Abstract: A memory device includes pages each including memory cells arranged in columns in plan view on a substrate, and voltages applied to first and second gate conductor layers and first and second impurity regions in each memory cell are controlled to retain a group of positive holes, generated by an impact ionization phenomenon, inside a semiconductor body. The first and second impurity regions are connected to source and bit lines, the first and second gate conductor layers are connected to word and plate lines, and voltages applied to these lines are controlled to perform a page write operation, a page erase operation, and a page read operation. In the page write operation, the group of positive holes are retained inside the semiconductor body at a first time, and a page write post-processing operation of making a group of excess positive holes disappear is performed at a second time.

Abstract: A dynamic flash memory includes a p layer as a semiconductor base material; first and second n+ layers extending on opposite sides thereof; a first gate insulating layer partially covering the p layer; a first gate conductor layer provided thereon; a second gate insulating layer provided in contact with the first gate insulating layer and partially covering the p layer; and a second gate conductor layer provided on the second gate insulating layer and electrically isolated from the first gate conductor layer. The first and second n+ layers, and the first and second gate conductor layers are respectively connected to a source line, a bit line, a word line, and a plate line. A voltage applied to each terminal during memory erasing is always greater than or equal to 0 V such that 2 V and 0.6 V are respectively applied to the plate line and the bit line.

Abstract: A memory device according to the present invention includes memory cells each of which is formed of a semiconductor body that stands on a substrate in a vertical direction relative to the substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity region, and a second impurity region of the memory cell are controlled to perform a write operation of retaining a group of positive holes, generated by an impact ionization phenomenon or a gate-induced drain leakage current, inside a semiconductor body, and the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity region, and the second impurity region are controlled to perform an erase operation of discharging the group of positive holes from inside the semiconductor body.

Abstract: Provided is dynamic flash memory for performing data write, read, and erase operations by controlling a voltage applied to each of a source line, a plate line, word lines, and bit lines. The memory is formed by forming on a substrate a first N+ layer, which connects to the source line, and second N+ layers, which connect to the bit lines, at opposite ends of Si pillars standing is the upright position along the vertical direction; and forming a SiO2 layer, which is located between a first TiN layer surrounding a first gate HfO2 layer surrounding the lower portion of the Si pillars, is continuous around the Si pillars, and connects to the plate line, and second TiN layers surrounding a second gate HfO2 layer surrounding the upper portion of the Si pillars and respectively connecting to the word lines, by oxidizing a doped semiconductor layer or conductor layer.

Abstract: A first Si pillar and a second Si pillar are disposed above a substrate. The first Si pillar stands in a perpendicular direction. In plan view, the outer periphery line of the second Si pillar is located inside the outer periphery line of the first Si pillar. An N+ layer connected to a source line and an N+ layer connected to a bit line are disposed at both ends of the first and second Si pillars. A first gate insulating layer surrounds the first Si pillar. A first gate conductor layer surrounds the first gate insulating layer and is connected to a plate line. A second gate conductor layer surrounds a gate HfO2 layer surrounding the second Si pillar and is connected to a word line.

Abstract: A semiconductor element memory device is configured to perform a data hold operation of controlling voltages to be applied to a plate line, a word line, a source line, and a bit line to hold, in a semiconductor base, a positive hole group formed by an impact ionization phenomenon or a gate-induced drain leakage current, and a data erase operation of controlling voltages to be applied to the plate line, the word line, the source line, and the bit line to discharge the positive hole group from the semiconductor base. The semiconductor element memory device includes a plurality of memory cells arranged in a matrix within a block, and constantly manages, using a controller circuit and a logical/physical conversion table, which physical block address of a dynamic flash memory corresponds to data stored in a logical block address.

Abstract: A memory device includes pages arranged in columns and each constituted by a plurality of memory cells on a substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity region, and a second impurity region in each memory cell included in each of the pages are controlled to perform a page write operation of retaining, inside a channel semiconductor layer, a group of positive holes generated by an impact ionization phenomenon or by a gate-induced drain leakage current, and the voltages applied to the first gate conductor layer, the second gate conductor layer, the third gate conductor layer, the fourth gate conductor layer, the first impurity region, and the second impurity region are controlled to perform a page erase operation of discharging the group of positive holes from inside the channel semiconductor layer.

