Abstract: A LADAR sensor includes a light emitter, a lens having areas of different refraction, a beam-steering device, and a light sensor. The beam-steering device is between the light emitter and the lens to direct light from the light emitter through the lens. The beam-steering device is designed to scan the aim of light from the light emitter to different ones of the areas of different refraction. The light sensor has a plurality of photodetectors. A controller is programmed to selectively power different combinations of the photodetectors based on the aim of the beam-steering device at the areas of different refraction.

Abstract: A vehicular ladar system includes a ladar sensor with a light source configured to generate modulated light. The ladar may be configured to illuminate in one flash the entire scene in the field of view, or may include a scanning mechanism configured to intercept the light generated by the light source and selectively direct the light into a portion of the field of view. A receiving lens assembly receives light reflected off an object in the field of view. A plurality of quantum dot photodiodes are arranged in an array. Each photodiode is configured to receive light from the receiving lens assembly. A readout circuit and a bias circuit are electrically connected to each photodiode. A number of quantum dot film densification methods and apparatus are also described.

Abstract: A LADAR sensor includes a light emitter, a lens having areas of different refraction, a beam-steering device, and a light sensor. The beam-steering device is between the light emitter and the lens to direct light from the light emitter through the lens. The beam-steering device is designed to scan the aim of light from the light emitter to different ones of the areas of different refraction. The light sensor has a plurality of photodetectors. A controller is programmed to selectively power different combinations of the photodetectors based on the aim of the beam-steering device at the areas of different refraction.

Abstract: A vehicle and ladar sensor assembly system is proposed which makes use of forward mounted long range ladar sensors and short range ladar sensors mounted in auxiliary lamps to identify obstacles and to identify potential collisions with the vehicle. A low cost assembly is developed which can be easily mounted within a body panel cutout of a vehicle, and which connects to the vehicle electrical and computer systems through the vehicle wiring harness. The vehicle has a digital processor which interprets 3D data received from the ladar sensor assembly, and which is in control of the vehicle subsystems for steering, braking, acceleration, and suspension. The digital processor onboard the vehicle makes use of the 3D data and the vehicle control subsystems to avoid collisions and steer a best path.

Abstract: A receiver circuit for a sensor includes a photosensitive input circuit and a logarithmic-signal circuit including a PN junction coupled to a pulse voltage node. The pulse voltage node may be coupled to the P-type terminal of the PN junction and an output of the photosensitive input circuit. In some examples, the receiver circuit also may include a linear-signal circuit and/or a square-root-signal circuit.

Abstract: A vehicle sensor system includes multiple LADAR sensors. Each of the LADAR sensors is configured to detect range within a corresponding field of view and to communicate the detected range to a vehicle systems controller. Each of the LADAR sensors includes a detector array electrically connected to a readout integrated circuit via multiple of metallic bumps. A glass screen is disposed outward of the detector array. A ceramic substrate includes a first indention and a conductive solderable surface mount layer, and one of the readout integrated circuit and the detector array is received in the first indention such that an electrical connection between the detector array and the readout integrated circuit is at least approximately level with the conductive solderable surface mount layer.

Abstract: An apparatus for reducing crosstalk between cathodes of detector diodes of an imager detector array includes a capacitor and voltage switch coupled into a detector bias network to virtually isolate a detector diode from a common cathode power plane while simultaneously ‘powering’ the diode for image acquisition, e.g., photo current detection. A method includes a timing sequence wherein during non-acquisition time intervals, the capacitor is charged through the voltage switch by turning the switch on to allow charge to flow into the capacitor from a common supply plane. The method further includes disconnecting the capacitor before an acquisition timer interval such that during the acquisition time interval, the current through the detector diode, caused by incident flux, comes from the capacitor and not from the common cathode power plane.

Abstract: A lidar sensor assembly includes a first detector array having a plurality of light sensitive detectors each configured to receive light reflected from an object and produce an electrical signal in response to receiving the light. The lidar sensor assembly also includes a second detector array having a plurality of detectors configured to receive light reflected from an object and produce an electrical signal in response to receiving the light. A readout integrated circuit (“ROIC”) is bonded to the first detector array and the second detector array. A gap is formed between the first detector array and the second detector array.

Abstract: In one embodiment, a ladar system includes a laser transmitter with at least one semiconductor laser having a pulsed laser light output. A laser drive circuit is connected to said at least one semiconductor laser and adapted to electrically drive said at least one semiconductor laser in a predetermined sequence. A laser beam steering mechanism is adapted to scan the pulsed laser light output sequentially through the field of view.

