Abstract: A modular connector having multiple ports, comprising a housing having a first end and a second end, a first optical port on the first end, a second optical port on the first end, a third optical port on the second end, a fiber bragg grating (FBG) within the housing optically connected to the first port, said FBG configured to reflect a set wavelength back and away from the first port, a coupler within the housing optically connected to the FBG, the second port, and the third port; and wherein each of said optical ports, once connected, is capable of supporting the housing without additional support.

Abstract: Automatic power control (APC) is provided by a) a variable output voltage differential receiver/driver, which receiver is responsive to data signals for generating a voltage, the laser driver output voltage amplitude being controlled by a first potentiometer on an integrated circuit generating an AC current signal for summing with a DC current signal to provide a laser drive current signal to b) a laser transmitter having a laser diode, said laser diode for producing optical power over an optical transfer medium and a photodiode for producing a feedback signal in response to said optical power, the APC including c) a power stabilizing circuit including an error amplifier, a second potentiometer and a bias current drive transistor, the error amplifier having inputs for both the feedback signal and a voltage reference to generate an output control signal, the second potentiometer affecting said output control signal, and said bias current drive transistor being responsive to said output control signal for suppl

Abstract: A modular connector having multiple ports, comprising a housing having a first end and a second end, a first optical port on the first end, a second optical port on the first end, a third optical port on the second end, a fiber bragg grating (FBG) within the housing optically connected to the first port, said FBG configured to reflect a set wavelength back and away from the first port, a coupler within the housing optically connected to the FBG, the second port, and the third port; and wherein each of said optical ports, once connected, is capable of supporting the housing without additional support.

Abstract: An optoelectronic transceiver module comprising a housing having a first opening at a first end and a second opening at a second end; a printed circuit board mounted within the housing; an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector; an optical assembly connected to the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communi

Abstract: An optoelectronic transceiver module having a housing with a first opening at a first end and a second opening at a second end, a printed circuit board mounted within the housing, an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector, an optical assembly on the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communicate outside of

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a circuit board having an optical subassembly mounted thereon. The module housing may be pluggable via a retention member received within the receptacle. The module and receptacle assembly may include grounding member such as a ground clip mounted within a gap provided between the module and a connector port of the receptacle to limit electromagnetic emissions.

Abstract: An optical package is provide including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The sleeve, focusing element and a mounting ring may be insert molded within the housing.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Abstract: An optoelectronic device includes two optical subassemblies mounted on an edge of a substrate. Electronic circuitry is mounted on the substrate. The two optical packages are electrically connected to the electrical circuitry. An optical coupling element is attached to one of the optical packages and another optical coupling element is attached to the other optical package. A rib is attached to the substrate and to one of the optical coupling elements so as to provide support for the optical coupling element, and another rib is attached to the substrate and to the other optical coupling element. Each optical coupling element has a respective ferrule receiving bore. The ferrule receiving bores are parallel to one another. A connection pin header is electrically connected to the electronic circuitry on the substrate. The connection pin header includes connection pins.

Abstract: An optoelectronic device includes two optical subassemblies mounted on an edge of a substrate. Electronic circuitry is mounted on the substrate. The two optical packages are electrically connected to the electrical circuitry. An optical coupling element is attached to one of the optical packages and another optical coupling element is attached to the other optical package. A rib is attached to the substrate and to one of the optical coupling elements so as to provide support for the optical coupling element, and another rib is attached to the substrate and to the other optical coupling element. Each optical coupling element has a respective ferrule receiving bore. The ferrule receiving bores are parallel to one another. A connection pin header is electrically connected to the electronic circuitry on the substrate. The connection pin header includes connection pins.

Abstract: A device which is surface mountable to a printed circuit board. The device includes a housing, an optical sub-assembly, and an electrical connector. The housing includes a fiber optic connector receptacle and a bottom side. The housing is made of an electrically conductive material. The optical sub-assembly is associated with the fiber optic connector receptacle. The electrical connector has contacts, where some portions of the contacts extend into the housing and some portions of the contacts extend from the housing. A portion of the contacts being in a same plane with the bottom side of the housing.