Abstract: A semiconductor-element-including semiconductor memory device includes a block in which a plurality of memory cells CL00 to CL13 are arranged in a matrix, in which a data retention operation is performed in which voltages applied to plate lines PL0 and PL1, word lines WL0 and WL1, a source line SL, and bit lines BL0 to BL3 are controlled to retain a group of positive holes, generated by an impact ionization phenomenon or a gate-induced drain leakage current, inside a semiconductor body, and a data erase operation is performed in which the voltages applied to the plate lines PL0 and PL1, the word lines WL0 and WL1, the source line SL, and the bit lines BL0 to BL3 are controlled to discharge the group of positive holes from inside the semiconductor body and the voltage of the semiconductor body is lowered with capacitive coupling with the plate lines PL0 and PL1 and capacitive coupling with the word lines WL0 and WL1.

Abstract: There is provided a columnar semiconductor memory device in which a data retention operation is performed in which voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity region, and a second impurity region are controlled to retain a group of positive holes, generated by an impact ionization phenomenon or a gate-induced drain leakage current, inside a semiconductor body, and a data erase operation is performed in which the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity region, and the second impurity region are controlled to discharge the group of positive holes from inside the semiconductor body and the voltage of the semiconductor body is lowered with capacitive coupling with the first gate conductor layer and capacitive coupling with the second gate conductor layer.

Abstract: By controlling voltages applied to plate lines, word lines, source lines, and bit lines, a memory device that uses semiconductor elements performs a data retention operation of holding positive hole groups formed by an impact ionization phenomenon or by a gate-induced drain leakage current in a semiconductor base material, and a memory erase operation of removing positive hole groups from inside the semiconductor base material. The memory device also performs a data erase operation during the memory erase operation to remove positive hole groups from inside the semiconductor base material of all the memory cells in a block made up of the memory cells, which are arrayed in a matrix.

Abstract: A memory apparatus includes a page including a plurality of memory cells arranged in a column on a substrate. Each of voltages applied to first and second gate conductor layers and first and second impurity layers in each memory cell included in the page is controlled to perform a page write operation of retaining holes, which have been formed through an impact ionization phenomenon or using a gate induced drain leakage current, in a semiconductor base material, or each of voltages applied to the first and second gate conductor layers, third and fourth gate conductor layers, and the first and second impurity layers is controlled to perform a page erase operation of removing the holes from the semiconductor base material, and to input page data for the page write operation to a sense amplifier circuit during the page erase operation.

Abstract: A memory device uses semiconductor elements. By controlling voltages applied to plate lines, word lines, source lines, and bit lines, the memory device performs a data write operation of holding positive hole groups formed by an impact ionization phenomenon or by a gate-induced drain leakage current in a semiconductor base material, and a data erase operation of removing positive hole groups from inside the semiconductor base material. The memory device includes a block made up of memory cells, which are arrayed in a matrix. Storage data of memory cells connected with a first word line, i.e., a selected one of the word lines, in the block is read to the bit lines by applying a first voltage to the first word line, and a second voltage to a second word line adjacent to the first word line.

Abstract: A data retention operation of holding positive hole groups generated by an impact ionization phenomenon or by a gate-induced drain leakage current in a semiconductor base body is performed by controlling voltages applied to plate lines, word lines, a source line, odd-numbered bit lines, and even-numbered bit lines; and a data erase operation is performed by removing positive hole groups from inside the semiconductor base body by controlling the voltages applied to plate lines, word lines, source line, odd-numbered bit lines, and even-numbered bit lines and lowering a voltage of The semiconductor base body by means of capacitive coupling between the plate lines and word lines. A block is made up of memory cells arrayed in a matrix, and storage data is read from the memory cells in the block alternately to the odd-numbered bit lines and even-numbered bit line.

