a map representing distribution of at least one of the average line width information and the roughness with the use of an obtained converted value.

Abstract: A sample, which has a mesa portion having a pattern thereon, is placed on a Z table. Light is irradiated to the mesa portion through an optical system and light reflected by the mesa portion is received to measure a height of the mesa portion. A height map of the mesa portion is created based on a height of a corner position. A height using the height map is corrected based on a deviation of a measured value from a target value, and a temporal variation of a focal position of light irradiated to the mesa portion. An optical image of the pattern is obtained while controlling the Z table based on the corrected height of the mesa portion. The optical image is compared with a reference image and a defect is determined when a difference value between the optical image and reference image is more than a predetermined threshold value.

Abstract: A mask has an inspection region virtually divided by a plurality of stripes. A position error-correcting unit is disposed on a stage in a region different from the mask, formed with patterns divided virtually by the plurality of stripes. A first deviation amount acquiring circuit acquires a first deviation amount from the optical image and the reference image of the position error correction unit. A second deviation amount acquiring circuit acquires a second deviation amount. A position correcting circuit corrects a positional relationship between the mask and the position error correction unit based on the first deviation amount, and obtains a fluctuation value of position coordinates of each pattern in the inspection region of the mask based on the second deviation amount and corrects the position coordinates.

Abstract: A pattern inspection apparatus includes: an optical image acquiring unit configured to acquire optical image data of a target object on which each of a plurality of identical patterns is respectively formed at a respective corresponding position of a plurality of forming positions with distortion; a cut-out unit configured to cut out a plurality of partial optical image data from the optical image data; a correction unit configured to correct positions of the plurality of partial optical image data by using distortion information from which each amount of distortion of the plurality of identical patterns respectively formed at the respective corresponding position of the plurality of forming positions on the target object can be acquired; and a comparison unit configured to compare a plurality of corrected partial optical image data against each other on a pixel to pixel basis.

Abstract: A pattern inspection method according to one aspect of the present invention includes generating a first positional deviation amount map by using data acquired by a pre-scan, generating a second positional deviation amount map by using data acquired by a full scan, generating a first positional deviation difference map by calculating a difference between the first positional deviation amount map and the second positional deviation amount map, generating a third positional deviation amount map from the first positional deviation difference map and the second positional deviation amount map, and judging existence of a value exceeding an allowable value, in values defined by the third positional deviation amount map.

Abstract: A workpiece inspection apparatus includes a measured image generator unit configured to measure a pattern of a workpiece and generate a measured image; and a comparator unit configured to compare the measured image to a fiducial image, wherein said measured image generator unit includes a light-receiving device having an interconnection of two or more time delay integration (TDI) sensors each being arranged by two or more line sensors each being arranged by two or more pixels, for generating as the measured image an average value of pixel values excluding an abnormal pixel value from pixels of each TDI sensor with respect to a position of the pattern of the workpiece.

Abstract: An inspection apparatus and method, which can perform defect determination and estimate a defect on a mask and the resultant influence on a wafer. Each of the transfer images is reviewed in order of following (1) to (3): (1) when the degree of defect identified in the first comparing unit is at or exceeding a third threshold and an error ratio corresponding to the defect is at or exceeding a fourth threshold; (2) when the degree of a defect identified in the first comparing unit is less than the third threshold, and an error ratio corresponding to the defect is at or exceeding a fourth threshold; and (3) when the degree of a defect identified in the first comparing unit is at or exceeding a third threshold, and an error ratio corresponding to the defect is less than the fourth threshold.

Abstract: A pattern inspection apparatus includes: an optical image acquiring unit configured to acquire optical image data of a target object on which each of a plurality of identical patterns is respectively formed at a respective corresponding position of a plurality of forming positions with distortion; a cut-out unit configured to cut out a plurality of partial optical image data from the optical image data; a correction unit configured to correct positions of the plurality of partial optical image data by using distortion information from which each amount of distortion of the plurality of identical patterns respectively formed at the respective corresponding position of the plurality of forming positions on the target object can be acquired; and a comparison unit configured to compare a plurality of corrected partial optical image data against each other on a pixel to pixel basis.

Abstract: An XY stage apparatus capable of reducing a measurement error due to air fluctuations is provided. The XY stage apparatus includes a stage that moves in the XY directions, a laser interferometer to measure a position of the stage, and a measuring optical path barrel mechanism having a fixed barrel that covers at least a portion of a measuring optical path between the stage and the laser interferometer, is provided on a side of the laser interferometer of the measuring optical path, and is fixed to the laser interferometer and a movable barrel that covers at least a potion of the measuring optical path, is provided on the side of the stage of the measuring optical path, and moves together with movement of the stage, wherein an end of one of the fixed barrel and the movable barrel is inserted into that of the other.

Abstract: A fuel cell system includes a fuel tank configured to store a fuel at a pressure higher than atmospheric pressure; a vaporizer configured to vaporize the fuel; a reformer configured to reform the vaporized fuel into a hydrogen rich gas; a CO gas removal apparatus configured to remove CO gas in the hydrogen rich gas; and a cell unit configured to generate electricity by allowing the hydrogen rich gas to react to oxygen.

Abstract: A fuel cell system is provided with a fuel cell having an anode, a cathode and an electrolyte film put therebetween, a fuel supply unit supplying fuel to the anode and a gas supply unit having a pump, the pump giving negative pressure to the cathode so as to introduce gas containing oxidant to the cathode.

Abstract: A workpiece inspection apparatus includes a measured image generator unit configured to measure a pattern of a workpiece and generate a measured image; and a comparator unit configured to compare the measured image to a fiducial image, wherein said measured image generator unit includes a light-receiving device having an interconnection of two or more time delay integration (TDI) sensors each being arranged by two or more line sensors each being arranged by two or more pixels, for generating as the measured image an average value of pixel values excluding an abnormal pixel value from pixels of each TDI sensor with respect to a position of the pattern of the workpiece.