Abstract: An ESD protection component includes a ceramic material and a BGA or LGA termination. In addition, an ESD protection component includes a basic body with a lower side. The basic body includes a ceramic material. At least one floating inner electrode is located at a distance from the lower side of two to 100 ceramic grains. Also a component includes a carrier, on which an LED and an ESD protection component are arranged.

Abstract: A piezoelectric multilayer component includes a stack of sintered piezoelectric layers and inner electrodes that are arranged there between. A piezoelectric layer includes at least one piezoelectric film. At least one of the piezoelectric films is designed as a weakening film, wherein the thickness of the weakening film is substantially smaller than the thickness of at least one of the other piezoelectric films.

Abstract: A piezoelectric component includes a stack of piezoelectric layers arranged one on top of the other and first and second electrode layers arranged therebetween. The stack includes at least one first piezoelectric layer having a first electrical coercive force and directly adjacent thereto at least one second piezoelectric layer having a second electrical coercive force different from the first coercive force.

Abstract: The invention relates to a piezoelectric multilayer component as an intermediate, which comprises a stack of piezoelectric layers arranged on top of one another. The stack comprises an active region having electrode layers arranged between the piezoelectric layers and at least one inactive region, wherein the active region on the end product of the piezoelectric multilayer component is provided for the purpose of deforming when a voltage is applied to the electrode layers. The inactive region contains at least one sacrificial layer which comprises an electrically insulating material and a metal, wherein the metal can diffuse at least partially from the sacrificial layer into the piezoelectric layers of the inactive region by heating the multilayer component.

Abstract: A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.

Abstract: A piezoelectric multilayer component has a stack of green piezoceramic layers arranged one on top of the other. A first electrode layer is applied onto a piezoceramic layer and contains a first metal. A structured sacrificial layer is applied onto a further piezoceramic layer, adjacent to the first electrode layer in the stacking direction, and contains a higher concentration of the first metal than does the first electrode layer. When the intermediate product is sintered, the first metal diffuses from the structured sacrificial layer to the first electrode layer and in the process leaves cavities which form a weak layer.

Abstract: A piezoelectric multilayer component includes a stack of piezoceramic layers, which are arranged one on top of the other, and electrode layers. The stack has a first area and a second area. The second area contains a disturbance material, which is used to make the second area less mechanically robust than the first area.

Abstract: A piezoelectric multilayer component includes a stack of sintered piezoelectric layers and inner electrodes that are arranged there between. A piezoelectric layer includes at least one piezoelectric film. At least one of the piezoelectric films is designed as a weakening film, wherein the thickness of the weakening film is substantially smaller than the thickness of at least one of the other piezoelectric films.

Abstract: A piezoelectric component includes a stack of piezoelectric layers arranged one on top of the other and first and second electrode layers arranged therebetween. The stack includes at least one first piezoelectric layer having a first electrical coercive force and directly adjacent thereto at least one second piezoelectric layer having a second electrical coercive force different from the first coercive force.

Abstract: A piezoelectric multilayer component includes a stack of piezoceramic layers, which are arranged one on top of the other, and electrode layers. The stack has a first area and a second area. The second area contains a disturbance material, which is used to make the second area less mechanically robust than the first area.

Abstract: A piezoelectric multilayer component includes a stack of piezoceramic layers, which are arranged one on top of the other, and electrode layers. The stack has a first area and a second area. The second area contains a disturbance material, which is used to make the second area less mechanically robust than the first area.

Abstract: A piezoelectric multilayer component has a base body with a stack of piezoceramic layers and electrode layers arranged one on top of the other in an alternating manner. Neighboring layers of the stack are braced against one another such that stresses run perpendicular to the stacking direction.

Abstract: A piezoelectric multilayer component includes a stack of green piezoceramic layers which are arranged one on top of the other. A first electrode layer is applied to a piezoceramic layer and contains a first metal. A second electrode layer is applied to a further piezoceramic layer and is adjacent to the first electrode layer in the stacking direction. The second electrode layer contains a higher concentration of the first metal than does the first electrode layer.

Abstract: A piezoelectric multilayer component includes a stack of piezoceramic layers, which are arranged one on top of the other, and electrode layers. The stack has a first area and a second area. The second area contains a disturbance material, which is used to make the second area less mechanically robust than the first area.

Abstract: A piezoelectric multilayer component has a stack of green piezoceramic layers arranged one on top of the other. A first electrode layer is applied onto a piezoceramic layer and contains a first metal. A structured sacrificial layer is applied onto a further piezoceramic layer, adjacent to the first electrode layer in the stacking direction, and contains a higher concentration of the first metal than does the first electrode layer. When the intermediate product is sintered, the first metal diffuses from the structured sacrificial layer to the first electrode layer and in the process leaves cavities which form a weak layer.

Abstract: A piezoelectric multilayer component has a base body with a stack of piezoceramic layers and electrode layers arranged one on top of the other in an alternating manner. Neighboring layers of the stack are braced against one another such that stresses run perpendicular to the stacking direction.

Abstract: The invention relates to a method for the protection of openings in a component, produced from an electrically-conducting material, in particular, from metal or a metal alloy, during a machining process against the ingress of material, whereby the openings are sealed with a filler material before the machining process, which is removed again after the machining process. The machining processes particularly concern coating processes and welding processes. Said method is characterized in that an electrically-conducting filler material is applied, the electrical conductivity of which matches the electrical conductivity of the base material.

Abstract: Masking layers for components according to the prior art react with the base material of the component and/or are difficult to remove again. The component according to the invention has a masking layer which can very easily be removed following coating of the components, since on the one hand the bonding between the masking layer and the base material of the component is poor, or the masking layer can easily be removed through penetration of a liquid.

Abstract: A plastic compound includes at least one polymer and at least one organic starting compound having a decomposition temperature Tz and formed of at least one ceramic material comprising a glass and/or a starting material of glass. Also, the plastic compound includes at least one glass material for forming a glass ceramic with the aid of the at least one ceramic material, the glass having a glass transition point Tg that substantially corresponds to the decomposition temperature Tz of the organic starting compound.

Abstract: Masking layers for components according to the prior art react with the base material of the component and/or are difficult to remove again. The component according to the invention has a masking layer which can very easily be removed following coating of the components, since on the one hand the bonding between the masking layer and the base material of the component is poor, or the masking layer can easily be removed through penetration of a liquid.