Abstract: The invention relates to a process for the production of an electro-chemical deposit (8-1, . . . , 8-4) with the aid of a substrate (2) having connection pieces (4-1, . . . , 4-5), said pieces being used as electrodes, the deposit taking place on the surface of a removable support (6) and which can be subsequently separated from the substrate on areas of said surface in electrical contact with the pieces of the substrate.

Abstract: This self-supported, anisotropic conductive film has a partly annealed polymer layer (46) containing through holes, nail-shaped conductive elements (51) filling the through holes, having a central portion and ends, and the central portion of the nails is made from a hard material (52) and each end respectively of a first and a second meltable materials (44, 54).

Abstract: The process includes the following steps: forming a layer of meltable material (102) on an initial substrate (100); forming a first layer of dielectric material (104) and engraving this layer (104) to form openings (106) therein; forming metal blocks (108) in the openings (106); depositing a metal layer (110) covering the blocks; engraving the metal layer (110) to form conducting tracks (112); forming a layer of dielectric material (114) covering the conducting tracks and engraving this layer (114) to form openings therein; forming metal blocks (118) in these openings; separating the interconnection substrate from the initial substrate by heating the meltable material to a temperature equal to or exceeding its melting temperature.

Abstract: A method of manufacturing a microelectric device containing, on a substrate, a plurality of interconnected elements, comprising the steps of manufacturing on a substrate cells of elements, testing of the cells in order to distinguish the valid cells, formation of junction bands in an electrical conductive material connecting at least one valid cell, the junction bands being formed in fields, each field comprising an overlapping area with at least one neighboring field.

Abstract: Support for an electrochemical deposit, comprising a substrate (120) and, on the latter, a plurality of first conductive surfaces (128) able to form electrodes, at least one second conductive surface (116) for forming a counterelectrode and means (130, 132, 133, 135) for connecting said first conductive surfaces and said second conductive surface to a voltage source.

Abstract: An apparatus for the propagation of microwaves, particularly ultrahigh frequency waves. A substrate has formed therein a cavity open on one of the sides of the substrate. A membrane is deposited on the substrate above the cavity. At least one transmission line is located on the membrane which is able to propagate an ultrahigh frequency wave. An integrated circuit for rigidifying the membrane is fixed to the transmission line or to the membrane on the side where the line is located.

Abstract: This process comprises the following steps:a) make a set of chips (110, 111, 112, 113) on a substrate (100), each chip including a number of electrodes (110a, 110b, 111a, 111b),b) individual validity test on each chip and the formation of at least one electrical network (117a, 117b) for addressable matched electrodes on different valid chips,c) make a deposit successively on matched electrode sets by dipping the substrate in an appropriate electrochemical bath and by application of appropriate voltages on the electrical network to cause an electrochemical reaction on the electrodes.

Abstract: The integrated electronic sensor for characterizing physical quantities comprises a substrate (5) having a characterizing member (3) and a cover (9) maintained in the vicinity of and in front of the characterizing member (3) by means of at least one ball (11) bearing on the substrate (5), so as to provide a first spacing between the cover (9) and the substrate and is characterized in that the cover has a boss (15) facing the characterizing member (3) so as to define a second spacing between the cover (9) and the member, which is smaller than the spacing between the cover and the substrate.

Abstract: This self-supported, anisotropic conductive film has a partly annealed polymer layer (46) containing through holes, nail-shaped conductive elements (51) filling said through holes, having a central portion and ends, and the central portion of the nails is made from a hard material (52) and each end respectively of a first and a second meltable materials (44, 54).

Abstract: A process for checking the conformity of hybridization balls present on a chip or a substrate and its implementation device are provided. The process includes positioning the hybridization balls of the electronic component or substrate near a strip transparent to a predetermined wavelength. The hybridization balls are partially flattened against the strip by positioning the electronic component or substrate at a previously defined distance from the transparent strip. The previously defined distance corresponds to a theoretical reference ball height less an acceptable deviation between the theoretical reference ball height and a minimum height of the hybridization balls. The partial flattening creates ball flats on the hybridization balls at the strip. The hybridization balls are illuminated with a light beam of the predetermined wavelength that is emitted through the strip. A portion of the light beam reflected back through the strip by the hybridization balls to be checked and is acquired.