Abstract: Provided is a landing pad structure including a substrate, a plurality of landing pads, a guard ring, and an edge pattern. The substrate includes a cell region, a periphery region, and a guard ring region located between the cell region and the periphery region. The landing pads are arranged on the substrate in the cell region in a hexagonal close packing (HCP) configuration. The guard ring is disposed on the substrate in the guard ring region in a strip form. The edge pattern is disposed on the substrate in the cell region and close to the guard ring region. A method of manufacturing the landing pad structure is also provided.

Abstract: A memory device includes a substrate, a bit line, a first insulating film, a second insulating film, a third insulating film, and a contact. The bit line is disposed over the substrate. The first insulating film is disposed on a sidewall of the bit line. The second insulating film is disposed on the first insulating film and is made of a different material than the first insulating film. The third insulating film is disposed on the second insulating film and is made of a different material than the second insulating film. The top surfaces of the second insulating film and the third insulating film are lower than the top surface of the first insulating film. The contact is disposed over the substrate and adjacent to the bit line. The width of the lower portion of the contact is less than the width of the upper portion of the contact.

Abstract: A wireless communication device, system and method. The device includes a memory, a processing circuitry coupled to the memory and including logic, the processing circuitry to cause communication in an Enhanced Directional Multi-Gigabit (EDMG) network. The processing circuitry may be configured to: activate at least one Radio Frequency (RF) chain of a plurality of RF chains to allow detection of a preamble of a wireless communication and to allow a setting of a Network Allocation Vector (NAV); detect the preamble using the at least one RF chain; set the NAV using the at least one RF chain; maintain a backoff timer for the at least one RF chain; and, in response to a determination that the backoff timer has reached zero, cause a Multiple Input Multiple Output (MIMO) wireless communication in the EDMG network.

Abstract: A wireless communication device, system and method. The device includes a memory, and processing circuitry coupled to the memory. The processing circuitry includes logic to: determine a training field length associated with a directional multigigabit (DMG) CTS frame of another wireless communication device; determine a Clear-To-Send time (CTS_Time) parameter based at least in part on the training field length; determine a transmit opportunity (TXOP) continuation timeout for the device based on the CTS_Time parameter; and set a network allocation vector (NAV) for the device based on the TXOP continuation timeout.

Abstract: Various techniques are provided to efficiently detect the position and angular velocity of an object relative to a compact radar system including a transmitter antenna array and a receiver antenna array. In one example, a method includes repeatedly scanning a transmitter antenna array and a receiver antenna array of an object sensing system through a plurality of designated transmitter and receiver channels over a period of time to generate a time series of measured channel responses corresponding to each one of the designated channels, determining a time series of directional vectors to or from an object scanned by at least one of the designated channels, and/or a corresponding time series of average phase differences, based, at least in part, on the time series of measured channel responses, and determining an angular velocity of the object from the time series of directional vectors and/or the corresponding time series of average phase differences.

Abstract: A semiconductor device and a manufacturing method of the same are provided. The semiconductor device includes a substrate having a plurality of active regions, at least one dielectric layer formed on the substrate, and a plurality of contacts disposed in the dielectric layer and contacting with the active regions. The contact is a barrel-shaped structure with a middle portion, a head portion having a perimeter small than that of the middle portion, and an end portion having a perimeter small than that of the middle portion.

Abstract: A puncture-proof structure of the present invention comprises at least two first fiber layers, an intermediate layer and at least two second fiber layers, which are stacked in sequence. A first fiber layers includes a plurality of first woven fibers having a plurality of first gaps therebetween. Another of the first fiber layers includes a plurality of first fibers, and the plurality of first fibers is arranged to be overlapped to enclose the plurality of first gaps. A second fiber layers includes a plurality of second woven fibers, and the plurality of second woven fibers having a plurality of second gaps therebetween. Another of the second fiber layers includes a plurality of second fibers, and the plurality of second fibers is arranged to be overlapped to enclose the plurality of second gaps. By such arrangement, the puncture-proof structure can achieve the effect of preventing the front and back from being punctured.