Abstract: A vehicle and ladar sensor assembly system is proposed which makes use of forward mounted long range ladar sensors and short range ladar sensors mounted in auxiliary lamps to identify obstacles and to identify potential collisions with the vehicle. A low cost assembly is developed which can be easily mounted within a body panel cutout of a vehicle, and which connects to the vehicle electrical and computer systems through the vehicle wiring harness. The vehicle has a digital processor which interprets 3D data received from the ladar sensor assembly, and which is in control of the vehicle subsystems for steering, braking, acceleration, and suspension. The digital processor onboard the vehicle makes use of the 3D data and the vehicle control subsystems to avoid collisions and steer a best path.

Abstract: An interface converter module includes a metallized housing having a first end and a second end. A printed circuit board is mounted within the housing and has mounted thereon electronic circuitry configured to convert data signals from a host device transmission medium to the second transmission medium. The printed circuit board has not more than twenty contact fingers adhered at one end in order to form a host connector, a media connector is at the other end of the module. The media end having a dual LC duplex optical receptacle, where each duplex portion of the dual LC duplex optical receptacle houses a ROSA and a TOSA. The module and receiver may include interengaging rails and slots and/or keys and keyways to ensure correct matching of modules and receptacles.

Abstract: A compact integrated APD device integrates the bias voltage and temperature compensation functions inside a standard 4-pin PIN package. The active components of the bias and temperature compensation circuits are integrated into a single ASIC using a high-voltage CMOS process and operated at frequencies of at least 1 MHz to greatly reduce the size of the passive components. To mount the relatively large ASIC chip inside the package with the APD chip, TIA chip and passives, the 4-pin package may be modified by either recessing the pins inside the can to facilitate surface mounting the ASIC or adding a spacer inside the can to facilitate three-dimensional packaging. Communication with the bias and temperature circuits is accomplished using a unique bi-directional 1-wire serial interface via the power supply pin. A clock signal is preferably embedded in the control data to synchronize the APD with an external controller.

Abstract: A compact integrated APD device integrates the bias voltage and temperature compensation functions inside a standard 4-pin PIN package. The active components of the bias and temperature compensation circuits are integrated into a single ASIC using a high-voltage CMOS process and operated at frequencies of at least 1 MHz to greatly reduce the size of the passive components. To mount the relatively large ASIC chip inside the package with the APD chip, TIA chip and passives, the 4-pin package may be modified by either recessing the pins inside the can to facilitate surface mounting the ASIC or adding a spacer inside the can to facilitate three-dimensional packaging. Communication with the bias and temperature circuits is accomplished using a unique bi-directional 1-wire serial interface via the power supply pin. A clock signal is preferably embedded in the control data to synchronize the APD with an external controller.

Abstract: A modular connector having multiple ports, comprising a housing having a first end and a second end, a first optical port on the first end, a second optical port on the first end, a third optical port on the second end, a fiber bragg grating (FBG) within the housing optically connected to the first port, said FBG configured to reflect a set wavelength back and away from the first port, a coupler within the housing optically connected to the FBG, the second port, and the third port; and wherein each of said optical ports, once connected, is capable of supporting the housing without additional support.

Abstract: Automatic power control (APC) is provided by a) a variable output voltage differential receiver/driver, which receiver is responsive to data signals for generating a voltage, the laser driver output voltage amplitude being controlled by a first potentiometer on an integrated circuit generating an AC current signal for summing with a DC current signal to provide a laser drive current signal to b) a laser transmitter having a laser diode, said laser diode for producing optical power over an optical transfer medium and a photodiode for producing a feedback signal in response to said optical power, the APC including c) a power stabilizing circuit including an error amplifier, a second potentiometer and a bias current drive transistor, the error amplifier having inputs for both the feedback signal and a voltage reference to generate an output control signal, the second potentiometer affecting said output control signal, and said bias current drive transistor being responsive to said output control signal for suppl

Abstract: A modular connector having multiple ports, comprising a housing having a first end and a second end, a first optical port on the first end, a second optical port on the first end, a third optical port on the second end, a fiber bragg grating (FBG) within the housing optically connected to the first port, said FBG configured to reflect a set wavelength back and away from the first port, a coupler within the housing optically connected to the FBG, the second port, and the third port; and wherein each of said optical ports, once connected, is capable of supporting the housing without additional support.

Abstract: An optoelectronic transceiver module comprising a housing having a first opening at a first end and a second opening at a second end; a printed circuit board mounted within the housing; an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector; an optical assembly connected to the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communi

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Abstract: An optoelectronic transceiver module having a housing with a first opening at a first end and a second opening at a second end, a printed circuit board mounted within the housing, an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector, an optical assembly on the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communicate outside of

Abstract: An optical package is provide including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The sleeve, focusing element and a mounting ring may be insert molded within the housing.