Abstract: The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electro-magnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Abstract: A pluggable optical transceiver module includes two optoelectronic devices mounted to a printed circuit board, and a High Speed Serial Data Connector connected to the printed circuit board. The printed circuit board, and associated optoelectronic devices and the High Speed Serial Data Connector being mounted in a housing. One of the two optoelectronic devices is a transmitter. The other of the two optoelectronic devices is a receiver. The pluggable optical transceiver module converts optical signal to electrical signals, and, also, converts electrical signals to optical signals. The High Speed Serial Data Connector is pluggable into a High Speed Serial Data Connector receptacle of a host device. Another portion of the module may have ports for receiving LC style fiber optic connectors.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The first region has the electrically conductive plating material applied thereto. The first and second through-holes protrudes through the second region.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a circuit board having an optical subassembly mounted thereon. The module housing may be pluggable via a retention member received within the receptacle. The module and receptacle assembly may include grounding means such as a ground clip mounted within a gap provided between the module and a connector port of the receptacle to limit electromagnetic emissions.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region.

Abstract: An optoelectronic transceiver is provided having an adaptable logic level signal detect output. The preferred embodiments are configured to generate various logic level signal detected signals directly for use by the transceiver host device. A first embodiment generates the SD output based on the actual optical power received over the optical transfer medium. When the received optical power exceeds a predetermined threshold, the monitor voltage exceeds the reference voltage, and the signal detected output is set. The output stage of the circuit can be configured such that in the true state, meaning a signal has been detected, a TTL level signal, a CMOS signal, or a high voltage or high current signal is set to true. The high voltage and high current configurations may be set to any value required under the specific requirements of the application. In a second embodiment an AC signal detecting circuit generates the SD output.

Abstract: A device which retains a polymer mounting block between a metallic cover and a metallic base. The mounting block includes two mounting halves. The mounting halves being hermaphroditic such that a pair of the mounting halves of the mounting block being substantially identical can be assembled in opposite transverse relation to form the mounting block. The mounting half of the mounting block includes a member and two latch arms attached to the member. The member includes a transmitter mounting provision and a receiver mounting provision. The transmitter mounting provision receives a transmitter sub-assembly, and the receiver mounting provision receives a receiver sub-assembly. The transmitter mounting provision and the receiver mounting provision straddle the second latch arm, and the first latch arm and the second latch arm straddle one of the transmitter mounting provision and the receiver mounting provision.

Abstract: An optical package is provided including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The ferrule receiving bore includes a longitudinal slot extending generally parallel to the axis of the bore providing radial flexibility to the outer wall. Additionally, a split sleeve is provided for accepting a fiber optic connector ferrule. The split sleeve being insertable and expandable in a ferrule receiving bore of an optical package housing. The split sleeve being retained in the ferrule receiving bore with an adhesive.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a circuit board having an optical subassembly mounted thereon. The module housing may be pluggable via a retention member received within the receptacle. The module and receptacle assembly may include grounding means such as a ground clip mounted within a gap provided between the module and a connector port of the receptacle to limit electromagnetic emissions.

Abstract: A robust optoelectronic transceiver module which provides for static discharge and is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly. Furthermore, the module provides electrically conductive latches which are conductively connected, via tabs for forming an electrical connection, to a grounded structure, such as a computer chassis.

Abstract: An optoelectronic transmitter module is provided for transmitting optical data signals from a host device. The module is housed within a grounded chassis of the host device and provides a reduced effective aperture therethrough. The module components include electronic circuitry mounted within the module configured to convert electrical data signals to an optical output signal. A conductive housing encloses the electronic circuitry. The module housing includes a first connector end adapted to receive a fiber optic connector. When the module is installed within the host device chassis, the connector end engages the host chassis to form a conductive barrier around the first end of the housing. A conductive transmitting optical subassembly (TOSA) is disposed within the connector end of the housing, forming a continuous conductive barrier therewith. The TOSA includes first and second ends with a narrow passage extending therebetween.

