Abstract: An information reproduction and recording apparatus able to prevent invalid data not required for recording from being recorded on a recording medium when transferring reproduced information by a small number of signal lines such as a three-line serial peripheral interface, wherein a music data reproducing unit outputs a data signal DATA and clock signals LRCK and BCK to a valid recording period control unit and outputs a SPACE signal to the valid recording period control unit while outputting music data containing track interval data, the signals are transferred to a high speed encoder and the data signal DATA is encoded and recorded on a hard disk by an HDD based on the clock signals LRCK and BCK while the SPACE signal is being output, and the valid recording period control unit suspends transfer of the clock signal LRCK and prevents recording of invalid data on the hard disk while the SPACE signal is not being output.

Abstract: A semiconductor device includes a semiconductor substrate on which a structure portion is provided except a peripheral portion thereof, and has a laminated structure including low dielectric films and wiring lines, the low dielectric films having a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400° C. or higher. An insulating film is formed on the structure portion. A connection pad portion is arranged on the insulating film and connected to an uppermost wiring line of the laminated structure portion. A bump electrode is provided on the connection pad portion. A sealing film made of an organic resin is provided on a part of the insulating film which surrounds the pump electrode. Side surfaces of the laminated structure portion are covered with the insulating film and/or the sealing film.

Abstract: A semiconductor device includes a semiconductor substrate having an integrated circuit. A low dielectric film wiring line laminated structure portion is provided on the semiconductor substrate except a peripheral portion thereof, and is constituted by low dielectric films and wiring lines. The low dielectric film has a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400° C. or higher. An insulating film is formed on the laminated structure portion. A connection pad portion is arranged on the insulating film and connected to a connection pad portion of an uppermost wiring line of the laminated structure portion. A bump electrode is provided on the connection pad portion. A sealing film is provided on the insulating film which surrounds the pump electrode and on the peripheral portion of the semiconductor substrate. The side surfaces of the laminated structure portion are covered with the insulating film or the sealing film.

Abstract: A desulfurizing agent is produced by mixing a copper compound, a zinc compound and an ammonium compound with an aqueous solution of an alkali substance to prepare or precipitate followed by calcitrating the resulting precipitate to form a calcined precipitate into a shape form of a copper oxide-zinc oxide-aluminum oxide mixture. The shaped form is impregnated with iron or nickel and calcined to produce a calcined oxide and reduced with hydrogen to form a sulfur-absorption desulfurizing agent.

Abstract: The invention provides a method for operating a reformed gas production apparatus with which it is possible to achieve a high reforming efficiency while preventing a drop in catalyst activity due to the deposition of carbon. The reformed gas production method uses a reforming catalyst to reform a fuel that contains a hydrocarbon having at least two carbon atoms to produce a reformed gas that includes methane, hydrogen, and carbon monoxide. With this method, a fluid that includes the fuel, at least one of steam and a carbon dioxide-containing gas, and an oxygen-containing gas, is supplied to a reforming reaction region, and with the thermal decomposition index temperature of the fuel, which is determined by the type and the concentration of the hydrocarbons having at least two carbon atoms that make up the fuel, serving as an upper limit temperature of the reforming reaction region, the fluid is brought into contact with the reforming catalyst to produce the reformed gas.

Abstract: A radio wave absorber that can be bonded securely to a flexible cable or a flexible printed circuit board eliminates the need for a release film. A radio wave absorber comprising a thermosetting adhesive sheet 1 that is cured into a flexible material, and a Sendust-containing curable resin composition layer 2 that is cured into a flexible material, wherein the curable resin composition layer is formed on either surface of the thermosetting adhesive sheet. The average particle diameter of Sendust is in the range of 30 to 100 ?m. The content ratio of Sendust in the curable resin composition layer is in the range of 50 to 85 wt %.

Abstract: A semiconductor device includes a semiconductor substrate and low dielectric film wiring line laminated structure portions which are provided in regions on the semiconductor substrate except a peripheral portion thereof. Each of the laminated structure portions has a laminated structure of low dielectric films and a plurality of wiring lines. An insulating film is provided on an upper side of the laminated structure portion. Connection pad portions for electrodes are arranged on the insulating film to be electrically connected to the connection pad portions of uppermost wiring lines of the laminated structure portion. Bump electrodes for external connection are provided on the connection pad portions for the electrodes. A sealing film is provided on the insulating film and on the peripheral portion of the semiconductor substrate. Side surfaces of the laminated structure portions are covered with the insulating film or the sealing film.

Abstract: This invention provides a rubber composition and an electromagnetic wave absorbing sheet that can realize excellent electromagnetic wave absorbance properties while only having a small thickness and is also excellent in flexibility. The rubber composition comprises 100 parts by weight of a rubber component such as natural rubber and 300 to 1500 parts by weight, preferably 500 to 1000 parts by weight, of carbonyl iron. The incorporation of a predetermined amount of carbonyl iron in the rubber component can realize excellent electromagnetic wave absorbance properties, whereby the thickness of the electromagnetic wave absorbing sheet for providing a necessary electromagnetic wave absorbance amount can be reduced. The rubber composition comprising carbonyl iron incorporated together with the rubber component has low hardness, and is also excellent in flexibility. Accordingly, the rubber composition has good processability, is less likely to break, and is also excellent in durability.

