Abstract: An electromagnetic field distribution measurement apparatus (10) according to the present invention includes: an electromagnetic field probe (20) for measuring an electromagnetic field distribution; a scan apparatus (30) for scanning the vicinity of a wiring (120) with the electromagnetic field probe (20) ; and a data processing apparatus (50) for calculating the offset value (?Xd) of the coordinate of the electromagnetic field probe (20) from the coordinate of the wiring (120). The data processing apparatus (50) extracts a characteristic point (E1 to E3) of the measured electromagnetic field distribution and calculates the offset value (?Xd) based on the coordinates of the extracted characteristic point (E1 to E3).

Abstract: An electric field sensor or a magnetic field sensor includes an optical fiber and an electro-optic layer or a magneto-optic layer. The electro-optic layer or a magneto-optic layer is provided on an end surface of an end portion of the optical fiber. The end surface of the optical fiber is a convex shape. The optical fiber may have the end portion with a shape of a substantial cone formed by extending the end portion, and the electro-optic layer or the magneto-optic layer may be formed on a side surface of a front end of the substantial cone. A dielectric layer may be further included between the optic layer and the end surface.

Abstract: An electric field sensor is obtained by directly forming an electrooptical film of Fabry-Perot resonator structure on a polished surface at a tip of an optical fiber by an aerosol deposition method.

Abstract: (Problem) This invention provides a high-purity, high-concentrated silica sol with long-term stability and low viscosity by preventing viscosity-increase after production, and method for producing the same. This invention provides the high-purity and high-concentrated silica sol that does not undergo a viscosity-increase or gelation in spite of any particle size differences of silica. This is obtained by adding a dispersing agent at a specific concentration to the reaction solution or solvent substitution-concentrated solution in the production process. (Means to Solve Problems) A silica sol produced by an alkoxide method, wherein said silica sol comprises at least a dispersing agent and silica, wherein said dispersing agent concentration is 10-3000 ppm with respect to the silica, wherein said dispersing agent consists of one or more compounds selected from inorganic acid, inorganic acid salt, organic acid and organic acid salt whose degradation temperature and boiling point are both 60° C.

Abstract: Two coil forming elements (12, 14) formed of conductor layers and a contact means (19), which is formed in an interlayer dielectric film (13) interposed between the conductor layers and brings the upper and lower coil forming elements into contact with each other through a via hole form a stacked coil (10). One end of the stacked coil is connected to an upper grounding layer (27) of a strip line (20), and the other end of the stacked coil is connected to a strip conductor (23) of the strip line. The number of turns of the stacked coil is larger than 1. A magnetic flux penetrating through the stacked coil increases to be able to induce a relatively large electromotive force. Thus, a high spatial resolution can be obtained easily.

Abstract: Two coil forming elements (12, 14) formed of conductor layers and a contact means (19), which is formed in an interlayer dielectric film (13) interposed between the conductor layers and brings the upper and lower coil forming elements into contact with each other through a via hole form a stacked coil (10). One end of the stacked coil is connected to an upper grounding layer (27) of a strip line (20), and the other end of the stacked coil is connected to a strip conductor (23) of the strip line. The number of turns of the stacked coil is larger than 1. A magnetic flux penetrating through the stacked coil increases to be able to induce a relatively large electromotive force. Thus, a high spatial resolution can be obtained easily.

Abstract: An electronic apparatus comprises a function module having a multilayer wiring unit including a first signal wiring corresponding to an internal layer wiring, a first signal via, a first reference potential wiring, a first signal pad to which the first signal wiring is connected through the first signal via, a first reference potential pad that surrounds the periphery of the first signal pad and to which the first reference potential wiring is connected, and a first reference potential connected to the first reference potential pad; a inultilayer circuit board; a first conductor; and a second conductor.

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: The present invention provides a device for detecting a magnetic field comprising: a dielectric body; an electrically conductive pattern; and an electrically conductive ground region. The electrically conductive pattern so extends in the dielectric body as to form a dielectric looped face at least partially surrounded by the electrically conductive pattern, and the electrically conductive pattern having a first end electrically connected to an external electrically conductive line and a second end. The electrically conductive ground region is formed in the dielectric body. The electrically conductive ground region is electrically connected to the second end of the electrically conductive pattern and is electrically isolated from other parts of the electrically conductive pattern than the second end, so that the electrically conductive ground region serves as a ground to the electrically conductive pattern.

Abstract: An electronic apparatus comprises a function module having a multilayer wiring unit including a first signal wiring corresponding to an internal layer wiring, a first signal via, a first reference potential wiring, a first signal pad to which the first signal wiring is connected through the first signal via, a first reference potential pad that surrounds the periphery of the first signal pad and to which the first reference potential wiring is connected, and a first reference potential via connected to the first reference potential pad; a multilayer circuit board including a second signal wiring corresponding to an internal layer wiring, a second signal via, a second reference potential wiring, a second signal pad to which one end of the second signal wiring is connected through the second signal via, a second reference potential pad that surrounds the periphery of the second signal pad and to which one end of the second reference potential wiring is connected, a second reference potential via connected to th

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are sup

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: A triplate stripline on a multilayer circuit board includes an inner conductor sandwiched between two ground patterns having a finite pattern width that is 10 times the pattern width of said inner conductor or less. The two ground patterns are short-circuited on opposite transverse ends thereof by a plurality of vias disposed in a longitudinal direction which is a signal transmitting direction of the stripline. An adjacent stripline is of the same structure as the triplate stripline. Each of the striplines has a cross-sectional shape in which one inner conductor is surrounded by the two ground patterns and the vias on the opposite sides. The inner conductor is thus prevented from suffering ambient electromagnetic noise and electromagnetic interference such as crosstalk or the like.

Abstract: A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are sup

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: A magnetic field sensor has a first conductor, a first insulating film, a second conductor, a second insulating film and a third conductor. The first conductor is composed of a “C-shaped” portion, which is formed in a C-like shape, and a linear portion, which is connected to one side of the “C-shaped” portion which is opposite to a gap of the “C-shaped” portion. The first insulating film is formed on the first conductor and has a hole in a predetermined position. The second conductor is formed in a ladle-like shape, and is formed on the first insulating film such that its one side corresponding to the front end of the ladle overlaps with a straight line, through which an outer edge of one end and an outer edge of the other end of the “C-shaped” portion.

Abstract: A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are sup