Abstract: An optoelectronic transmitter is provided including a semiconductor laser as the active optical transmitting element. The transmitter includes first and second printed circuit boards, with the first printed circuit board having mounted thereon electronic components and circuitry for driving the optoelectronic transmitter. A transmitting optical sub-assembly (TOSA) is mounted to the second printed circuit board. The second printed circuit board has an array of solder pads disposed on the back surface thereof, and the first printed circuit board has a corresponding array of solder pads disposed along an outer edge of the board. Spacing of the solder pads is such that when the first printed circuit board is placed in perpendicular abutment against the outer edge of the first printed circuit board, the solder pads formed on the first printed circuit board are aligned adjacent to the solder pads disposed on the back of the second printed circuit board.

Abstract: An optoelectronic transmitter is provided including a laser diode. A control circuit for driving the laser diode includes a current source which provides a DC bias current to the laser diode, and the laser diode emits an optical signal having an average power determined by the magnitude of the bias current. A voltage regulator establishes a regulated supply voltage which is input to a first reference circuit and a feedback monitor circuit. The first reference circuit establishes a first fixed reference voltage. The feedback monitor circuit includes a monitor device for measuring the optical power emitted by the laser diode, and the monitor circuit establishes a variable monitor voltage proportional to the optical power measured by the monitor device. An op-amp compares the first fixed reference voltage and the feedback monitor voltage, and the output voltage of the op-amp controls the magnitude of the bias current output by the current source.

Abstract: An optical package is provide including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon.

Abstract: The present invention provides in improved Transmitting Optical Subassembly (TOSA) for coupling an optical output signal from an optical transmitter to an optical fiber sheathed within a fiber optic connector ferrule. The TOSA includes a housing formed of precision molded plastic or machined metal. A first end of the housing includes an optics cavity configured to receive an optical element for emitting an optical signal. A second end of the housing is configured as a long bore configured to receive an optical fiber connector ferrule. The housing further defines a lens cavity for retaining a focusing element between the optics cavity and the ferrule receiving bore. Finally, the housing also includes an attenuator receiving aperture between the optics cavity and the ferrule receiving bore. The plug receiving aperture is configured to removably receive an attenuation plug whereby the optical output of the optical element passes through the attenuator plug and is attenuated.

Abstract: An improved Gigabaud Link Module (GLM) is provided for performing bi-directional data transfers between a host device and a serial transfer medium. The improved GLM, includes data signal transmission circuitry for reading data signals from the host device and transmitting the data signals as serial data over a first serial transfer link. Data signal receiving circuitry is also provided for receiving serial data signals from a second serial transfer link. The receiving circuitry then writes the signals to the host device. The first and second transfer links form the serial transfer medium, and the transmission and receiving circuitry provides the bi-directional data transfer between the host device and the serial transfer medium. The improved GLM further includes signal detection circuitry for determining when data signals are being received over the second serial transfer link.

Abstract: A Media Interface Adapter (MIA) module is provided for converting Fiber Channel data signals from a first copper transfer medium to a second alternate transfer medium. The MIA includes an internal mounted printed circuit board containing the electronic components necessary to convert signals between the first copper medium and second alternate medium. A transmitter is provided for transmitting the data signals over the second alternate transfer medium, and a receiver is provided for receiving data signals over the second alternate transfer medium. Opposite the transmitter and receiver, a nine pin electrical D-sub connector is provided for connecting the module to the first copper transfer medium. The D-sub connector has a metal flange insertable into a connector mounting structures formed in the housing. The connector mounting structures being configured to partially overlap the flange of the D-sub connector.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly. The module housing may be pluggable via release levers having detentes received in apertures of a receptacle and a pluggable connector of the module mated within the receptacle. The receptacle may include grounding means such as a ground clip mounted within the receptacle and a protective door to limit electromagnetic emissions.

Abstract: A power stabilizer for maintaining a constant level of output power from a laser transmitter. The laser transmitter has a laser diode which produces an optical output which corresponds to the level of bias current received. In addition, the laser transmitter has a photodiode which produces a feedback signal which corresponds to the optical output power being produced by the laser diode. Furthermore, the power stabilizer consists of a digitally controlled potentiometer for producing a reference input signal and an op-amp for comparing the feedback signal and the reference input signal to produce a control signal to supply bias current.