Abstract: A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

Abstract: A circuit substrate of a grounding structure of a semiconductor device according to the invention has a plurality of connection pads and a grounding wiring. The semiconductor device has a semiconductor substrate having one side face and the other side face opposite thereto, an insulating film formed thereon, an SOI integrated circuit provided thereon and including a plurality of connection pads, and electrodes for external connection each of which is connected to the corresponding connection pad. The semiconductor device has the external connection electrodes connected to the respective connection pads of the circuit substrate by a face-down bonding scheme. An under-filling material is provided between the semiconductor device and the circuit substrate, and there is provided a connection member which connects the other side face of the semiconductor device with the grounding wiring of the circuit substrate, and is made of a conductive material.

Abstract: A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

Abstract: In a data management apparatus (1) including a recording device (12) for recording contents data and a data processing section for processing the contents data, first management data for managing the contents data according to a first reference is recorded in the recording device (12), and the data processing section reproduces the contents data based on the first management data, and transfers the contents data to an external device (2) based on second management data which is used for management of the contents data by the external device according to a second reference different from the first reference. As a result, the protection of the contents data can be made while complying with related laws, and the contents data with optional functions added thereto can be backed up.

Abstract: A semiconductor device has a semiconductor substrate having a plurality of connection pads on an upper surface thereof, a protective film made of a resin which is provided on the semiconductor substrate, and has openings at those portions to which the respective connection pads correspond, an altered layer having a mesh-like structure formed on an upper surface of the protective film, and a metallic layer provided on upper surfaces of the connection pads and an upper surfaces of the altered layer.

Abstract: The invention provides a combustion apparatus which can inhibit an NOx generation even in the case of promoting a mixing between a high-temperature combustion gas and an air so as to intend to reduce an unburned combustible. In a combustion apparatus provided with a burner burning a fuel within a furnace in a theoretical air ratio or less, and an air port supplying a combustion air for a shortfall in the burner, a supply apparatus for supplying a nitrogen oxide generation inhibiting gas is provided in a mixing region between the both or near the mixing region. Further, the invention provides a wind box which can inhibit an NOx generation even in the case of promoting a mixing between a high-temperature combustion gas and an air so as to intend to reduce an unburned combustible.

Abstract: A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

Abstract: A recording and reproducing apparatus for reproducing information recorded on a recording medium concurrently while recording the information, includes a compression section, a temporary storage section, a reproducing process section, and a storage section. The compression section reads the information recorded on the recording medium and compresses read information. The temporary storage section stores compressed information provided by the compression process. The reproducing process section decompresses the compressed information output thereto from the temporary storage section and reproduces decompressed information. The storage section stores the compressed information output thereto from the temporary storage section.

Abstract: An information reproduction and recording apparatus able to prevent invalid data not required for recording from being recorded on a recording medium when transferring reproduced information by a small number of signal lines such as a three-line serial peripheral interface, wherein a music data reproducing unit outputs a data signal DATA and clock signals LRCK and BCK to a valid recording period control unit and outputs a SPACE signal to the valid recording period control unit while outputting music data containing track interval data, the signals are transferred to a high speed encoder and the data signal DATA is encoded and recorded on a hard disk by an HDD based on the clock signals LRCK and BCK while the SPACE signal is being output, and the valid recording period control unit suspends transfer of the clock signal LRCK and prevents recording of invalid data on the hard disk while the SPACE signal is not being output.

Abstract: The object of the present invention is to obtain a carbon-monoxide removing technique capable of very effectively reducing/removing carbon monoxide present at one thousand of ppm to several % in a hydrogen-rich treatment-object gas such as a reformed gas obtained by reforming of a fuel such as natural gas, methanol, etc. to a concentration of several tens of ppm (preferably 10 ppm) or lower without excessive loss of hydrogen, even when carbon dioxide, methane are co-existent For accomplishing this object, there are provided two stages of CO removers for removing carbon monoxide from a hydrogen-containing treatment-object gas, the first-stage CO remover removing a portion of the carbon monoxide by methanation thereof through a catalyst reaction, the second-stage CO remover removing the remaining portion of the carbon monoxide mainly by oxidation thereof through a further catalyst reaction involving addition of an oxidizing agent.

Abstract: In a method of manufacturing a copper-zinc-aluminum-based methanol reforming catalyst by coprecipitation, the methanol reforming catalyst is obtained by using a copper compound, a zinc compound and aluminum hydroxide, mixing them with an alkaline substance to produce a precipitate, calcining the precipitate obtained, and reducing the calcined product. Thus, a method is provided for manufacturing a highly active, highly heat resistant and durable methanol reforming catalyst which can be used for a long time even under reaction conditions of 300° C. and higher.

Abstract: A semiconductor device includes a semiconductor structure including a semiconductor substrate having an integrated circuit portion, and a plurality of connecting pads connected to the integrated circuit portion. A plurality of distributing lines are formed on the semiconductor structure, connected to the connecting pads, and have connecting pad portions. An encapsulating layer made of a resin is formed on the semiconductor structure and upper surface of the distributing lines. A copper oxide layer is formed on at least a surface of each of the distributing lines except for the connecting pad portion.