Abstract: A MOSFET main switch transistor has a pull-down FET coupled between a drain thereof and the gate of the main switch transistor. A gate of the pull-down FET is coupled to the drain of the main switch transistor by a capacitor and is connected to a source thereof by a resistor. The pull-down FET is operated by capacitive coupling to the voltage drop across the main switch and can be used to hold the gate of the main switch transistor at or near its source potential to avoid or reduce unintentional turn-on of the main switch transistor by the Miller effect.

Abstract: A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.

Abstract: A semiconductor die package includes: an assembly including a semiconductor die, a clip structure attached to an upper surface of the semiconductor die, and a heat sink attached to an upper surface of the clip structure; and a molding material partially encapsulating the assembly, wherein an upper surface of the heat sink is exposed through the molding material.

Abstract: A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.

Abstract: An active clamping circuit for a multi-stage power amplifier includes a feedback circuit which affects the gain of the amplifier. The feedback circuit feeds an output via a filter and a clamping transistor to an input of at least one stage of the power amplifier. The output fed to the filter and clamping transistor may be tapped from one or more diodes belonging to a diode stack connected to the power amplifier's output.

Abstract: DNA Methyltransferases can be utilized in methods for quickly and accurately: determining variations, mutations or polymorphisms in DNA sequences; identifying specific alleles in single copy genes; creating genomic fingerprints; creating DNA Paints; and generating ordered maps.

Abstract: Technique for reducing local oscillator leakage in integrated frequency conversion circuits is disclosed, which provides coupling an external portion of a resonator circuit to the integrated frequency conversion circuit. The coupling is accomplished without using any of the DC power or ground pins of the conversion circuit. A frequency conversion circuit based on this technique includes resonator, oscillator, and mixer circuits. Part of the oscillator and mixer circuit is encapsulated in a package, whereas at least a portion of the resonator circuit is located outside the package. The outside portion of the resonator circuit connects to at least two external resonator pins of the package such that, during the operating of the conversion circuit, the net current entering the package via said external resonator pins is approximately zero.