Abstract: A coil component includes an element body, a pair of terminal electrodes, and a coil. The coil includes a first wiring portion, a second wiring portion, and a connection portion. A plurality of insulating layers includes a first insulating layer constituting a principal surface, the first insulating layer including the principal surface and a facing surface facing the principal surface, the first wiring portion being disposed along the facing surface, a second insulating layer constituting a mounting surface, and one or a plurality of third insulating layers disposed between the first insulating layer and the second insulating layer. A surface roughness of the facing surface of the first insulating layer is smaller than a surface roughness of each of surfaces of the second insulating layer and the third insulating layer.

Abstract: Provided is a multilayer coil component in which a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface is located closer to an end surface in a first direction than a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface, and a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface is located closer to an end surface in the first direction than a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface.

Abstract: Provided is a multilayer coil component including an element body, a first terminal electrode, a second terminal electrode, a coil, a first connecting conductor, and a second connecting conductor, wherein a length of each of the first connecting conductor and the second connecting conductor in a first direction is longer than lengths of pillar portions connected to the first connecting conductor and the second connecting conductor in the first direction and equal to or less than lengths of the first terminal electrode and the second terminal electrode in the first direction.

Abstract: A multilayer coil component 1 includes an element body, a first terminal electrode, a second terminal electrode, a coil, a first connecting conductor, and a second connecting conductor, the coil includes first wiring portions, second wiring portions, and pillar portions, and lengths of the pillar portions in a first direction are longer than lengths of the pillar portions in a third direction.

Abstract: A laminated coil component includes an element body, a first terminal electrode and a second terminal electrode, and a coil, the coil includes a first wiring portion, a second wiring portion, and a pillar portion, the pillar portion has a first pillar member and a second pillar member alternately laminated in a second direction, and an area of a first surface and an area of a second surface of the first pillar member are larger than an area of a first surface and an area of a second surface of the second pillar member, or smaller than the area of the first surface and the area of the second surface of the second pillar member.

Abstract: A laminated coil component includes an element body, a first terminal electrode and a second terminal electrode, and a coil, the coil includes a plurality of first wiring portions disposed on a main surface side and disposed side by side in a third direction, a plurality of second wiring portions disposed on a mounting surface side and disposed side by side in the third direction, and a plurality of first pillar portions and second pillar portions that extend in a second direction and connect the first wiring portion with the second wiring portion which correspond to each other, and a width of the second wiring portion in the third direction is smaller than a width of the first wiring portion in the third direction.

Abstract: A multilayer coil component includes an element body including a main surface (a mounting surface) and a main surface, a pair of terminal electrodes disposed on the main surface of the element body, and a coil that is disposed in the element body and electrically connected to the pair of terminal electrodes, wherein the element body includes at least one element body layer containing a filler and at least one element body layer having a lower dielectric constant than the element body layer between a first wiring portion and the terminal electrodes.

Abstract: A dielectric composition contains a complex oxide represented by a composition formula of BixZnyNbzO1.75+?. x+y+z=1.00. x<0.20. 0.20?y?0.50. 0.25?x/z. A dielectric composition contains a complex oxide represented by a composition formula of BixZnyNbzO1.75+?. x+y+z=1.00. 0.20?y?0.50. 1.5<x/z?3.0. z<0.25.

Abstract: A dielectric composition including a complex oxide containing bismuth, zinc, and niobium, includes a crystal phase formed of the complex oxide and having a pyrochlore type crystal structure, and an amorphous phase. When the complex oxide is represented by a composition formula BixZnyNbzO1.75+?, in which x, y, and z satisfy relations of x+y+z=1.00, 0.20?y?0.50, and 2/3?x/z?3/2.

Abstract: Disclosed herein is a coil component that includes a resin body having a first resin-based insulating material and a second resin-based insulating material lower in relative permittivity than the first resin-based insulating material, a coil pattern embedded in the resin body and helically wound in a plurality of turns, and first and second terminal electrodes formed on a surface of the resin body and connected respectively to one and other ends of the coil pattern. The coil pattern has a part covered with the first resin-based insulating material and another part covered with the second resin-based insulating material.

Abstract: Disclosed herein is a coil component that includes a coil pattern embedded in a resin body. The resin body includes a winding core area surrounded by the coil pattern and having a first surface and a substantially flat second surface different in the circumferential direction position from the first surface, and a first surrounding area covering the first surface of the winding core area. The coil pattern includes first sections extending along the first surface of the winding core area and second sections extending along the second surface of the winding core area. One ends of the first sections are connected respectively to their corresponding one ends of the second sections. The other ends of the first sections are connected respectively to their corresponding other ends of the second sections.

Abstract: Disclosed herein is a coil component that includes a coil pattern embedded in an element body and helically wound in a plurality of turns. The element body includes a support body having a cavity formed therein and a first insulating layer stacked on the support body so as to cover the cavity, thereby forming a hollow space inside the element body. The coil pattern includes a plurality of first sections formed along an inner wall of the cavity and a plurality of second sections formed on the first insulating layer. One ends of the plurality of first sections are connected respectively to their corresponding one ends of the plurality of second sections. The other ends of the plurality of first sections are connected respectively to their corresponding other ends of the plurality of second sections.

Abstract: A dielectric composition including a complex oxide containing bismuth, zinc, and niobium, includes a crystal phase formed of the complex oxide and having a pyrochlore type crystal structure, and an amorphous phase. When the complex oxide is represented by a composition formula BixZnyNbzO1.75+?, in which x, y, and z satisfy relations of x+y+z=1.00, 0.20?y?0.50, and 2/3?x/z?3/2.

Abstract: A dielectric composition contains a complex oxide represented by a composition formula of BixZnyNbzO1.75+?. x+y+z=1.00. x<0.20. 0.20?y?0.50. 0.25?x/z. A dielectric composition contains a complex oxide represented by a composition formula of BixZnyNbzO1.75+?. x+y+z=1.00. 0.20?y?0.50. 1.5<x/z?3.0. z<0.25.

Abstract: A method of manufacturing a layered chip package that includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of layer portions. The method includes fabricating a plurality of substructures, and completing the layered chip package by fabricating the main body using the plurality of substructures and by forming the wiring on the main body.

Abstract: A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number.

Abstract: A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions.

Abstract: A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. The insulating portion has an end face located at the side surface of the main body on which the wiring is disposed. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed.

Abstract: The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.

Abstract: A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number.