Abstract: An optoelectronic transceiver module comprising a housing having a first opening at a first end and a second opening at a second end; a printed circuit board mounted within the housing; an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector; an optical assembly connected to the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communi

Abstract: An optoelectronic transceiver module having a housing with a first opening at a first end and a second opening at a second end, a printed circuit board mounted within the housing, an electrical connector on the printed circuit board at the first end of the optoelectronic transceiver module, the electrical connector having an insulative mating surface within the first opening and including a first side with electrical contacts in an area oriented substantially parallel to the first side of the insulative mating surface, wherein the electrical contacts slidingly engage a circuit card connector of a host receptacle in order to quickly install and remove the optoelectronic transceiver module from within the circuit card connector, an optical assembly on the printed circuit board at the second end of the optoelectronic transceiver module, the optical assembly including a transmitting optical subassembly and a receiving optical subassembly, the second opening allowing the optical assembly to communicate outside of

Abstract: A fiber optic plug for connecting to a receptacle of a small format optoelectronic package or device. The fiber optic plug includes a body and ferrules attached to the body. Each ferrule has an aperture for receiving and holding an optical fiber and each ferrule has a diameter substantially equal to 1.25 mm. The aperture of each adjacent ferrule is separated by a distance of approximately 3.125 mm. The ferrules exist in a plane.

Abstract: A fiber optic plug for connecting to a receptacle of a small format optoelectronic package or device. The fiber optic plug includes a body and ferrules attached to the body. Each ferrule has an aperture for receiving and holding an optical fiber and each ferrule has a diameter substantially equal to 1.25 mm. The aperture of each adjacent ferrule is separated by a distance of approximately 3.125 mm. The ferrules exist in a plane.

Abstract: A connector for mounting to and through a wall of a device. In one form of the invention a connector is used for mounting to and through a wall of a device. The connector includes a body, an optical fiber, and a sealant. The body includes a surface having an aperture. The optical fiber has a length and a first end and a second end. A portion of the length of the optical fiber being metallized. The optical fiber passes through the aperture of the surface of the body and the metallized portion of the optical fiber is attached to the aperture of the surface of the body so as to form a hermetic seal between the optical fiber and the aperture of the surface of the body. The sealant is located between the body and the surface of the device so as to provide a hermetic seal between the body and the wall of the device when the body is urged toward the wall of the device thus deforming the sealant. The connector allows an optical signal to be transmitted within the optical fiber through the body.

Abstract: The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electromagnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Abstract: Automatic power control (APC) is provided by a) a variable output voltage differential receiver/driver, which receiver is responsive to data signals for generating a voltage, the laser driver output voltage amplitude being controlled by a first potentiometer on an integrated circuit generating an AC current signal for summing with a DC current signal to provide a laser drive current signal to b) a laser transmitter having a laser diode, said laser diode for producing optical power over an optical transfer medium and a photodiode for producing a feedback signal in response to said optical power, the APC including c) a power stabilizing circuit including an error amplifier, a second potentiometer and a bias current drive transistor, the error amplifier having inputs for both the feedback signal and a voltage reference to generate an output control signal, the second potentiometer affecting said output control signal, and said bias current drive transistor being responsive to said output control signal for suppl

Abstract: A device or array of arrayed optical subassemblies includes modular units called one channel sub-assemblies. Each of the one channel sub-assemblies includes a small format optical subassembly attached to a substrate and an optical coupling element all of which is connected to a base. The optical coupling element includes a focusing element and a ferrule receiving bore. The arrayed device makes it possible to remove and replace one of the one channel sub-assemblies with another one channel sub-assembly. The small format optical subassembly of the one channel sub-assembly may be a transmitter or a receiver. Thus, the device is a modular, high-density, multiple optical transmitter/receiver array.