Abstract: A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of first-type layer portions each including a first-type semiconductor chip; and a second-type layer portion including a second-type semiconductor chip. The first-type semiconductor chip includes a plurality of memory cells. The second-type semiconductor chip includes a control circuit that controls writing and reading on and from the memory cells included in the plurality of first-type layer portions. Each layer portion includes an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. Each of the electrodes has an end face that is located at the side surface of the main body and connected to the wiring.

Abstract: A terminal electrode body on a substrate is exposed relative to a resin layer, protruding out beyond the side of the resin layer. That is, the terminal electrode body is not covered by the resin layer. The electronic element is covered by an insulating layer and the terminal electrode body and the electronic element are electrically connected. Hence, an electric signal applied to the terminal electrode body can be transmitted to the electronic element. A cover layer covers the terminal electrode body and the boundary between the terminal electrode body and the resin layer.

Abstract: The invention relates to a common mode choke coil and a method of manufacturing the same and provides a compact, low-profile, and low-cost common mode choke coil and a method of manufacturing the same. A common mode choke coil has a general outline in the form of a rectangular parallelepiped provided by forming an insulation layer, a first helical coil unit, a second helical coil unit, and a closed magnetic path on a silicon substrate made of a single-crystal using thin film forming techniques. The first and second helical coil units are formed such that their axes of spiral extend substantially parallel to a substrate surface of the silicon substrate.

Abstract: The invention relates to a coil component used as a main component of a common mode choke coil or a transformer and a method of manufacturing the same, and the invention is aimed at providing a coil component with a small size and a low height having high differential transmission characteristics and a method of manufacturing the same. A common mode choke coil has a configuration in which an insulation film, a coil conductor, another insulation film, another coil conductor and another insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. The coil conductors have a coil section which is in a trapezoidal general configuration. A top portion of the coil section is formed in a convex configuration such that it bulges in the form of a convex, and a bottom portion of the coil section is formed in a planar configuration.

Abstract: The invention relates to a method of manufacturing a coil component uses as a major part of a common mode choke coil or a transformer, and there is provided a method of manufacturing a compact and low height coil component in which deterioration of impedance characteristics is low and reliability is high. An insulating film is formed on a magnetic substrate, and open regions are formed in the insulating film. A lead terminal portion is formed on the insulating film, and a planarizing film is formed on the open regions. An insulating film is formed and openings are formed in the insulating film at the open regions. A coil conductor is formed on the insulating film, and a planarizing film is further formed on the planarizing film. After a coil conductor is further formed on the coil conductor through the insulating film, the planarizing films are removed.

Abstract: Each of first and second coil conductors has a spiral form and is disposed between first and second magnetic substrates. The first and second coil conductors include first parts arranged so as to extend along each other with a predetermined gap therebetween on a first insulating layer, and second parts intersecting each other three-dimensionally. The first and second coil conductors intersect each other in their middle part as seen from a direction orthogonal to the principal face of the first magnetic substrate (second magnetic substrate).

Abstract: The invention relates to a coil component used as a major component of a common mode choke coil or transformer and a method of manufacturing the same, and the invention is aimed at providing a compact and low-profile coil component having a high common mode filtering property and a method of manufacturing the same. A common mode choke coil has a configuration in which a first insulation film, a first coil conductor, a second insulation film, a second coil conductor and a third insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. A top portion of the first coil conductor is formed in a convex shape. The second insulation film is formed so as to follow the shape of the top portion of the first coil conductor. A bottom portion of the second coil conductor is formed in a concave shape such that it follows the shape of a top portion of the second insulation film.

Abstract: The invention relates to a common mode choke coil and a method of manufacturing the same and provides a compact, low-profile, and low-cost common mode choke coil and a method of manufacturing the same. A common mode choke coil has a general outline in the form of a rectangular parallelepiped provided by forming an insulation layer, a first helical coil unit, a second helical coil unit, and a closed magnetic path on a silicon substrate made of a single-crystal using thin film forming techniques. The first and second helical coil units are formed such that their axes of spiral extend substantially parallel to a substrate surface of the silicon substrate.

Abstract: The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.

Abstract: There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.

Abstract: There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.

Abstract: The invention relates to a coil component used as a major component of a common mode choke coil or transformer and a method of manufacturing the same, and the invention is aimed at providing a compact and low-profile coil component having a high common mode filtering property and a method of manufacturing the same. A common mode choke coil has a configuration in which a first insulation film, a first coil conductor, a second insulation film, a second coil conductor and a third insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. A top portion of the first coil conductor is formed in a convex shape. The second insulation film is formed so as to follow the shape of the top portion of the first coil conductor. A bottom portion of the second coil conductor is formed in a concave shape such that it follows the shape of a top portion of the second insulation film.

Abstract: The invention relates to a coil component used as a main component of a common mode choke coil or a transformer and a method of manufacturing the same, and the invention is aimed at providing a coil component with a small size and a low height having high differential transmission characteristics and a method of manufacturing the same. A common mode choke coil has a configuration in which an insulation film, a coil conductor, another insulation film, another coil conductor and another insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. The coil conductors have a coil section which is in a trapezoidal general configuration. A top portion of the coil section is formed in a convex configuration such that it bulges in the form of a convex, and a bottom portion of the coil section is formed in a planar configuration.

Abstract: There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.

Abstract: The invention relates to a method of manufacturing a coil component uses as a major part of a common mode choke coil or a transformer, and there is provided a method of manufacturing a compact and low height coil component in which deterioration of impedance characteristics is low and reliability is high. An insulating film is formed on a magnetic substrate, and open regions are formed in the insulating film. A lead terminal portion is formed on the insulating film, and a planarizing film is formed on the open regions. An insulating film is formed and openings are formed in the insulating film at the open regions. A coil conductor is formed on the insulating film, and a planarizing film is further formed on the planarizing film. After a coil conductor is further formed on the coil conductor through the insulating film, the planarizing films are removed.

Abstract: Each of first and second coil conductors has a spiral form and is disposed between first and second magnetic substrates. The first and second coil conductors include first parts arranged so as to extend along each other with a predetermined gap therebetween on a first insulating layer, and second parts intersecting each other three-dimensionally. The first and second coil conductors intersect each other in their middle part as seen from a direction orthogonal to the principal face of the first magnetic substrate (second magnetic substrate).