Abstract: An optical encoding device includes a code disc, an optical signal generator, (K+1) optical sensors and an encoding circuit. The code disk has K gratings arranged in a row. The total width of the optical sensors is equal to the total width W of the gratings. The optical sensor receives the optical signal through the code disk. Each optical sensor converts the optical signal into a voltage signal and outputs the voltage signal. The encoding circuit receives and normalizes the voltage signals to generate (K+1) voltage values. During a period in which the code disk rotates by a distance of 2W/K, the encoding circuit compares the voltage values with a preset value to generate at least two binary codes. When K is odd, the preset value is 0.5, and when K is even, the preset value is 0.55. The present invention can increase an absolute row resolution of the code disc.

Abstract: Provided is a landing pad structure including a substrate, a plurality of landing pads, a guard ring, and an edge pattern. The substrate includes a cell region, a periphery region, and a guard ring region located between the cell region and the periphery region. The landing pads are arranged on the substrate in the cell region in a hexagonal close packing (HCP) configuration. The guard ring is disposed on the substrate in the guard ring region in a strip form. The edge pattern is disposed on the substrate in the cell region and close to the guard ring region. A method of manufacturing the landing pad structure is also provided.

Abstract: A patterning method includes sequentially forming a target layer, a first layer, a second layer, a third layer, and a first mask pattern. A first spacer is formed on a sidewall of the first mask layer. The first mask pattern is removed to form a plurality of peripheral openings surrounding a central opening in the first spacer. A rounding process is performed to round the peripheral openings and form a second mask pattern. A portion of the second layer is removed by using the second mask pattern as a mask, so as to form a third mask pattern. A second spacer is formed in the third mask pattern. The third mask pattern is removed. Portions of the first layer and the target layer are removed by using the second spacer as a mask.

Abstract: A method for forming a semiconductor structure includes providing a semiconductor substrate, forming a sacrificial layer over the semiconductor substrate, etching the sacrificial layer to form a sacrificial pattern, etching the semiconductor substrate using the sacrificial pattern as an etching mask to form an active region of the semiconductor substrate, trimming the sacrificial pattern, and replacing the trimmed sacrificial pattern with a gate electrode.

Abstract: A sphygmomanometer arm band for an arm-type sphygmomanometer includes a cuff and a clamp. The clamp includes an arc-grip part, a first arc-shaped force portion, and a second arc-shaped force portion, wherein the arc-grip part is configured to elastically clamp on the cuff, wherein the first arc-shaped force portion and the second arc-shaped force portion are respectively disposed on the outer side of the arc-grip part for applying a force to control a gap between the two opposite ends of the arc-grip part. Thereby, the blood pressure measurement operation can be performed more conveniently and the measurement result can be more accurate.

Abstract: A method includes forming an ILD to cover a gate stack of a transistor. The ILD and the gate stack are parts of a wafer. The ILD is etched to form a contact opening, and a source/drain region of the transistor or a gate electrode in the gate stack is exposed through the contact opening. A conductive capping layer is formed to extend into the contact opening. A metal-containing material is plated on the conductive capping layer in a plating solution using electrochemical plating. The metal-containing material has a portion filling the contact opening. The plating solution has a sulfur content lower than about 100 ppm. A planarization is performed on the wafer to remove excess portions of the metal-containing material. A remaining portion of the metal-containing material and a remaining portion of the conductive capping layer in combination form a contact plug.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a plurality of gate structures, a plurality of dielectric structures, and spacers. The plurality of gate structures is disposed on the substrate. The plurality of dielectric structures is respectively disposed between the gate structures and the substrate, wherein a top width of the dielectric structure is less than the bottom width of the dielectric structure. The spacers are disposed on the sidewalls of the gate structures and cover the sidewalls of the dielectric structures.

Abstract: A video processing method includes receiving a bitstream, and decoding, by a video decoder, the bitstream to generate a decoded frame. The decoded frame is a projection-based frame that has a 360-degree image/video content represented by triangular projection faces packed in a triangle-based projection layout. An omnidirectional image/video content of a viewing sphere is mapped onto the triangular projection faces via a triangle-based projection of the viewing sphere. An equator of the viewing sphere is not mapped along any side of each of the triangular projection faces.

Abstract: Methods and apparatus to announce channel capabilities in wireless communication systems are discussed herein. An example first wireless communication device includes a channel support identifier to determine wireless communication channels supported by the wireless communication device, a channel capability field generator to generate a listing of the supported wireless communication channels, a channel capability field inserter to insert the listing into a Capabilities element transmitted to a second wireless communication device.