Abstract: A memory device includes pages arranged in columns and each constituted by a plurality of memory cells on a substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity layer, and a second impurity layer in each memory cell included in each of the pages are controlled to perform a page write operation of retaining, inside a channel semiconductor layer, a group of positive holes generated by an impact ionization phenomenon or by a gate-induced drain leakage current, the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity layer, and the second impurity layer are controlled to perform a page erase operation of discharging the group of positive holes from inside the channel semiconductor layer, the first impurity layer of the memory cell is connected to a source line, the second impurity layer thereof is connected to a bit line, one of the first gate conductor layer or the second gate conductor layer is connected t

Abstract: A memory device includes a plurality of pages arranged in columns, each page is constituted by a plurality of memory cells arranged in rows on a substrate, the memory cells included in the page are memory cells of a plurality of semiconductor base materials that stand on the substrate in a vertical direction or that extend in a horizontal direction along the substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity layer, and a second impurity layer in each memory cell are controlled to perform a page write operation of retaining, inside a channel semiconductor layer, a group of positive holes generated by an impact ionization phenomenon or by a gate-induced drain leakage current, the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity layer, and the second impurity layer are controlled to perform a page erase operation of discharging the group of positive holes from inside the channel semiconductor layer, a

Abstract: A first semiconductor layer 1 is formed on a substrate, a first impurity layer 3 and a second impurity layer 4 extending in a vertical direction are sequentially disposed on part of the first semiconductor layer 1, their sidewalls and the semiconductor layer 1 are covered by a second gate insulating layer 2, a gate conductor layer 22 and a second insulating layer are disposed in a groove formed there, and a second semiconductor layer 7, n+ layers 6a and 6c positioned at respective ends of the layer 7 and connected to a source line SL and a bit line BL, respectively, a second gate insulating layer 8 formed to cover the second semiconductor layer 7, and a second gate conductor layer 9 connected to a word line WL are disposed on the second impurity layer.

Abstract: A contact hole is formed on a boundary region between an N+ layer connected to a bottom part of a Si pillar forming a select transistor SGT and a P+ layer connected to a bottom part of a Si pillar forming a load transistor SGT on an X-X? line and on a gate TiN layer surrounding a Si pillar forming a load transistor SGT on an XX-XX? line in an SRAM cell. A conductor W layer is formed in a bottom part of the contact hole. A SiO2 layer including a hole is formed inside the contact hole on the W layer.

Abstract: A memory device includes pages including memory cells arranged on a substrate. Voltages applied to first and second gate conductor layers and first and second impurity regions in each memory cell are controlled to retain a group of positive holes. The first and second impurity regions and first and second gate conductor layers are connected to source, bit, plate, and word lines. In a page write operation, a channel semiconductor layer is at a first data retention voltage. In a page erase operation, the group of positive holes are discharged by controlling the voltages, the channel semiconductor layer is at a second data retention voltage, a positive voltage pulse is applied to at least one of the word and plate lines of a selected page, and a ground voltage is applied to the word and plate lines of a non-selected page and to all of the source and bit lines.

Abstract: P+ layers which entirely cover top parts of Si pillars and which surround the Si pillars at equal widths in a plan view are formed by self-alignment with the Si pillars, W layers are formed on the P+ layers, a band-shaped contact hole which is in contact with respective partial regions of the W layers and which extends in the Y direction is formed, and a supply wiring metal layer is formed by filling the band-shaped contact hole. The partial regions of the W layers are shaped so as to protrude to outside of the band-shaped contact hole in a plan view.

Abstract: A p layer extending in a direction horizontal to a substrate is provided separately from the substrate. An n+ layer and an n layer are provided on respective sides of the layer. A gate insulating layer partially covers the layers. A gate conductor layer partially covers the layer. A gate insulating layer partially covering the layer is provided separately from the layer. A gate conductor layer partially covers the layer. An n+ layer is provided at part of the p layer between the layers. The layers are connected to a bit line, a control line, a word line, a plate line, and a source line, respectively. Memory operation of a dynamic flash memory cell is performed by manipulating voltage of each line.